Transducers '01 eurosensors XV: digest of technical papers 2 Sessions 3A1 - 4D3, papers 3A1.01 - 4D3.16P
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| Format: | Tagungsbericht Buch |
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| Sprache: | English |
| Veröffentlicht: |
Berlin [u.a.]
Springer
2001
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| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | S. 881 - 1807 Ill., graph. Darst. |
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| 245 | 1 | 0 | |a Transducers '01 eurosensors XV |b digest of technical papers |n 2 |p Sessions 3A1 - 4D3, papers 3A1.01 - 4D3.16P |c the 11th International Conference on Solid State Sensors and Actuators, June 10 - 14, 2001, Munich, Germany. [Ed. Ernst Obermeier] |
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| 700 | 1 | |a Obermeier, Ernst |e Sonstige |4 oth | |
| 711 | 2 | |a International Conference on Solid State Sensors and Actuators |n 11 |d 2001 |c München |j Sonstige |0 (DE-588)10023286-3 |4 oth | |
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| 856 | 4 | 2 | |m GBV Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009420031&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
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| _version_ | 1804128601822461952 |
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| adam_text | TRANSDUCERS 01 EUROSENSORS XV THE 11TH INTERNATIONAL CONFERENCE ON
SOLID-STATE SENSORS AND ACTUATORS JUNE 10 - 14, 2001 MUNICH, GERMANY
UNIVERSIRATSSIBLIOTHEK HANNOVER TFCHIN!!SCHE INFORMATIOMSBSBUOTHCK
DIGEST OF TECHNICAL PAPERS - VOLUME 2 SESSIONS 3A1 - 4D3 PAPERS 3A1.01 -
4D3.16P PP.881 - 1809 SPRINGE] UB/TIB HANNOVER 122 076 648 89 CONTENTS
1A1 PLENARY 1 MONDAY, JUNE 11, 2001, (9.00 A.M. - 12.30 P.M.) 1A1.01
TECHNOLOGIES FOR MICROTURBOMACHINERY - M. SCHMIDT , MASSACHUSETTS INST.
TECH., CAMBRIDGE, MA, USA P-2 1A1.02 MEMS MEETS INSECTS - I. SHIMOYAMA ,
K. HOSHINO, Y. OZAKI, S. TAMAKI, S. TAKEUCHI, AND I YASUDA, U. TOKYO,
TOKYO, JAPAN P. 6 1A2 PLENARY 2 MONDAY, JUNE 11, 2001 (9.00 A.M. - 12.30
P.M.) 1A2.01 RETINA IMPLANT - A BIOMEMS CHALLENGE - J.-U. MEYER
SPEAKER , FRAUNHOFER INST. BIOMED. ENGINEERING, ST. INGBERT, GERMANY P.
1 2 1A2.02 MEMS - THE VIEW BACK ... AND THE VISTAS AHEAD - R. S. MULLER
, U. CALIFORNIA, BERKELEY, CA, USA P. 20 1A3 MEMS POWER GENERATION
MONDAY, JUNE 11, 2001 (2:00 P.M. - 3:20 P.M.) 1 A3.01 MINIATURIZED
THERMOELECTRIC GENERATORS BASED ON POLY-SI AND POLY-SIGE SURFACE
MICROMACHINING - M. STRASSER*, R. AIGNER, AND M. FRANOSCH, INFINEON
TECH. AG, MUNICH, GERMANY, G. WACHUTKA, (AND*), MUNICH U. TECH., MUNICH,
GERMANY P. 26 1A3.02 A COMBUSTION-BASED MEMS THERMOELECTRIC POWER
GENERATOR - S. SCHAEVITZ, A. FRANZ, K. JENSEN, AND M. SCHMIDT, MIT,
CAMBRIDGE, MA, USA P. 30 1A3.03 AN INTEGRATED COMBUSTER-THERMOELECTRIC
MICRO POWER GENERATOR - C. ZHANG, K. NAJAFI, L BERNAL, AND P.
WASHABAUGH, U. MICHIGAN, ANN ARBOR, ML, USA, P. 34 1A3.04 A
LASER-MICROMACHINED VIBRATIONAL TO ELEC- TRICAL POWER TRANSDUCER FOR
WIRELESS SENSING SYSTEMS - N. CHING, H. WONG, W. LI, AND P. LEONG, CHIN.
U. HONG KONG, HONG KONG, SAR, Z. WEN, CHONGQING U., CHINA P. 38 1A3.05P
MICRO GENERATOR SYSTEMS - K. IZUMIDA, N. TOYOTA, M. YOSHIMURA, Y. MUROI,
I TAKENAKA, AND K. IKEDA, TOKYO U., TOKYO, JAPAN P. 42 1A3.06P THE
MODELLING OF A PIEZOELECTRIC VIBRATION POWERERD GENERATOR FOR
MICROSYSTEMS - P. GLYNNE-JONES, S. BEEBY, E. JAMES, AND N. WHITE, U.
SOUTHAMPTON, SOUTHAMPTON, UK P. 46 1B3 ACOUSTIC SENSORS MONDAY, JUNE 11,
2001 (2:00 P.M. - 3:20 P.M.) 1B3.01 BIMORPH PIEZOELECTRIC ACOUSTIC
TRANSDUCER - M. NIU, U. HAWAII, HONOULU, HI, USA, E. KIM, USC, LOS
ANGELES, CA, USA P. 110 1B3.02 HIGH-DIRECTIVITY ARRAY OF ULTRASONIC
MICRO SENSOR USING PZTTHIN FILM ON SI DIAPHRAGM - K. YAMASHITA, H.
KATATA, AND M. OKUYAMA, OSAKA U., OSAKA, JAPAN, H. MIYOSHI, G. KATO, AND
S. AOYAGI, KANSAI U., OSAKA, JAPAN, Y. SUZUKI, TECH. RES. INST. OSAKA
PREF, OSAKA, JAPAN P. 114 1B3.03 SELF-CALIBRATING MICROMACHINED
MICROPHONES WITH INTEGRATED OPTICAL DISPLACEMENT DETECTION - N. HALL AND
F. DEGERTEKIN, GEORGIA TECH., ATLANTA, GA, USA P. 118 1B3.04 SINGLE-CHIP
LOW-VOLTAGE ANALOG-TO-DIGITAL INTERFACE FOR ENCAPSULATION WITH ELECTRET
MICROPHONE - 0. BAJDEEHI AND J. HUIJSING, DELFT U. TECH., DELFT, THE
NETHERLANDS P. 122 1B3.05P SILICON MICROPHONES WITH LOW STRESS MEMBRANES
- M. FULDNER*, A. DEHE, R. AIGNER, AND T. BEVER, INFINEON TECH. AG,
MUNICH, GERMANY, R. LERCH, AND (*), U. ERLANGEN- NUREMBERG, ERLANGEN,
GERMANY P. 126 1B3.06P FABRICATION OF A BIOMIMETIC CORRUGATED POLY-
SILICON DIAPHRAGM WITH ATTACHED SINGLE CRYSTAL SILICON PROOF MASSES - K.
YOO AND J. YEH, CORNELL U., ITHACA, NY, USA, N. TIEN, U. CALIFORNIA,
DAVIS, CA, USA, C. GIBBONS, Q. SU, W. CUI, AND R. MILES, SUNY,
BINGHAMPTON, NY, USA P. 130 1C3 PACKAQINQ ET WAFER BONDINQ MONDAY, JUNE
11, 2001 (2:00 P.M. - 3:20 P.M.) 1C3.01 SELECTIVE ENCAPSULATION USING A
POLYMERIC OR BONDED SILICON CONSTRAINT DAM FOR MEDIA COMPATIBLE PRESSURE
SENSOR APPLICATIONS - G. LI, J. SCHMIESING, A. MCNEIL, K. NEUMANN, B.
GOGOI, G. BITKO, S. PETROVIC, J. TORRES, M. FUHRMANN, AND D. MONK,
MOTOROLA SEMICON., TEMPE, AZ, USA P. 178 1 C3.02 WAFER-LEVEL PACKAGING
USING LOCALIZED MASS DEPOSITION - P. CHANG-CHIEN AND K. WISE, U.
MICHIGAN, ANN ARBOR, ML, USA P. 182 1C3.03 CAVITY-MICROMAEHINING
TECHNOLOGY: ZERO- PACKAGE SOLUTION FOR INERTIAL SENSORS - R. AIGNER, K.
OPPERMANN, H. KAPELS, AND S. KOLB, INFINEON TECH. AG, MUNICH, GERMANY,
P. 186 1C3.04 ACCELERATED HERMETICITY TESTING OF A GLASS- SILICON
PACKAGE FORMED BY RTP ALUMINUM-TO-SILICON NITRIDE BONDING - M. CHIAO AND
L. LIN, U. CALIFORNIA, BERKELEY, CA, USA P. 190 1C3.05P AN ULTRA-THIN
HERMETIC PACKAGE UTILIZING ELECTROPLATED GOLD - B. STARK AND K. NAJAFI,
U. MICHIGAN, ANN ARBOR, ML, USA P. 194 1C3.06P PLASTIC BGA PACKAGE AND
DIRECT FILTER ATTACHMENT FOR CMOS THERMAL IMAGERS - M. WAELTI,
INTELLISENSE CORP., WILMINGTON, MA, USA, A. SCHAUFELBUHL, 0. BRAND, AND
H. BALTES, ETH ZURICH, ZURICH, SWITZERLAND P. 198 1C3.07P NOVEL OPTICAL
TRANSCEIVER WITH COMPOUND PARABOLIC CONCENTRATOR FOR GRADED INDEX
PLASTIC OPTICAL FIBER - Y. MATSUMOTO, A. NAKAZONO, T. KITAHARA, AND Y.
KOIKE, KEIO U., YOKOHAMA, JAPAN P. 202 1C3.08P MOUNTING OF SI-CHIPS WITH
PLASTICALLY BENT CANTILEVERS - E. GARTNER, J. FRUHAUF, AND E. JANSCH,
TECH. U. CHEMNITZ, CHEMNITZ, GERMANY, B. HANNEMANN, U. BREMEN, BREMEN,
GERMANY P. 206 1C3.09P ANISOTROPIC CONDUCTIVE ADHESION OF MICRO- SENSORS
APPLIED IN THE INSTANCE OF A LOW PRESSURE SENSOR - R. BRIEGEL, M.
ASHAUER, H. ASHAUER, H. SANDMAIER*, AND W. LANG, HSG-IMIT,
VILLINGEN-SCHWENNINGEN, GERMANY, (* AND U. STUTTGART, STUTTGARD,
GERMANY) P. 210 1 C3.10P NANOSECOND-PULSED LASER BONDING WITH A BUILT-IN
MASK FOR MEMS PACKAGING APPLICATIONS - C. LUO, L LIN, AND M. CHIAO, U.
CALIFORNIA, BERKELEY, CA, USA P. 214 1 C3.11 P LOCAL LASER BONDING FOR
LOW TEMPERATURE BUDGET - U. MESCHEDER AND C. NACHTIGALL, U. FURTWANGEN,
GERMANY, M. ALAVI, K. HILTMANN, C. LIZEAU, AND H. SANDMAIER*, HSG-IMIT,
VILLINGEN-SCHWENNINGEN, GERMANY, (* AND U. STUTTGART, STUTTGARD,
GERMANY) P. 218 1C3.12P AN 8-INCH WAFER BONDING APPARATUS WITH
ULTRA-HIGH ALIGNMENT ACCURACY USING SURFACE ACTIVATED BONDING (SAB)
CONCEPT - T. SUGA, T. ITOH, AND M. HOWLADER, U. TOKYO, TOKYO, JAPAN P.
222 1C3.13P SI-SI BONDING USING RF AND MICROWAVE RADIATION - K.
THOMPSON, Y. GIANCHANDANI, J. BOOSKE, AND R. COOPER, U. WISCONSIN,
MADISON, WL, USA P. 226 1 C3.14P ANODIC-BONDING ON GLASS LAYERS PREPARED
BY A SPIN-ON GLASS PROCESS: PREPARATION PROCESS AND EXPERI- MENTAL
RESULTS - H. QUENZER AND A. SCHULZ, FRAUNHOFER ISIT, ITZEHOE, GERMANY, I
KINKOPF, AND T. HELM, FRAUNHOFER IBMT, ST. INGBERT, GERMANY P. 230
1C3.15P SILICON PYREX ELECTROSTATIC BONDING: APPLICABILITY TO INDUSTRIAL
MICRODEVICES PRODUCTION - G. BLASQUEZ AND P. FAVARO, CNRS-LAAS,
TOULOUSE, FRANCE P. 234 1D3 BIO-SENSING SYSTEMS MONDAY, JUNE 11, 2001
(2:00 P.M. - 3:20 P.M.) 1D3.01 A DIELECTROPHORESIS-BASED ARRAY CYTOMETER
- J. VOLDMAN, M. GRAY, AND M. SCHMIDT, MIT, CAMBRIDGE, MA, USA, M.
TONER, MASS. GEN. HOSPITAL, BOSTON, MA, USA P. 322 1D3.02 FABRICATION OF
DIRECTLY SYNTHESIZED DNA CHIP USING PHOTOLITHOGRAPHY FOR RAPID AND
PARALLEL GENE ANALYSIS - K. TAKAHASHI AND M. ESASHI, TOHOKU U., SENDAI,
JAPAN, K. SEIO, AND M. SEKINE, TOKYO INST. TECH., YOKOHAMA, JAPAN, 0.
HINO, CANCER INST., TOKYO, JAPAN P. 326 1D3.03 IMMOBILIZED TWO
DIMENSIONAL PROTEIN ARRAYS BY U-STAMP AND PROTEIN WELL - F. TSENG, S.
LIN, H. HUANG, C. HUANG, AND C. CHIENG, NAT. TSING-HUA U., HSINCHU,
TAIWAN, ROC P. 330 1 D3.04 ELECTROCHEMICAL GENE DETECTION WITH PCR CHIP
- M. KOBAYASHI, M. OOMURA, Y. MORITA, Y. MURAKAMI, K. YOKOYAMA, AND E.
TAMIYA, JAIST, ISHIKAWA, JAPAN, I KUSAKAWA, HOKUTO SCI. IND., TOYAMA,
JAPAN P. 334 1D3.05P SOFT LITHOGRAPHIC TECHNIQUES FOR GUIDANCE OF
HIPPOCAMPAL NEURONS ON MICRO-ELECTRODE ARRAYS - L GRISCOM AND H. FUJITA,
U. TOKYO, JAPAN, P. DEGENAAR AND E. TAMIYA, JAPAN ADV. INST. TECH.,
JAPAN, B. LEPIOUFLE, ECOLE NORM. SUP., CACHAN, BRUZ, FRANCE P. 338
1D3.06P DEVELOPMENT OF A SUPEROXIDE SENSOR BY SUPEROXIDE DISMUTASE
IMMOBILIZATION - K. ENDO, S. AOYAGI, AND K. SAKAI, WASEDA U., TOKYO,
JAPAN, T. MIYASAKA, N. HIMI, AND S. MOCHIZUKI, KAWASAKI MED. SCHOOL,
JAPAN P. 342 1D3.07P BIOELECTRONIC NOSE FOR METHYL MERCAPTAN VAPOR USING
A XENOBIOTIC METABOLIZING SYSTEM - K. MITSUBAYASHI AND Y. HASHIMOTO,
TOKAI U., KANAGAWA, JAPAN P. 346 1D3.08P RADIAL ARTERY PULSE DETECTION
SYSTEM BASED ON EIGHT CONSTITUTIONAL MEDICINE THEORY - Y. JEONG, S.
MOON, C. LEE, H. LEE, J. GONG, J. CHANG, AND K. CHUN, SEOUL NAT. U.,
SEOUL, KOREA, D. KUON, JESON ORIENTAL CLIN., SEOUL, KOREA, S. PARK,
KYUNGPOOK, NAT. U., TAEGU, KOREA P. 350 1D3.09P DEVELOPMENT OF A
MULTICHANNEL INTEGRATED INTERFEROMETER IMMUNOSENSOR - A. YMETI, J.
KANGER, R. WIJN, P. LAMBECK, AND J. GREVE, U. TWENTE, ENSCHEDE, THE
NETHERLANDS P. 354 1D3.10P FLEXIBLE BIOMEMS WITH ELECTRODE ARRANGE-
MENTS ON FRONT AND BACK SIDE AS KEY COMPONENT IN NEURAL PROSTHESES AND
BIOHYBRID SYSTEMS - T. STIEGLITZ AND M. GROSS, FRAUNHOFER IBMT, ST.
INGBERT, GERMANY P. 358 1D3.11P SELF-ASSEMBLAGE OF REDOX PROTEINS AND
NUCLEIC ACIDS ONTO A LIPIDIC BIOSENSOR - W. BOIREAU AND D. POMPON,
CNRS-CGM, GIF/YVETTE, FRANCE, S. BOMBARD AND M. SARI, CNRS UMR, PARIS,
FRANCE P. 362 1D3.12P DEVELOPMENT OF RECEPTOR BASED AFFINITY MICROASSAY
- T. FROMMICHEN, A. ZIMMERMANN, T. NANN, A. SIPPEL, AND G. URBAN, U.
FREIBURG, FREIBURG, GERMANY P. 366 1D3.14P AN IN-LINE OSMOMETER FOR
APPLICATION IN TISSUE BASED BIO-SENSOR SYSTEMS - N. MOURLAS, N. MALUF*,
AND G. KOVACS, STANFORD U., STANFORD, CA, USA, (* AND NEW FOCUS, SANTA
CLARA, CA, USA) P. 370 1D3.15P A BIOSENSOR FOR ESCHERICHIA COLI BASED
ON A POTENTIOMETRIC ALTERNATING BIOSENSING (PAB) TRANSDUCER - C. ERCOLE,
M. DEL GALLO, M. PANTALONE, S. SANTUCCI, AND A. LEPIDI, U. L AQUILA,
L AQUILA, ITALY, C. LACONI AND L MOSIELLO, ENEA C.R. CASACCIA, ROME,
ITALY P. 374 1D3.16P SENSING NITRIC OXIDE NEURONAL MESSENGERS USING
SCREEN-PRINTED CARBON MICRO-ELECTRODE ARRAYS - P. GEORGE AND N. THAKOR,
JOHNS HOPKINS U., BALTIMORE, MD, USA, J. MUTHUSWAMY, ARIZONA U., TEMPE,
AZ, USA, J. CURRIE AND M. PARANJAPE, GEORGETOWN U., WASHINGTON, D.C.,
USA P. 378 1 D3.17P CUFF ACTUATOR FOR ADAPTIVE HOLDING CONDITION AROUND
NERVES - S. KONISHI, T. KOBAYASHI, H. MAEDA, AND M. MAKIKAWA,
RITSUMEIKAN U., SHIGA, JAPAN, S. ASAJIMA, SHIGA U. MED. SCI., SHIGA,
JAPAN P. 382 1D3.18P INTRACELLULAR NEURONAL RECORDING WITH HIGH ASPECT
RATIO MEMS PROBES - Y. HANEIN, U. LANG, J. THEOBALD, R. WYETH, T.
DANIEL, 0. WILLOWS, D. DENTON, AND K. BOHRINGER, U. WASHINGTON, SEATTLE,
WA, USA P. 386 1 D3.19P ANALYSIS OF MICROELECTRODE-RECORDED SIGNALS FROM
A CARDIAC CELL LINE AS A TOOL FOR PHARMACEUTICAL SCREENING - K.
GILCHRIST, L GIOVANGRANDI, AND G. KOVACS, STANFORD U., STANFORD, CA, USA
P. 390 1 D3.20P THE FABRICATION OF THE NOVEL MICRO TIME-OF- FLIGHT (TOF)
MASS SPECTROMETER WITH A MICRO ION SOURCE - H. YOON, T. PARK, AND S.
YANG, AJOU U., SUWON, KOREA, J. KIM, AND K. JUNG, WONKWANG U., IKSAN,
KOREA P. 394 1D3.21P DISCRIMINATION OF D-AMINO ACIDS FROM L- AMINO ACIDS
USING MEMBRANE CHARACTERISTICS CHANGE - H. CHIBVONGODZE, K. HAYASHI, AND
K. TOKO, KYUSHU U., FUKUOKA, JAPAN P. 398 1D3.22P DESIGN OF MINIATURIZED
SOLID-STATE SENSORS BASED ON SILICON STRUCTURE WITH BACK-SIDE CONTACTS -
K. WYGLADACZ, E. MALINOWSKA, AND Z. BRZOZKA, WARSAW U. TECH., WARSAW,
POLAND, D. PIJANOWSKA AND J. JAZWINSKI, INST. ELEE. TECH., WARSAW,
POLAND P. 402 1A4 INTEGRATED SYSTEMS MONDAY, JUNE 11, 2001 (3:40 P.M. -
5:20 P.M.) 1A4.01 A MINIATURIZED, AUTONOMOUS, PROGRAMMABLE STRESS
MONITORING DEVICE, PART OF A DENTAL PROSTHESIS - R. PUERS, W. CLAES, W.
SANSEN, M. DE COOMAN, J. DUYCK, AND I. NAERT, K. U. LEUVEN, HEVERLEE,
BELGIUM P. 52 1A4.02 MONOLITHIC SURFACE-MICROMACHINED SENSOR SYSTEM FOR
HIGH PRESSURE APPLICATIONS - H. KAPELS, R. AIGNER, INFINEON TECH. AG,
MUNICH, GERMANY, C. KOLLE, INFINEON TECH. AG, VILLACH, AUSTRIA P. 56
1A4.03 DEDICATED INTERFACE ELECTRONICS FOR CAPA- CITIVELY-COUPLED
CONDUCTIVITY DETECTION IN ON-CHIP CAPILLARY ELECTROPHORESIS - F.
LAUGERE, G. LUBKING, J. BASTEMEIJER, AND M. VELLEKOOP, DELFT U. TECH.,
DELFT, THE NETHERLANDS P. 60 1A4.04 SENSITIVITY ENHANCEMENT OF MEMS
INERTIAL SENSORS USING NEGATIVE SPRINGS AND ACTIVE CONTROL - M.
HANDTMANN , R. AIGNER, AND A. MECKES, INFINEON TECH. AG, MUNICH,
GERMANY, G. WACHUTKA, (AND*) MUNICH U. TECH., MUNICH, GERMANY, P. 64
1A4.05 A SMART WIND-SENSOR BASED ON THERMAL SIGMA-DELTA MODULATION - K.
MAKINWA AND J. HUIJSING, DELFT U. TECH., DELFT, THE NETHERLANDS P. 68 1
A4.06P HIGH MASS AND SPATIAL RESOLUTION MASS SENSOR BASED ON RESONATING
NANO-CANTILEVERS INTEGRATED WITH CMOS- Z. DAVIS, B. HELBO, 0. HANSEN,
AND A. BOISEN, TECH. U. DENMARK, LYNGBY, DENMARK, G. ABADAL, F.
PEREZ-MURANO, R. RUIZ, AND N. BARNIOL, U. AUTON. BARCELONA, BELLATERRA,
SPAIN, F. CAMPABADAL, J. ESTEVE, AND E. FIGUERAS, INST. MICROELEC,
BELLATERRA, SPAIN P. 72 1A4.07P POSITION SENSING SYSTEM USING INTEGRATED
MAGNETIC SENSORS AND NEURAL NETWORKS - M. TAKAYAMA, SHIKOKU POLYTECH.
COL., KAGAWA, JAPAN, K. MAENAKA AND A. YAMAMOTO, HIMEJI INST. TECH.,
HYOGO, JAPAN P. 76 1 A4.08P AN ACCURATE CMOS SMART TEMPERATURE SENSOR
WITH DYNAMIC ELEMENT MATCHING AND SECOND-ORDER CURVATURE CORRECTION - M.
PERTIJS AND J. HUIJSING, DELFT U. TECH., DELFT, THE NETHERLANDS, A.
BAKKER, PHILIPS SEMICON., DELFT, THE NETHERLANDS P. 80 1A4.09P THE
SCALING OF MULTIPLE SENSOR SIGNALS WITH A WIDE DYNAMIC VOLTAGE RANGE -
G. WANG, G. MEIJER, DELFT U. TECH., DELFT, THE NETHERLANDS P. 84 1A4.10P
INTEGRATED MULTI-SENSOR SYSTEM FOR INTEL- LIGENT DATA CARRIER - T.
FUJITA AND K. MAENAKA, HIMEJI INST. TECH., HYOGO, JAPAN K. INOUE, A.
TSUCHITANI, S. ARITA, TECH. RES INST. AND SEIS PROJ., OSAKA, JAPAN P. 88
1A4.11P NOVEL SURFACE-MICROMACHINED LOW-POWER FUSES FOR ON-CHIP
CALIBRATION - D. MAIER-SCHNEIDER, S. KOLB, B. WINKLER, AND W. WERNER,
INFINEON TECH. AG, MUNICH, GERMANY P. 92 1A4.12P SENSORS LINEARITY
IMPROVEMENT BY MEANS OF DITHERING: FEASIBILITY AND LIMITS - J. HOLUB AND
R. SMID, CZECH TECH. U., PRAGUE, CZECH REPUBLIC P. 96 1A4.13P ELECTRONIC
PROTECTION OF THE CONDUCTIVITY DETECTOR IN A MICRO CAPILLARY
ELECTROPHORESIS CHANNEL - J. BASTEMEIJER, W. LUBKING, F. LAUGERE, AND M.
VELLEKOOP, DELFT U. TECH., DELFT, THE NETHERLANDS P. 100 1 A4.14P
SOPHISTICATED INTERFACE ELECTRONICS FOR QCM - J. SCHRODER, R.
BORNGRABER, F. EICHELBAUM, AND P. HAUPTMANN, OTTO-VON-GUERICKE U.,
MAGDEBURG, GERMANY P. 104 1B4 MAGNETIC SENSORS MONDAY, JUNE 11, 2001
(3:40 P.M. - 5:20 P.M.) 1 B4.01 REFERENCE MAGNETIC ACTUATOR FOR SELF
CALIBRATION OF A VERY SMALL HALL SENSOR ARRAY - M. DEMIERRE, S. PESENTI,
J. FROUNCHI, P. BESSE, AND R. POPOVIC, SWISS FED. INST. TECH., LAUSANNE,
SWITZERLAND P. 136 1B4.02 A VERTICAL HALL DEVICE IN CMOS HIGH-VOLTAGE
TECHNOLOGY - E. SCHURIG, M. DEMIERRE, AND R. POPOVIC, SWISS FED. INST.
TECH., LAUSANNE, SWITZERLAND, C. SCHOTT, SENTRON AG, ZUG, SWITZERLAND P.
140 1B4.03 SINGLE DEPOSITION GMR SENSORS FOR ROTATIONAL SPEED SENSING -
C. GIEBELER, J. RUIGROK, AND J. VAN ZON, PHILIPS RES. LAB., EINDHOVEN,
THE NETHERLANDS P. 144 1 B4.04 HIGH DIRECTIONAL SENSITIVITY OF
MICROMACHINED MAGNETIC FLUXGATE SENSORS - R. RUB, S. GUPTA, AND C. AHN,
U. CINCINNATI, CINCINNATI, OH, USA P. 148 1 B4.05 MAGNETIC SENSOR BASED
ON STABILIZED MOSFET FIELD EMITTER ARRAYS - M. AVRAM, NAT. INST. RES.
DEV. MICROTECH., BUCHAREST, ROMANIA P. 152 1B4.06P A NEW HIGHLY
SENSITIVE PARALLEL-FIELD HALL MICROSENSOR - C. ROUMENIN, D. NIKOLOV, A.
IVANOV, AND C. MIHAILOVA, BULGARIAN ACAD. SCI., SOFIA, BULGARIA P. 156 1
B4.07P HIGH SENSITIVITY HALL MAGNETIC SENSORS USING PLANAR MICRO AND
MACRO FLUX CONCENTRATORS - P. DRLJACA, V. SCHLAGETER, F. VINCENT, AND R.
POPOVIC, SWISS FED. INST., LAUSANNE, SWITZERLAND P. 160 1B4.08P
FERROMAGNETIC MICROMECHANICAL MAGNETO- METERS - H. YANG, N. MYUNG, J.
YEE, D. PARK, B. YOO, M. SCHWARTZ, K. NOBE, AND J. JUDY, U. CALIFORNIA,
LOS ANGELES, CA, USA P. 164 1B4.09P A STUDY ON NARROW-RANGE ANGLE
SENSORS BASED ON WIGGLES IN ANGULAR DEPENDENCE OF PSEUDO-HALL EFFECT IN
PERMALLOY THIN FILMS - P. KIM*, N. THUY, P. LEMINH*, AND D. MANH, ITIMS,
HANOI, VIETNAM, (* AND U. TWENTE, ENSCHEDE, THE NETHERLANDS) P. 168
1B4.10P STOCHASTICALLY DISTRIBUTED NANOWIRES WITH MICRO-LITHOGRAPHIC
INTERCONNECTS FOR MAGNETIC FIELD SENSORS - M. LINDEBERG AND K. HJORT,
UPPSALA U., UPPSALA, SWEDEN, Y. JACCARD AND J. ANSERMET, SWISS FED.
INST., LAUSANNE, SWITZERLAND P. 172 1C4 MODELLING FT SIMULATION MONDAY,
JUNE 11, 2001 (3:40 P.M. - 5:20 P.M.) 1C4.01 IMPROVED COUPLED-FIELD FE
ANALYSIS OF MICRO- MACHINED ELECTROMECHANICAL TRANSDUCERS - J. WIBBELER,
CAD-FEM GMBH, CHEMNITZ, GERMANY, D. SCHEIBNER AND J. MEHNER, CHEMNITZ U.
TECH., CHEMNITZ, GERMANY P. 240 1C4.02 THEORETICAL ANALYSIS OF THE
TILTING EFFECT IN SILICON MICRO-SWITCHES - K. SUZUKI AND A. PAULY, NEC
CORP., IBARAKI, JAPAN P. 244 1C4.03 MACROMODELING OF AN ELECTROSTATIC
TORSIONAL ACTUATOR - R. SATTLER AND G. WACHUTKA, MUNICH U. TECH.,
MUNICH, GERMANY, F. PLOTZ, INFINEON TECH. AG, MUNICH, GERMANY P.248
1C4.04 A NOVEL TOPOLOGY DESIGN SCHEME FOR THE MULTI-PHYSICS PROBLEMS OF
ELECTRO-THERMALLY ACTUATED COMPLIANT MICROMECHANISMS - L YIN AND G.
ANANTHASURESH, U. PENNSYLVANIA, PHILADELPHIA, PA, USA P. 252 1C4.05 AN
ANALYTICAL MODEL OF THE PIEZOJUNCTION EFFECT FOR ARBITRARY STRESS AND
CURRENT ORIENTATIONS - F. CREEMER AND P. FRENCH, DELFT U. TECH., DELFT,
THE NETHERLANDS P. 256 1C4.06P COMPUTATIONAL METHODS FOR REDUCED ORDER
MODELING OF COUPLED DOMAIN SIMULATIONS - F. BENNINI, J. MEHNER, AND W.
DOTZEL, CHEMNITZ U. TECH., CHEMNITZ, GERMANY P. 260 1C4.07P AUTOMATIC
REDUCED-ORDER MODELING IN MEMCAD USING MODAL BASIS FUNCTIONS - M.
VARGHESE AND S. SENTURIA, MIT, CAMBRIDGE, MA, USA, J. GILBERT, AND V.
RABINOVICH, COVENTOR, CAMBRIDGE, MA, USA P. 264 1C4.08P MODELING AND
SIMULATION OF MICRO- ELECTROMECHANICAL SYSTEMS WITH AN ANALOG HARDWARE
DESCRIPTION LANGUAGE - G. ZHOU AND P. DOWD, NANYANG TECH. U., SINGAPORE
P. 268 1C4.09P AUTOMATIC TRANSFER FROM BULK-SILICON TECH- NOLOGY
SIMULATION INTO THE FEM-ENVIRONMENT - D. ZIELKE AND R. LIESKE, GEMAC
MBH, CHEMNITZ, GERMANY, J. WILL, CADFEM GMBH, GRAFING, GERMANY P. 272
1C4.10P EFFICIENT NUMERICAL PREDICTIONS OF MEMS FLUID-STRUCTURE
INTERACTION DAMPING - J. HYVARINEN, ANKER-ZEMER ENG. AB, KARLSKOGA,
SWEDEN, J. SODERKVIST, COLIBRI PRO DEV. AB, TABY, SWEDEN P. 276 1C4.11P
LAYOUT EXTRACTION FOR INTEGRATED ELECTRONICS AND MEMS DEVICES - B.
BAIDYA AND T. MUKHERJEE, CARNEGIE MELLON U., PITTSBURGH, PA, USA P. 280
1C4.12P A HIGH TORQUE DENSITY MEMS MAGNETIC INDUCTION MACHINE - H. KOSER
AND J. LANG, MIT, CAMBRIDGE, MA, USA, F. CROS, AND M. ALLEN, GEORGIA
TECH., ATLANTA, GA, USA P. 284 1 C4.13P MODELING THE PULL-IN PARAMETERS
OF ELECTRO- STATIC ACTUATORS WITH A NOVEL LUMPED TWO DEGREES OF FREEDOM
PULL-IN MODEL - 0. BOEHOBZA-DEGANI, Y. YANIV, E. SOCHER, AND Y.
NEMIROVSKY, TECHNION, HAIFA, ISRAEL P. 288 1C4.14P ON THE EFFECT OF
RESIDUAL CHARGES ON THE PULL-IN PARAMETERS OF ELECTROSTATIC ACTUATORS -
0. BOEHOBZA-DEGANI, E. SOCHER, AND Y. NEMIROVSKY, TECHNION, HAIFA,
ISRAEL P. 292 1C4.1 5P LOW VOLTAGE DRIVEN CAPILLARY ELECTROPHORESIS
CHIPS USING TRAVELLING ELECTRIC FIELD DESIGN - Y. LIN AND W. WU, NAT.
CHENG KUNG U., TAINAN, TAIWAN P. 296 1 C4.16P MODELING AND
CHARACTERIZATION OF LAME-MODE MICRORESONATORS REALIZED BY UV-LIGA - H.
MAJJAD, J. COUDEVYLLE, S. BASROUR, AND M. DE LABACHELERIE, LAB. PHYS.
METROL. OSCI., BESANEON, FRANCE P. 300 1C4.17P DESIGN AND SIMULATION OF
CAPACITIVE, PIEZO- RESISTIVE AND PIEZOELECTRIC TRIAXIAL ACCELEROMETERS
USING A HIGHLY SYMMETRICAL QUAD-BEAM STRUCTURE - G. LI, Z. LI, Y. JIN,
Y. HAO, D. ZHANG, AND G. WU, PEKING U., BEIJING, CHINA P. 304 1 C4.1 8P
FET PRESSURE SENSOR AND ITERATIVE METHOD FOR MODELLING OF THE DEVICE -
R. JACHOWICZ AND Z. AZGIN, WARSAW U. TECH., WARSAW, POLAND P. 308
1C4.19P DIELECTRIC MICRO-HOTPLATE FOR INTEGRATED SENSORS: AN
ELECTRO-THERMO-MECHANICAL ANALYSIS - J. PUIGCORBE, A. VILA, AND J.
MORANTE, U. BARCELONA, BARCELONA, SPAIN, I. GRACIA, AND C. CANE, CEN.
NAT. MICROELEC, BARCELONA, SPAIN P. 312 1C4.20P ON-CHIP INTEGRATED
SILICON BULK-MICROMA- CHINED SOIL MOISTURE SENSOR BASED ON THE DPHP
METHOD - A.VALENTE, U.TRAS-OS-MONTESALTO DOURO.VILA REAL, PORTUGAL, C.
COUTO AND J. CORREIA, U. MINHO, AZUREM, PORTUGAL P. 316 1D4 TECHNOLOGY
FOR BIOMEDICAL SYSTEMS MONDAY, JUNE 11, 2001 (3:40 P.M. - 5:20 P.M.) 1
D4.01 A MINIATURIZED ANALYSIS SYSTEM BASED ON CAPILLARY ELECTROPHORESIS
AND CONTACTLESS CONDUCTIVITY DETECTION - J. LICHTENBERG, E. VERPOORTE,
AND N. DE ROOIJ, U. NEUCHATEL, NEUCHATEL, SWITZERLAND P. 408 1D4.02
FABRICATION OF A MICRO NEEDLE FOR A TRACE BLOOD TEST - K. OKA AND S.
AOYAGI, KANSAI U., OSAKA, JAPAN, Y. ISONO, RITSUMEIKAN U., SHIGA, JAPAN,
G. HASHIGUCHI, KAGAWA U., KAGAWA, JAPAN, H. FUJITA, TOKYO U., TOKYO,
JAPAN P. 412 1 D4.03 A 256-SITE 3D CMOS MICROELECTRODE ARRAY FOR
MULTIPOINT STIMULATION AND RECORDING IN THE CENTRAL NERVOUS SYSTEM - M.
GINGERICH, J. HETKE, D. ANDERSON, AND K. WISE, U. MICHIGAN, ANN ARBOR,
ML, USA P. 416 1 D4.04 A DISPOSABLE INTELLIGENT MOSQUITO WITH A
REVERSIBLE SAMPLING MECHANISM UTILIZING THE VOLUME PHASE TRANSITION OF A
GEL - H. SUZUKI, T. TOKUDA, AND K. KOBAYASHI, U. TSUKUBA, IBARAKI, JAPAN
P. 420 1 D4.05 MICROMACHINED ULTRASONIC OPHTHALMIC MICRO- SURGICAL TOOL
WITH INTEGRATED PRESSURE SENSOR - X. CHEN AND A. LAI, U. WISCONSIN,
MADISON, WL, USA P. 424 2A1 INERTIAL SENSORS 1 TUESDAY, JUNE 12, 2001
(8:30 A.M. - 10:00 A.M.) 2A1.01 INERTIAL SENSORS FOR AUTOMOTIVE
APPLICATIONS - H. KUISMA , VTI HAMLIN, VANTAA, FINLAND P. 430 2A1.02
RASTA: THE REAL-ACCELERATION-FOR-SELF-TEST ACCELEROMETER - S. REYNTJENS
AND R. PUERS, K. U. LEUVEN, LEUVEN, BELGIUM P. 434 2A1.O3 FIBER-OPTICS
MEMS ACCELEROMETER WITH HIGH MASS DISPLACEMENT RESOLUTION - B.
GULDIMANN, P. DUBOIS, P. CLERC, AND N. DE ROOIJ, U. NEUCHATEL,
NEUCHATEL, SWITZERLAND P. 438 2A1.04 A MONOLITHIC THREE-AXIS
ACCELEROMETER WITH SYMMETRIC PROPERTIES - H. RODJEGARD AND G. ANDERSSON,
IMEGO INST., GOTEBORG, SWEDEN P. 442 2A1.05P 5-AXIS CAPACITIVE MOTION
SENSOR FABRICATED BY SILICON MICROMACHINING TECHNIQUE - Y. WATANABE, T.
MITSUI, T. MINETA, AND S. KOBAYASHI, YAMAGATA RES. INST. TECH.,
YAMAGATA, JAPAN, N. TANIGUCHI, AND K. OKADA, WACOH CORP., SAITAMA, JAPAN
P. 446 2A1.06P A 19-ELEMENT SHOCK SENSOR ARRAY FOR BI- DIRECTIONAL
SUBSTRATE-PLANE SENSING FABRICATED BY SACRIFICIAL LIGA - S. MCNAMARA AND
Y. GIANCHANDANI, U. WISCONSIN, MADISON, WL, USA P. 450 2B1 OPTICAL
SENSORS TUESDAY, JUNE 12, 2001 (8:30 A.M. - 10:00 A.M.) 2B1.01
TRANSMISSION-TYPE OPTICAL SENSORS FABRICATED BY SI MICROMACHINING - K.
HANE , M. SASAKI, TOHOKU U., SENDAI, JAPAN P. 524 2B1.02 MINIATURE CO 2
GAS SENSOR (1 CM 3 ) USING SILICON MICROBOLOMETERS AND MICRO VARIABLE
INFRARED FILTER - N. KISHI, H. HARA, AND H. IWAOKA, YOKOGAWA ELEC.
CORP., NAGANO, JAPAN P. 528 2B1.03 CMOS INTEGRATED WAVEFRONT SENSOR - D.
DE LIMA MONTEIRO, G. VDOVIN, AND M. LOKTEV, DELFT U. TECH., DELFT, THE
NETHERLANDS P. 532 2B1.04 DEVELOPMENT OF A MICRO-OPTICAL DISTANCE SENSOR
WITH ELECTRICAL I/O INTERFACE - I OKA, H. NAKAJIMA, A. SHIRATSUKI, AND
M. TSUGAI, MITSUBISHI ELEC. CORP., HYOGO, JAPAN, U. WALLRABE, U.
HOLLENBACH, P. KRIPPNER, AND J. MOHR, FZK, KARLSRUHE, GERMANY P. 536
2B1.05P BIAS DEPENDENT PHOTOCURRENT COLLECTION IN P-I-N A-SI:H/SIC:H
HETEROJUNCTION - P. LOURO, M. VIEIRA, Y. VYGRANENKO, M. FERNANDES, AND
R. SCHWARZ, ISEL, LISBON, PORTUGAL, M. SCHUBERT, U. STUTTGART,
STUTTGARD, GERMANY P. 540 2B1.06P PHOTOCHEMICAL REACTION BY
NANOMETER-SCALE LIGHT EMITTING DIODE-ANTIFUSES - P. LEMINH, J. HOLLEMAN,
H. WALLINGA, AND A. VAN DEN BERG, U. TWENTE, ENSCHEDE, THE NETHERLANDS
P. 544 2B1.O7P FABRICATION AND OPTICAL MEASUREMENTS OF MULTI-SLIT
GRATING BASED INFRARED MICRO-SPECTROMETER - S. KONG, D. WIJNGAARDS, G.
DE GRAAF, AND R. WOLFFENBUTTEL, DELFT U. TECH., DELFT, THE NETHERLANDS
P. 548 2B1.08P SI MICROMACHINED OPTICAL ENCODER BASED ON GRATING IMAGING
- K. HANE, T. ENDO, AND M. SASAKI, TOHOKU U., SENDAI, JAPAN, Y. ITO,
HARMONIC DRIVE SYS. INC., NAGANO, JAPAN P. 552 2B1.09P CMOS
MICROMACHINED INFRARED IMAGER PIXEL - H. LAKDAWALA AND G. FEDDER,
CARNEGIE MELLON U., PITTSBURGH, PA, USA P. 556 2B1.1OP
WAVELENGTH-DIFFERENTIAL IMAGING USING VARIABLE INTERFEROMETER AND
VISUALIZATION OF GAS FLOW - K. YAMASHITA AND M. OKUYAMA, OSAKA U.,
OSAKA, JAPAN, T. NAGASHIMA, HOCHIKI CORP., TOKYO, JAPAN, S. HATTA, R.
KAJIHARA, AND Y. HAMAKAWA, RITSUMEIKAN U., SHIGA, JAPAN P. 560 2B1.11P
AN UNCOOLED INFRARED SENSOR OF DIELECTRIC BOLOMETER MODE USING A NEW
DETECTOR TECHNIQUE OF OPERATION BIAS VOLTAGE - M. NODA, K. INOUE, M.
OGURA, H. XU, S. MURAKAMI, H. KISHIHARA, AND M. OKUYAMA, OSAKA U.,
OSAKA, JAPAN P. 564 2B1.12P PYROELECTRIC HIGH-RESOLUTION LINEAR ARRAY
WITH 256 MICROMACHINED LITHIUM TANTALATE PIXELS - R. KOEHLER*, V.
NORKUS*, G. GERLACH, DRESDEN U. TECH., DRESDEN, GERMANY, J. VOLLHEIM, N.
HEB, G. HOFMANN, AND (*), DIAS GMBH, DRESDEN, GERMANY P. 568 2C1 BASIC
PHYSICAL EFFECTS IN MEMS TUESDAY, JUNE 12, 2001 (8:30 A.M. - 10:00 A.M.)
2C1.01 NANO ELECTROMECHANICAL SYSTEMS - M. ROUKES , CALTECH, PASADENA,
CA, USA P. 658 2C1.02 WHY IS (111) SILICON A BETTER MECHANICAL MATERIAL
FOR MEMS? - J. KIM AND D. CHO, SEOUL NAT. U., SEOUL, KOREA, R. MUTTER,
U. CALIFORNIA, BERKELEY, CA, USA P. 662 2C1.03 ANALYZING FLUID
COMPRESSION EFFECTS IN COMPLICATED MICROMACHINED DEVICES - X. WANG AND
J. WHITE, MIT, CAMBRIDGE, MA, USA P. 666 2C1.04 PHYSICALLY-BASED
MODELING OF SQUEEZE FILM DAMPING BY MIXED LEVEL SYSTEM SIMULATION - G.
SCHRAG, P. VOIGT, AND G. WACHUTKA, MUNICH U. TECH., MUNICH, GERMANY P.
670 2C1.05P MICRODISCHARGE DEVICE FABRICATED IN SILICON BY
MICROMACHINING TECHNIQUE WITH PYRAMIDAL CAVITY - J. CHEN, S. PARK, J.
EDEN, AND C. LIU, U. ILLINOIS, URBANA, IL, USA P. 674 2C1.06P USING THE
PULL-IN VOLTAGE AS VOLTAGE REFERENCE - E. CRETU, L ROCHA, AND R.
WOLFFENBUTTEL, DELFT U. TECH., DELFT, THE NETHERLANDS P. 678 2D1
CHEMICAL SENSING TUESDAY, JUNE 12, 2001 (8:30 A.M. - 10:00 A.M.) 2D1.01
THE EMERGENCE OF PHYSICAL CHEMOSENSORS AND BIOSENSORS - M. VELLEKOOP ,
DELFT U. TECH., DELFT, THE NETHERLANDS P. 770 2D1.02 MEMS SPECTROMETER
FOR INFRARED GAS ANALYSIS BASED ON A TUNABLE FILTER OF POROUS SILICON -
G. LAMMEL, S. SCHWEIZER, AND P. RENAUD, SWISS FED. INST. TECH.,
LAUSANNE, SWITZERLAND P. 776 2D1.03 A PHOTOACOUSTIC GAS SENSING SILICON
MICRO- SYSTEM - P. OHLCKERS* AND A. FERBER, FIFTY-FOUR POINT SEVEN,
OSLO, NORWAY, (* AND U. OSLO, OSLO, NORWAY), V. DMITRIEV, AND G.
KIRPILENKO, PATINOR COAT., MOSCOW, RUSSIA P. 780 2D1.04 HIGH-Q FACTOR RF
PLANAR MICROCOILS ON GLASS SUBSTRATES FOR NMR SPECTROSCOPY - C. MASSIN,
G. BOERO, P. EICHENBERGER, P. BESSE, AND R. POPOVIC, SWISS FED. INST.
TECH., LAUSANNE, SWITZERLAND P. 784 2D1.05P MICROMACHINED MASS
SPECTROMETER - N. SILLON AND R. BAPTIST, CEA/LETI, GRENOBLE, FRANCE P.
788 2A2 INERTIAL SENSORS 2 TUESDAY, JUNE 12, 2001 (10:20 A.M. - 12:00
P.M.) 2A2.01 A SYMMETRIC SURFACE MICROMACHINED GYROSCOPE WITH DECOUPLED
OSCILLATION MODES - S. ALPER AND T. AKIN, MIDDLE EAST TECH. U., ANKARA,
TURKEY P. 456 2A2.02 A LINK BEAM DRIVEN, TRIPLE AXIS ANGULAR RATE SENSOR
BASED ON A DOUBLE GIMBAL STRUCTURE - M. TSUGAI, N. KONNO, Y. ARIYOSHI,
AND T. USAMI, MITSUBISHI ELEC. CORP., HYOGO, JAPAN, H. FUJITA, U. TOKYO,
TOKYO, JAPAN P. 460 2A2.03 NEW APPROACH FOR FREQUENCY MATCHING OF TUNING
FORK GYROSCOPES BY USING A NONLINEAR DRIVING CONCEPT - 0. SCHWARZELBACH,
G. FAKAS, AND W. NIENKIRCHEN, FRAUNHOFER ISIT, ITZEHOE, GERMANY P. 464
2A2.04 SELF-TEST FOR RESONANT STRUCTURE SENSORS APPLIED TO A TUNING FORK
GYRO AND A RESONANT ACCELEROMETER - K. BAUER, W. FICKER, K. KOPPENHAGEN,
E. STENZEL, AND J. SCHALK, EADS DEUTSCHL. GMBH, MUNICH, GERMANY, M.
AIKELE, TEMIC, MUNICH, GERMANY, F. NEUBAUER, DAIMLERCHRYSLER,
SINDELFINGEN, GERMANY P. 468 2A2.05 NEW DIGITAL READOUT ELECTRONICS FOR
CAPA- CITIVE SENSORS BY THE EXAMPLE OF MICRO-MACHINED GYRO- SCOPES - A.
GAIBER, W. GEIGER, T. LINK, J. MERZ, S. STEIGMAJER, A. HAUSER, H.
SANDMAIER*, AND W. LANG, HSG-IMIT, VILLINGEN- SCHWENNINGEN, GERMANY, (*
AND U. STUTTGART, GERMANY), N. NIKLASCH, VICON ENG., MUNICH, GERMANY P.
472 2A2.06P A BULK-MICROMACHINED SINGLE CRYSTAL SILICON GYROSCOPE
OPERATING AT ATMOSPHERIC PRESSURE - S. KIM, J. LEE, C. KIM, AND Y. KIM,
SEOUL NAT. U., SEOUL, KOREA P. 476 2B2 IMAGE SENSORS TUESDAY, JUNE 12,
2001 (10:20 A.M. - 12:00 P.M.) 2B2.01 A CHOPPERLESS PYROELECTRIC ACTIVE
PIXEL INFRARED IMAGE SENSOR USING CHIP SHIFT OPERATION - S. KAWAHITO,
SHIZUOKA U., HAMAMATSU, JAPAN, K. SAWADA, K. TADA, M. ISHIDA, AND Y.
TADOKORO, TOYOHASHI U. TECH., TOYOHASHI, JAPAN P. 574 2B2.02 LASER
SCANNED PHOTODIODES (LSP) FOR IMAGE SENSING - M. VIEIRA, M. FERNANDES,
P. LOURO, AND R. SCHWARZ, ISEL, LISBON, PORTUGAL, M. SCHUBERT, U.
STUTTGART, STUTTGARD, GERMANY P. 578 2B2.03 ELECTRON EMISSION TYPE
INFRARED IMAGE SENSOR USING FERROELECTRIC THIN PLATE - K. TOMITA, D.
TAKAMURO, K. SAWADA, AND M. ISHIDA, TOYOHASHI U. TECH., TOYOHASHI, JAPAN
P. 582 2B2.04 A MILLIMETER-WAVE IMAGE SENSOR USING ANTENNA COUPLED MICRO
THERMOCOUPLE - D. LEE, K. LEE, S. CHANG, AND H. HWANG, KOREA ELEC. TECH.
INST, KYUNGGI-DO, KOREA P. 586 2B2.05 A MEMS NON-LNTERFEROMETRIC
DIFFERENTIAL CON- FOCAL SCANNING OPTICAL MICROSCOPE - W.
PIYAWATTANAMETHA, P. PATTERSON, G. SU, H. TOSHIYOSHI, AND M. WU, U.
CALIFORNIA, LOS ANGELES, CA, USA P. 590 2C2 ACTUATORS 1 TUESDAY, JUNE
12, 2001 (10:20 A.M. - 12:00 P.M.) 2C2.01 PARALLEL LINEAR ACTUATOR
SYSTEM WITH HIGH ACCURACY AND LARGE STROKE - S. KONISHI, K. OHNO, AND M.
MUNEEHIKA, RITSUMEIKAN U., SHIGA, JAPAN P. 682 2C2.02 A HIGH-FREQUENCY,
HIGH STIFFNESS PIEZOELECTRIC MICRO-ACTUATOR FOR HYDRAULIC APPLICATIONS -
D. ROBERTS, L STEYN, H. LI, K. TURNER, L SAGGERE, S. SPEARING, M.
SCHMIDT, AND N. HAGOOD, MIT, CAMBRIDGE, MA, USA, R. MLCAK, BOSTON
MICROSYS. INC., WOBURN, MA, USA P. 686 2C2.03 A MONOLITHIC PIEZOELECTRIC
MINIATURE ROBOT WITH 5 DOF - U. SIMU AND S. JOHANSSON, UPPSALA U.,
UPPSALA, SWEDEN P. 690 2C2.04 A NOVEL MICROMACHINED ELECTROMAGNETIC
LOUDSPEAKER FOR HEARING AID - M. CHENG, W. HUANG, R. HUANG, AND T. CHIN,
NAT. TSING HUA U., HSINCHU, TAIWAN P. 694 2C2.05 AN ACTIVE GUIDE WIRE
WITH SHAPE MEMORY ALLOY BENDING ACTUATOR FABRICATED BY ROOM TEM-
PERATURE PROCESS - T. MINETA, T. MITSUI, Y. WATANABE, AND S. KOBAYASHI,
YAMAGATA RES. INST. TECH., YAMAGATA, JAPAN, Y. HAGA, M. ESASHI, TOHOKU
U., SENDAI, JAPAN P. 698 2C2.06P THE FLOATING MASS VIBRATION TRANSDUCER
USING POLYIMIDE ELASTIC BODY FOR IMPLANTABLE HEARING AID - K. LEE, S.
LEE, S. PARK, J. CHO, AND S. LEE, KYUNGPOOK NAT. U., TAEGU, KOREA, S.
LEE, AGENCY TECH. STD., KOREA P. 702 2C2.07P BISTABLE THIN FILM
COMPOSITES WITH TIHFNI- SHAPE MEMORY ALLOYS - B. WINZEK, T. STERZL, AND
E. QUANDT, CAESAR, BONN, GERMANY P. 706 2C2.08P SMA MICROGRIPPER SYSTEM
- M. KOHL, B. KREVET, AND E. JUST, FZK GMBH, KARLSRUHE, GERMANY P. 710
2C2.09P COMPLIANT MICROTRANSMISSIONS FOR RECTI- LINEAR ELECTRO-THERMAL
ACTUATORS - L CHU, J. HETRICK, AND Y. GIANCHANDANI, U. WISCONSIN,
MADISON, WL, USA P. 714 2C2.10P BULK MICROMACHINED DURABLE AIR-FLOW
MICROACTUATOR ARRAY FOR ROBUST CONVEYANCE SYSTEMS - Y. MITA, M. ARAI, A.
TIXIER, AND H. FUJITA, U. TOKYO, TOKYO, JAPAN P. 718 2C2.11 P A NEW
MICRO PNEUMATIC ACTUATOR FOR MICRO- MECHANICAL SYSTEMS - S. BIITEFISEH,
V. SEIDEMANN, AND S. BIITTGENBACH, BRAUNSCHWEIG U. TECH., BRAUNSCHWEIG,
GERMANY P. 722 2C2.12P INFLUENCE OF ELASTIC DEFORMATION IN SURFACE
ACOUSTIC WAVE MOTOR FRICTION DRIVE - M. KUROSAWA AND H. ITOH, TOKYO
INST. TECH., TOKYO, JAPAN, K. ASAI, MATSUSHITA CO., KAWASAKI, JAPAN P.
726 2D2 CHEMICAL SENSING 2 TUESDAY, JUNE 12, 2001 (10:20 A.M. - 12:00
P.M.) 2D2.01 DESIGN AND FABRICATION OF A HYDRODYNAMIC CHROMATOGRAPHY
CHIP - M. BLOM, J. GARDENIERS, M. ELWENSPOEK, AND A. VAN DEN BERG, U.
TWENTE, ENSCHEDE, THE NETHERLANDS, E. CHMELA, AND R. TIJSSEN, U.
AMSTERDAM, AMSTERDAM, THE NETHERLANDS P. 794 2D2.02 CHEMICAL IMAGES BY
AN ARTIFICIAL OLFACTORY BULB - J. MIZSEI AND S. RESS, BUDAPEST U. TECH.,
BUDAPEST, HUNGARY P. 798 2D2.03 MINIATURIZED FLAME LONIZATION DETECTOR
FOR GAS CHROMATOGRAPHY - S. ZIMMERMANN, J. MIILLER, TECH. U.
HAMBURG-HARBURG, HAMBURG, GERMANY, P. KRIPPNER, AND A. VOGEL, ABB AG
CORP. RES., HEIDELBERG, GERMANY P. 802 2D2.04 NEW TYPE OF THERMAL
CONDUCTIVITY SENSOR FOR GAS DETECTION - P. TARDY, J. COULON, AND F.
MENIL, ENSEIRB U. BORDEAUX, TALENCE, FRANCE P. 806 2D2.05 IMPEDANCE
IMAGING OF CHEMICAL AND BIO- CHEMICAL SYSTEMS - J. STETTER, U. GOPEL, W.
PENROSE, AND L MANNO, ILLINOIS INST. TECH., CHICAGO, IL, USA P. 810 2A3
PRESSURE ET FORCE SENSORS | TUESDAY, JUNE 12, 2001 (1:30 P.M. - 3:10
P.M.) 2A3.O1 A PIEZORESISTIVE LOW-PRESSURE SENSOR FABRI- CATED USING
SILICON-ON-LNSULATOR (SOI) FOR HARSH ENVIRONMENT APPLICATIONS - J. VON
BERG, M. GNIELKA, C. CAVALLONI, AND T. BOLTSHAUSER, KISTLER INSTR. AG,
WINTERTHUR, SWITZERLAND, T. DIEPOLD, FIRST SEN. TECH., BERLIN, GERMANY,
B. MUKHOPADHYAY, AND E. OBERMEIER, BERLIN U. TECH., GERMANY P. 482
2A3.02 HIGH TEMPERATURE CHARACTERIZATION OF CERAMIC PRESSUE SENSORS - M.
FONSEEA, J. ENGLISH, M. VON ARX, AND M. ALLEN, GEORGIA TECH., ATLANTA,
GA, USA P. 486 2A3.03 THE NANOPIRANI - PRESUMABLY THE WORLD S SMALLEST
PRESSURE SENSOR - S. REYNTJENS, D. DE BRUYKER, AND P. PUERS, K. U.
LEUVEN, LEUVEN, BELGIUM P. 490 2A3.04 MINIATURIZED PRESSURE SENSOR USING
A FREE HANGING STRAIN-GAUGE WITH LEVERAGE EFFECT FOR INCREASED
SENSITIVITY - P. MELVAS, E. KALVESTEN, P. ENOKSSON, AND G. STEMME, ROYAL
INST. TECH., STOCKHOLM, SWEDEN P. 494 2A3.05 CAPACITIVE SILICON
MICROSENSOR FOR FORCE AND TORQUE MEASUREMENT - A. MECKES AND R. AIGNER,
INFINEON TECH. AG, MUNICH, GERMANY, G. DORFINGER, AND G. WACHUTKA,
MUNICH U. TECH., MUNICH, GERMANY P. 498 2A3.06P A NEW VACUUM FRICTION
GAUGE BASED ON A SI TUNING FORK - S. KURTH, K. HITLER, N. ZICHNER, J.
MEHNER, C. KAUFMANN, W. DOTZEL, AND T. GESSNER, CHEMNITZ U. TECH.,
CHEMNITZ, GERMANY, T. IWERT, AND S. BIEHL, U-SEN MST GMBH, RUDOLSTADT,
GERMANY P. 502 2A3.07P A SERVO-CONTROLLED CAPACITIVE PRESSURE SENSOR
WITH A THREE-MASK FABRICATION SEQUENCE - J. PARK AND Y. GIANCHANDANI, U.
WISCONSIN, MADISON, WL, USA P. 506 2A3.08P HIGH TEMPERATURE PRESSURE
SENSOR WITH MONOLITHICALLY INTEGRATED CMOS READOUT CIRCUIT BASED ON
SIM0X TECHNOLOGY - K. KASTEN AND W. MOKWA*, AACHEN U. TECH., AACHEN,
GERMANY, N. KORDAS, H. KAPPERT, AND (*), FRAUNHOFER IMS, DUISBURG,
GERMANY P. 510 2A3.09P FABRICATION AND TESTING OF SINGLE CRYSTALLINE
3C-SIC PIEZORESISTIVE PRESSURE SENSORS - C. WU, S. STEFANESCU, H. KUO,
C. ZORMAN, AND M. MEHREGANY, CASE WEST. RESERVE U., CLEVELAND, OHIO, USA
P. 514 2A3.10P STABLE AND CORROSION-RESISTANT SAPPHIRE CAPACITIVE
PRESSURE SENSOR FOR HIGH TEMPERATURE AND HARSH ENVIRONMENTS - S. KIMURA,
Y. ISHIKURA, T. KATAOKA, M. SOEDA, T. MASUDA, Y. YOSHIKAWA, AND M.
NAGATA, YAMATAKE CORP., KANAGAWA, JAPAN P. 518 2B3 MICROMACHINING FT
ETCHING TUESDAY, JUNE 12, 2001 (1:30 P.M. - 3:10 P.M.) 2B3.01
MICROMACHINING OF PIEZOELECTRIC MEMS - J. BABOROWSKI, N. LEDERMANN, S.
GENTIL, AND P. MURALT, SWISS FED. INST. TECH., LAUSANNE, SWITZERLAND P.
596 2B3.02 METHODS FOR FABRICATION OF RELEASED NICKEL COMB-DRIVE DEVICES
ON CMOS - A. YALCINKAYA, J. RAVNKILDE, AND 0. HANSEN, TECH. U. DENMARK,
LYNGBY, DENMARK, L JOHANSEN, IONASA/S, BIRKEROD, DENMARK P. 600 2B3.03
ANISOTROPIC SI ETCHING TECHNIQUE FOR OPTICALLY SMOOTH SURFACES - M.
SASAKI, T. FUJII, Y. LI, AND K. HANE, TOHOKU U., SENDAI, JAPAN P. 604
2B3.04 ULTRA-FAST ANISOTROPIC SILICON ETCHING WITH RESULTING MIRROR
SURFACES IN AMMONIA SOLUTIONS - C. MIHALCEA, S. KHUMPUANG, M. KUWAHARA,
Z. YANG, R. MAEDA, J. TOMINAGA, AND N. ATODA, NAT. INST. ADV. INTERDIS.
RES., IBARAKI, JAPAN P. 608 2B3.05 ASPECT RATIO AND CRYSTALLOGRAPHIC
ORIENTATION DEPENDENCE IN DEEP DRY SILICON ETCHING AT CRYOGENIC
TEMPERATURES - G. CRACIUN, M. BLAUW, E. VAN DER DRIFT, AND P. FRENCH,
DELFT U. TECH., DELFT, THE NETHERLANDS P. 612 2B3.06P FABRICATION OF
MICROMECHANICAL STRUCTURES OF TITANIA AND TITANIUM WITH ELECTROPHORETIC
DEPOSITION - C. MARQUORDT AND M. ALLEN, GEORGIA TECH., ATLANTA, GA, USA
P. 616 2B3.07P SURFACE MICROMACHINING PROCESS FOR C-SI AS ACTIVE
MATERIAL - A. KOVACS AND U. MESCHEDER, U. FURTWANGEN, FURTWANGEN,
GERMANY P. 620 2B3.O8P ADVANCED SACRIFICIAL POLY-SI TECHNOLOGY FOR
FLUIDIC SYSTEMS - J. BERENSCHOT, N. TAS, T. LAMMERINK, M. ELWENSPOEK,
AND A. VAN DEN BERG, U. TWENTE, ENSCHEDE, THE NETHERLANDS P. 624 2B3.09P
A NEW PROCESSING TECHNIQUE TO PREVENT STICTION USING SILICON SELECTIVE
ETCHING FOR SOI-MEMS - N. FUJITSUKA AND J. SAKATA, TOYOTA INC., AICHI,
JAPAN P. 628 2B3.10P ELECTROCHEMICAL ETCHING FOR N-TYPE SILICON USING A
NOVEL ETCHANT - S. IZUO, H. OHJI, AND K. TSUTSUMI, MITSUBISHI ELEC.
CORP., HYOGO, JAPAN, P. FRENCH, DELFT U. TECH., DELFT, THE NETHERLANDS
P. 632 2B3.11P A NOVEL SUB-MICRON GAP FABRICATION TECHNOLOGY USING
CHEMICAL-MECHANICAL POLISHING (CMP): APPLICATION TO LATERAL FIELD
EMISSION DEVICE (FED) - C. LEE AND C. HAN, KAIST, DAEJON, KOREA P. 636
2B3.12P MICRO- AND NANOPATTERNING OF SENSOR CHIPS BY MEANS OF
MACROPOROUS SILICON - A. KUROWSKI AND J. SCHULTZE, HEINRICH-HEINE U.
DUESSELDORF, DUESSELDORF, GERMANY, H. LIITH, AND M. SCHONING*, RES.
CENT. JUELIEH, JUELICH, GERMANY, (* AND U. AACHEN, JUELICH, GERMANY) P.
640 2B3.13P MICROFLUIDIC CHANNEL ROUTING WITH PROTECTED CONVEX CORNERS -
J. KWON AND E. KIM, U. S. CALIFORNIA, LOS ANGELES, CA, USA P. 644
2B3.14P A NEW EXPLANATION OF MASK-CORNER UNDERCUT IN ANISOTROPIC SILICON
ETCHING: SADDLE POINT IN ETCHING RATE DIAGRAM - M. SHIKIDA, K. NANBARA,
I KOIZUMI, H. SASAKI, M. ODAGAKI AND K. SATO, NAGOYA U., NAGOYA, JAPAN,
M. ANDO AND S. FURUTA, SANWA KAGAKU KENKYUSHO CO. LTD., GIFU, JAPAN, K.
ASAUMI, FUJI CO., TOKYO, JAPAN P. 648 2B3.15P BRF 3 DRY RELEASE
TECHNOLOGY FOR LARGE FREE- STANDING PARYLENE MEMS - I YAO, X. YANG, AND
Y. TAI, CALIFORNIA TECH., PASADENA, CA, USA P. 652 2C3 ACTUATORS 2
TUESDAY, JUNE 12, 2001 (1:30 P.M. - 3:10 P.M.) I I 2C3.01 DESIGN,
FABRICATION AND TESTING OF NEW COMB ACTUATORS REALIZING
THREE-DIMENSIONAL CONTINUOUS MOTIONS - Y. ANDO, T. IKEHARA, AND S.
MATSUMOTO, NAT. INST. ADV. IND. SCI. TECH., IBARAKI, JAPAN P. 732 2C3.02
OPTIMAL SHAPE DESIGN FOR ELECTRODES OF A ROTARY MICROACTUATOR - S. JUNG,
J. CHOI, C. LEE, C. PARK, D. MIN, C. KIM, AND J. JEON, SAMSUNG ADV.
INST. TECH., SUWON, KOREA, J. PARK, YONSEI U., SEOUL, KOREA P. 736
2C3.03 ELECTROSTATICALLY-DRIVEN-LEVERAGE ACTUATOR AS AN ENGINE FOR
OUT-OF-PLANE MOTION - H. LIN, H. HU, W. FANG, AND R. HUANG, NAT. TSING
HUA U., HSINCHU, TAIWAN P. 740 2C3.04 SELF-RECIPROCATING
RADIOISOTOPE-POWERED CANTILEVER - H. LI, A. LAI, J. BLANCHARD, AND D.
HENDERSON, U. WISCONSIN, MADISON, WL, USA P. 744 2C3.05 A
MICROMECHANICAL SWITCH WITH ELECTRO- STATICALLY DRIVEN LIQUID-METAL
DROPLET - J. KIM, W. SHEN, AND C. KIM, U. CALIFORNIA, LOS ANGELES, CA,
USA, L LATORRE, LAB. INF., ROBOT., MICROELEC, MONTPELLIER, FRANCE P. 748
2C3.06P FABRICATION OF MICRO XY-STAGE WITH LARGE-AREA RECTANGULAR
SHUTTLE USING ANODIC BONDING PROCESS - C. KIM AND Y. KIM, SEOUL NAT. U.,
SEOUL, KOREA, H. JEONG, J. CHOI, AND J. JEON, SAMSUNG ADV. INST. TECH.,
SUWON, KOREA P. 752 2C3.07P A NOVEL ELECTROSTATIC VERTICAL ACTUATOR
FABRICATED IN ONE HOMOGENEOUS SILICON WAFER USING EXTENDED SBM
TECHNOLOGY - J. KIM, S. PARK, AND D. CHO, SEOUL NAT. U., SEOUL, KOREA P.
756 2C3.08P NEW CURRENT DRIVE METHOD TO EXTEND THE STABLE OPERATION
RANGE OF ELECTROSTATIC ACTUATORS: EXPERIMENTAL VERIFICATION - R.
GUARDIA, A. DEHE, AND R. AIGNER, INFINEON TECH. AG, MUNICH, GERMANY, L
CASTARIER, U. POLITEC. CATALUNYA, BARCELONA, SPAIN P. 760 2C3.09P 3D
SELF-ASSEMBLED MICRO-ACTUATORS FOR OPTICAL APPLICATIONS - E. QUEVY AND L
BUCHAILLOT, INST. ELEC. MICROELEC. NORD, VILLENEUVE D ASCQ, FRANCE, D.
COLLARD, U. TOKYO, TOKYO, JAPAN P. 764 2D3 MATERIALS FOR GAS SENSING |
TUESDAY, JUNE 12, 2001 (1:30 P.M. - 3:10 P.M.) 2D3.01 PREPARATION OF
THERMALLY STABLE MESOPOROUS TIN OXIDE AS A SEMICONDUCTOR GAS SENSOR
MATERIAL - T. HYODO, N. NISHIDA, Y. SHIMIZU, AND M. EGASHIRA, NAGASAKI
U., NAGASAKI, JAPAN P. 816 2D3.02 SILICON PLANAR MICROCALORIMETER
EMPLOYING NANOSTRUCTURED FILMS - J. GARDNER AND S. LEE, WARWICK U.,
COVENTRY, UK, P. BARTLETT AND S. GUERIN, SOUTHAMPTON U., UK, D. BRIAND,
AND N. DE ROOIJ, U. NEUCHATEL, NEUCHATEL, SWITZERLAND P. 820 2D3.03
SCREEN PRINTED METAL OXIDE GAS SENSORS WITH MICROMINIATURE GAS
SEPARATION SYSTEMS - K. PRATT AND C. KING, CAPTEUR SEN. ANA., OXON, UK
P. 824 2D3.04 GROUP ILL-NITRIDE BASED SENSORS FOR EXHAUST GAS MONITORING
- J. SCHALWIG AND G. MIILLER, EADS DEUTSCHL. GMBH, MUNICH, GERMANY, 0.
AMBACHER AND M. STUTZMANN, MUNICH U. TECH., MUNICH, GERMANY P. 828
2D3.05 PT/CEO 2 SIC SCHOTTKY DIODES WITH HIGH RESPONSE TO HYDROGEN AND
HYDROCARBONS - S. JACOBSEN, SENSONOR, HORTEN, NORWAY, U. HELMERSSON, L
EKEDAHL, I. LUNDSTROM, AND A. LLOYD SPETZ, LINKOPING U., LINKOPING,
SWEDEN, P. MARTENSSON, APPLIEDSENSOR, LINKOPING, SWEDEN P. 832 2D3.06P
COMPARISON OF SINGLE AND BINARY OXIDE MOO T , J O 2 AND WO, SOL-GEL GAS
SENSORS - K. GALATSIS, Y. LI, AND W. WLODARSKI, RMIT U., MELBOURNE,
AUSTRALIA, E. COMINI AND G. SBERVEGLIERI, U. BRESCIA, BRESCIA, ITALY, C.
CANTALINI, S. SANTUCEI, AND M. PASSACANTANDO, U. L AQUILA, L AQUILA,
ITALY P. 836 2D3.07P GAS SENSING PROPERTIES OF P-TYPE SEMICON- DUCTING
CR-DOPED TIO 2 THIN FILMS - Y. LI, SHANGHAI INST. CERAM., SHANGHAI,
CHINA, W. WLODARSKI, K. GALATSIS, S. MOSHLI, J. COLE, AND S. RUSSO, RMIT
U., MELBOURNE, AUSTRALIA, N. ROCKELMANN, CSIRO, MELBOURNE, AUSTRALIA P.
840 2D3.08P POLYSILICON MESOSCOPIC WIRES COATED BY PD AS HIGH
SENSITIVITY H 2 SENSORS - A. TIBUZZI, C. DI NATALE, AND A. D AMICO, U.
TOR VERGATA, ROME, ITALY, B. MARGHESIN, S. BRIDA, AND M. ZEN, ITC-IRST,
POVO, ITALY, G. SONCINI, U. TRENTO, ITALY P. 844 2D3.09P NEW MATERIAL
FOR THIN FILM FILAMENT OF MICRO- MACHINED HOT-PLATE - A. POLLIEN, J.
BABOROWSKI, N. LEDERMANN, AND P. MURALT, SWISS FED. INST. TECH.,
LAUSANNE, SWITZERLAND P. 848 3A1 MICROTHRUSTERS AND MICROJETS WEDNESDAY,
JUNE 13, 2001 (8:30 A.M. - 10:00 A.M.) 3A1.01 MICROSYSTEMS IN SPACE
EXPLORATION - L STENMARK , UPPSALA U., UPPSALA, SWEDEN P. 882 3A1.02 A
HYBRID COLD GAS MICROTHRUSTER SYSTEM FOR SPACECRAFT - J. KOHLER, U.
SIMU, J. BEJHED, H. KRATZ, K. JONSSON, H. NGUYEN, F. BRUHN, C. HEDLUND,
U. LINDBERG, K. HJORT, AND L STENMARK, UPPSALA U., UPPSALA, SWEDEN P.
886 3A1.03 HIGH-DENSITY MICROMACHINED ACOUSTIC EJECTOR ARRAY FOR MICRO
PROPULSION - T. CHOU, K. NAJAFI, M. MULLER, L BERNAL, AND P. WASHABAUGH,
U. MICHIGAN, ANN ARBOR, ML, USA P. 890 3A1.04 WATER NEEDLE - A NEW
PHENOMENON FOR INK- JET PRINTING - Q. ZOU AND D. HUANG, U. HAWAII,
HONOLULU, HI, USA, E. KIM, USC, LOS ANGELES, CA, USA P. 894 3A1.05P A
HIGH-IMPULSE LOW-POWER MICROTHRUSTER USING LIQUID PROPELLANT WITH
HIGH-VISCOUS FLUID-PLUG - S. KIM, T. KANG, AND Y. CHO, KOREA ADV. INST.
SCI., TAEJON, KOREA P. 898 3A1.06P A MICROMACHINED MONOLITHIC INKJET
PRINT HEAD WITH DOME SHAPE CHAMBER - C. LEE, K. NA, D. MAENG, K. KUK,
AND Y. OH, SAMSUNG ADV. INST. TECH., SUWON, KOREA P. 902 3A1.07P A
SURFACE MICROMACHINED ELECTROSTATIC DROP EJECTOR - P. GALAMBOS, K.
ZAVADIL, R. GIVLER, AND F. PETER, SANDIA NAT. LABS, ALBUQUERQUE, NM,
USA, A. GOORAY, AND G. ROLLER, XEROX CORP., WEBSTER, NY, USA, J.
CROWLEY, ELECTROSTATIC APPS., MORGAN HILL, CA, USA P. 906 3A1.08P
PERFORMANCE IMPROVEMENT IN DOMEJET INKJET PRINT HEAD BY MEASURING
TEMPERATURE OF HEATER - D. MAENG, K. KUK, C. LEE, K. NA, AND Y. OH,
SAMSUNG ADV. INST. TECH., SUWON, KOREA P. 910 3B1 MATERIALS 1 WEDNESDAY,
JUNE 13, 2001 (8:30 A.M. - 10:00 A.M.) | 3B1.01 EPITAXIAL TECHNOLOGY FOR
MEMS APPLICATIONS - M. ISHID A , TOYOHASHI U. TECH., JAPAN P. 980 3B1.02
NOVEL LOW-TEMPERATURE CVD PROCESS FOR SILICON CARBIDE MEMS - C. STOLDT,
C. CARRARO, W. ASHURST, M. FRITZ, D. GAO, AND R. MABOUDIAN, U.
CALIFORNIA, BERKELEY, CA, USA P. 984 3B1.03 POLY SIGE, A PROMISING
MATERIAL FOR MEMS POST-PROCESSING ON TOP OF STANDARD CMOS WAFERS - S.
SEDKY, CAIRO U., GIZA, EGYPT, A. WITVROUW, AND K. BAERT, IMEC, LEUVEN,
BELGIUM P. 988 3B1.04 A BONDED-MICRO-PLATFORM TECHNOLOGY FOR MODULAR
MERGING OF RF MEMS AND TRANSISTOR CIRCUITS - A. WONG, Y. XIE, AND C.
NGUYEN, U. MICHIGAN, ANN ARBOR, ML, USA P. 992 3C1 MICROPROBES FT
NANODEVICES WEDNESDAY, JUNE 13, 2001 (8:30 A.M. - 10:00 A.M.) 3C1.01 THE
MILLIPEDE - MORE THAN 1000 TIPS FOR PARALLEL AND DENSE DATA STORAGE -
P. VETTIGER , G. CROSS, M. DESPONT, U. DREEHSLER, U. DIIRIG, W. HABERLE,
M. LUTWYCHE, H. ROTHUIZEN, R. STUTZ, R. WIDMER, AND G. BINNIG, IBM
ZURICH, ZURICH, SWITZERLAND P. 1054 3C1.02 MICROSYSTEM FOR VERTICAL
PROFILE MEASUREMENT OF HIGH ASPECT-RATIO MICROSTRUCTURES - E.
LEBRASSEUR, J. POURCIEL, T. BOUROUINA, M. OZAKI, T. MASUZAWA, AND H.
FUJITA, U. TOKYO, TOKYO, JAPAN P. 1058 3C1.03 NANOMETRIC SENSING AND
PROCESSING WITH MICROMACHINED FUNCTIONAL PROBE - T. ONO, X. LI, D. LEE,
H. MIYASHITA, AND M. ESASHI, TOHOKU U., SENDAI, JAPAN P. 1062 3C1.04
FABRICATION AND PROPERTIES OF ULTRA SMALL SI WIRE ARRAYS BY
VAPOR-LIQUID-SOLID GROWTH WITH CIRCUITS - T. KAWANO, Y. KATO, M.
FUTAGAWA, H. TAKAO, K. SAWADA, AND M. ISHIDA, TOYOHASHI U. TECH.,
TOYOHASHI, JAPAN P. 1066 3C1.05P FORMATION OF ULTRA-SHALLOW P + /N
JUNCTIONS USING BF 2 IMPLANTATION FOR THE FABRICATION OF IMPROVED
PIEZORESISTIVE CANTILEVERS - E. COCHETEAU, C. BERGAUD, L BARY, AND R.
PLANA, LAAS/CNRS, TOULOUSE, FRANCE, B. BELIER, U. PARIS-SUD, ORSAY,
FRANCE P. 1070 3C1.06P CMOS 10-CANTILEVER ARRAY FOR CONSTANT-FORCE
PARALLEL SCANNING AFM - D. LANGE, M. ZIMMERMANN, C. HAGLEITNER, 0.
BRAND, AND H. BALTES, ETH ZURICH, ZURICH, SWITZERLAND P. 1074 3C1.07P ON
A MEMS-BASED PARAMETRICALLY AMPLIFIED ATOMIC FORCE SENSOR - M. WOLFSON,
CORNELL U., ITHACA, NY, USA, N. MACDONALD, U. CALIFORNIA, SANTA BARBARA,
CA, USA P. 1078 3C1.08P A LONGITUDINALLY VIBRATING TOUCH PROBE SENSOR
USING PZTTHIN FILM VIBRATOR - T. KANDA AND T. HIGUCHI, U. TOKYO, TOKYO,
JAPAN, M. KUROSAWA, TOKYO INST. TECH., TOKYO, JAPAN P. 1082 3C1.09P
FABRICATION OF A NANONEEDLE ARRAY - H. NEVES, R. GOLDSMITH, A. DEGOLYER,
G. BACHAND. J. SCHMIDT, AND C. MONTEMAGNO, CORNELL U., ITHACA, NY, USA
P. 1086 3C1.10P FABRICATION OF VARIOUS SHAPES NANO STRUCTURE USING SI
ANISOTROPIC ETCHING AND SILICIDATION - K. KAKUSHIMA, M. MITA, Y. MITA,
AND H. FUJITA, U. TOKYO, TOKYO, JAPAN, G. HASHIGUCHI, KAGAWA U., JAPAN
P. 1090 3D1 MICROFLUIDICS - BIO I WEDNESDAY, JUNE 13, 2001 (8:30 A.M. -
10:00 A.M.) 3D1.01 DISPOSABLE PLASTIC MICROFLUIDIC ARRAYS FOR
APPLICATIONS IN BIOTECHNOLOGY - T. BOONE, Z. FAN, I. GIBBONS, A. RICCO ,
A. SASSI, S. SINGH, D. SLOMSKI, H. TAN, S. WILLIAMS, V. XIAO, AND Q.
XUE, ACLARA BIOSCI. INC., MOUNTAIN VIEW, CA, USA P. 1146 3D1.02 DROPLET
MANIPULATION ON A SUPERHYDROPHOBIC SURFACE FOR MICROCHEMICAL ANALYSIS -
A. TORKKELI, A. HAARA AND J. SAARILAHTI, VTT ELECTRONICS, FINLAND, H.
HARMA AND T. SOUKKA, U. TURKU, TURKU, FINLAND, P. TOLONEN, WALLAC OY,
TURKU, FINLAND P. 1150 3D1.03 HYDRODYNAMIC ADDRESSING; A FLOW CELL FOR
IMPROVED SIGNAL QUALITY IN BIOANALYTICAL SYSTEMS - M. TIDARE AND H.
ROOS, BIACORE AB, UPPSALA, SWEDEN, U. LINDBERG, UPPSALA U., UPPSALA,
SWEDEN P. 1154 3D1.04 MICROFLUIDIC CHIPS WITH MXN CONTINUOUS SAMPLE
INTRODUCTION FUNCTION USING HYDRODYNAMIC FLOW SWITCHING - G. LEE, B.
HWEI, AND G. HUANG, NAT. CHENG KUNG U., TAINAN, TAIWAN P. 1158 3D1.05P
PMMA (POLY-METHYLMETHACRYLATE) MICROCHIPS FOR ON-LINE DNA
PRECONCENTRATION AND ELECTROPHORESIS - Y. LIN, H. HO, AND S. HOU, NAT.
CHENG KUNG U., TAINAN, TAIWAN, C. WU, ITRI, HSINCHU, TAIWAN P. 1162
3D1.06P GLASS-SILICON BONDING TECHNOLOGY WITH FEED- THROUGH ELECTRODES
FOR MICRO CAPILLARY ELECTROPHORESIS - Y. CHAN, R. LENIGK, M. CARLES, N.
SUCHER, M. WONG, AND Y. ZOHAR, HONG KONG U. SCI. TECH., HONG KONG P.
1166 3D1.07P POLYCARBONATE-BASED CAPILLARY ELECTROPHORESIS DEVICES FOR
DNA ANALYSIS - Y. LIU, D. GANSER, A. SCHNEIDER, R. LIU, J. BLACKWELL, D.
FAYDEN, D. WESTON, D. RHINE, T. SMEKAL, AND P. GRODZINSKI, MOTOROLA
INC., TEMPE, AZ, USA P. 1170 3D1.08P HIGH ASPECT RATIO QUARTZ CHANNELS
FOR CAPILLARY ELECTROPHORESIS - L CERIOTTI, E. VERPOORTE, AND N. DE
ROOIJ, U. NEUCHATEL, NEUCHATEL, SWITZERLAND, K. WEIBLE, WEIBLE OPTECH,
NEUEHATEL, SWITZERLAND P. 1174 3D1.09P EXPERIMENTAL VERIFICATION OF AN
IMPROVED METHOD FOR CONDUCTIVITY DETECTION IN ON-CHIP CAPILLARY
ELECTROPHORESIS SYSTEMS - F. LAUGERE, A. BERTHOLD, G. LUBKING, J.
BASTEMEIJER, R. GUIJT, E. BALTUSSEN, P. SARRO, AND M. VELLEKOOP, DELFT
U. TECH., DELFT, THE NETHERLANDS P. 1178 3D1.10P SI BASED THIN-FILM
FILTER WITH HIGH VISIBLE- OVER-UV SELECTIVITY FOR BIOCHEMICAL
FLUORESCENSE ANALYSIS - V. LORDANOV, G. LUBKING, R. ISHIHARA, R.
WOLFFENBUTTEL, P. SARRO, AND M. VELLEKOOP, DELFT U. TECH., DELFT, THE
NETHERLANDS P. 1182 3D1.11P A CHEMILUMINESCENCE-BASED MULTI-SENSOR
SYSTEM FOR THE ANALYTICAL DETECTION OF GASES - S. TERAKADO, K.
NAMIKOSHI, T. MARUYAMA, T. OKABAYASHI, I. YAMAMOTO, K. UTSUNOMIYA, N.
YAMASHITA, AND M. NAKAGAWA, OKAYAMA U. SCI., OKAYAMA, JAPAN P. 1186
3D1.12P ON-CHIP IMPEDANCE-SPECTROSCOPY FOR FLOW- CYTOMETRY USING A
DIFFERENTIAL ELECTRODE SENSOR - S. GAWAD, M. WIITHRICH, AND P. RENAUD,
SWISS FED. INST. TECH., LAUSANNE, SWITZERLAND, L SCHILD, U. LAUSANNE,
LAUSANNE, SWITZERLAND, 0. DUBOCHET, LEISTER PROCESS TECH., SAMEN,
SWITZERLAND P. 1190 3D1.13P MULTI-INLET CHIP FOR ELECTROKINETIC IMMUNO-
METRIC HETEROGENEOUS IMMUNOASSAY - A. DODGE, X. WANG, E. VERPOORTE, AND
N. DE ROOIJ, U. NEUCHATEL, NEUCHATEL, SWITZERLAND P. 1194 3D1.14P A
DURABLE SENSOR FOR BLOOD CELL COUNTER USING MEMS TECHNOLOGY - D. SATAKE,
H. EBI, N. OKU, AND K. MATSUDA, HORIBA LTD., KYOTO, JAPAN, H. TAKAO, M.
ASHIKI, AND M. ISHIDA, TOYOHASHI U. TECH., TOYOHASHI, JAPAN P. 1198
3D1.15P MANUFACTURING AND INTEGRATION OF DIFFRACTIVE OPTICAL ELEMENTS
WITH MICROFLUIDIC CD DEVICES - F. NIKOLAJEFF, 0. LARSSON, AND 0. OHMAN,
AMICAB, UPPSALA, SWEDEN, P. ANDERSSON, GYROS AB, UPPSALA, SWEDEN P. 1202
3D1.16P CHARACTERIZATION OF A MIXING LAYER MICRO- DEVICE - S. LEE, M.
WONG, AND Y. ZOHAR, HONG KONG U. SCI. TECH., HONG KONG P. 1206 3D1.17P
FABRICATION OF FLEXIBLE, IMPLANTABLE MICRO- ELECTRODES WITH EMBEDDED
FLUIDIC MICROCHANNELS - S. METZ, R. HOLZER, AND P. RENAUD, SWISS FED.
INST. TECH., LAUSANNE, SWITZERLAND P. 1210 3D1.18P MICROFLUIDIC
BIOANALYSIS CARTRIDGE WITH INTERCHANGEABLE MICROCHANNEL SEPARATION
COMPONENTS - M. TAYLOR, F. RAISI, P. BELGRADER, F. POURAHMADI, A. HERR,
G. KINTZ, AND M. NORTHRUP, CEPHEID, SUNNYVALE, CA, USA P. 1214 3D1.19P
UNIVERSAL INTEGRATED DIAGNOSTIC SAMPLE PREPARATION FOR RAPID
QUANTITATIVE AND QUALITATIVE NUCLEIC ACID ANALYSIS - R. BUSER AND D.
BUEHEL, NTB U. APPL. SCI., BUCHS, SWITZERLAND, D. BACHI, ETH ZURICH,
ZURICH, SWITZERLAND, P. DAY, CHILDREN S HOSPITAL, ZURICH, SWITZERLAND P.
1218 3A2 MICROPUMPS FT MICROVALVES WEDNESDAY, JUNE 13, 2001 (10:20 A.M.
- 12:00 P.M.) 3A2.O1 THE OPTIMIZED SMA MICRO PUMP CHIP APPLICABLE TO
LIQUIDS AND GASES - K. IKUTA, T. HASEGAWA, AND T. ADACHI, NAGOYA U.,
NAGOYA, JAPAN P. 916 3A2.02 A MICROMACHINED SILICON LOW-VOLTAGE
PARALLEL- PLATE ELECTROKINETIC PUMP - D. LASER, S. YAO, C. CHEN, J.
MIKKELSEN JR., K. GOODSON, J. SANTIAGO, AND I KENNY, STANFORD U.,
STANFORD, CA, USA P. 920 3A2.03 PNEUMATIC SILICON MICROVALVES WITH
PIEZO- ELECTRIC ACTUATION - S. KLUGE, G. NEUMAYER, U. SCHABER, AND M.
WACKERLE, FRAUNHOFER IMS, MUNICH, GERMANY, M. MAICHL, P. POST, AND M.
WEINMANN, FESTO AG, ESSLINGEN, GERMANY, R. WANNER, BEURER GMBH, ULM,
GERMANY P. 924 3A2.04 ELECTROSTATIC MICROVALVES IN SILICON WITH 2-WAY-
FUNCTION FOR INDUSTRIAL APPLICATIONS - J. SCHAIBLE, R. ZENGERLE*, H.
SANDMAIER**, T. STROBELT, HSG-IMIT, VILLINGEN-SCHWENNINGEN, GERMANY, J.
VOLLMER, HOERBIGER ORIGA, SCHONGAU, GERMANY, (* AND U. FREIBURG,
FREIBURG, GERMANY), (** AND U. STUTTGART, STUTTGARD, GERMANY) P. 928
3A2.05 MICRO FLOW SWITCHES USING THERMAL GELATION OF METHYL CELLULOSE
FOR BIOMOLECULES HANDLING - K. TASHIRO, S. IKEDA, I SEKIGUCHI, H. SATO,
S. SHOJI, H. MAKAZU, K. WATANABE, AND T. FUNATSU, WASEDA U., TOKYO,
JAPAN, S. TSUKITA, KYOTO U., KYOTO, JAPAN P. 932 3A2.06P BATCH
FABRICATION OF SILICON MICROPUMPS - M. RICHTER, J. KRUCKOW, J. WEIDHAAS,
M. WACKERLE, A. DROST, U. SCHABER, M. SCHWAN, AND K. KIIHL, FRAUNHOFER
IMS, MUNICH, GERMANY P. 936 3A2.07P HIGH-SPEED AND BI-STABLE
ELECTROLYSIS- BUBBLE ACTUATED GATE VALVES - A. PAPAVASILIOU, A. PISANO,
AND D. LIEPMANN, U. CALIFORNIA, BERKELEY, CA, USA P. 940 3B2 MATERIALS 2
WEDNESDAY, JUNE 13, 2001 (10:20 A.M. - 12:00 P.M.) 3B2.01 PERFORMANCE
CHARACTERIZATION OF ULTRA-THIN N-TYPE PIEZORESISTIVE CANTILEVERS - Y.
LIANG, S. UENG, AND T. KENNY, STANFORD U., STANFORD, CA, USA P. 998
3B2.02 SINGLE CRYSTALLINE SILICON NANO WIRE PIEZO- RESISTORS FOR
MECHANICAL SENSORS - T. TORIYAMA, Y. TANIMOTO, AND S. SUGIYAMA,
RITSUMEIKAN U., SHIGA, JAPAN P. 1002 3B2.03 THE TEMPERATURE-STABLE
PIEZOELECTRIC MATERIAL GAP0 4 AND ITS SENSOR APPLICATIONS - P. WORSCH,
P. KREMPL, F. KRISPEL, C. REITER, H. THANNER, AND W. WALLNOFER, AVL LIST
GMBH, GRAZ, AUSTRIA P. 1006 3B2.04 THERMOPHYSICAL CHARACTERISATION OF
POLY SI 07 GE 03 FOR USE IN THERMOELECTRIC DEVICES - D. WIJNGAARDS, S.
KONG, P. SARRO, AND R. WOLFFENBUTTEL, DELFT U. TECH., DELFT, THE
NETHERLANDS P. 1010 3B2.05 INVESTIGATION OF 4H-SIC AS A NEW MATERIAL FOR
HALL OR TEMPERATURE SENSORS WORKING UP TO 500 C - J. ROBERT, S.
CONTRERAS, J. CAMASSEL, J. PERNOT, AND E. NEYRET*, U. MONTPELLIER II,
MONTPELLIER, FRANCE, L DI CIOCCIO, T. BILLON, (AND *), CEA/LETI,
GRENOBLE, FRANCE P. 1014 3B2.06P PZTTHIN FILMS FOR PIEZOELECTRIC
MICRO-ACTUATOR APPLICATIONS - H. KUPPERS, T. LEUERER, U. SCHNAKENBERG,
W. MOKWA, M. HOFFMANN, T. SCHNELLER, U. BOTTGER, AND R. WASER, AACHEN U.
TECH., AACHEN, GERMANY P. 1018 3B2.08P HIGH ASPECT RATIO SOFT
MICROMOLDING OF PIEZOCERAMIC THICK FILMS - T. ROSQVIST AND S.JOHANSSON,
UPPSALA U., UPPSALA, SWEDEN P. 1022 3B2.09P PROPERTIES OF 1-3 PZT
COMPOSITE FOR ULTRA- SONIC TRANSDUCER ARRAY FABRICATED BY MICRO-PRESSING
AND DICING METHODS - J. PARK, J. CHO, S. JUNG, AND S. PARK, KOREA ELEC.
TECH. INST, KYUNG-GI, KOREA, S. LEE, D. KIM, AND J. HAN, PROSONIC CO.
LTD., KYONG-BUK, KOREA P. 1026 3C2 MEMS RESONATORS WEDNESDAY, JUNE 13,
2001 (10:20 A.M. - 12:00 P.M.) 3C2.01 A 10-MHZ MICROMECHANICAL RESONATOR
PIERCE REFERENCE OSCILLATOR FOR COMMUNICATIONS - S. LEE, M. DEMIRCI, AND
C. NGUYEN, U. MICHIGAN, ANN ARBOR, ML, USA P. 1094 3C2.02 HIGH Q
ACHIEVED IN MICROWAVE INDUCTORS FABRICATED BY PARALLEL SELF-ASSEMBLY -
G. DAHLMANN AND E. YEATMAN, IMPERIAL COLLEGE, LONDON, UK, P. YOUNG, I.
ROBERTSON, AND S. LUCYSZYN, U. SURREY, GUILDFORD, UK P. 1098 3C2.03 14
MHZ MICROMECHANICAL OSCILLATOR - T. MATTILA, 0. JAAKKOLA, J. KIIHAMAKI,
J. KARTTUNEN, A. OJA, H. SEPPA, AND H. KATTELUS, VTT, FINLAND, T.
LAMMINMAKI, P. RANTAKARI, AND I. TITTONEN, HELSINKI U. TECH., HELSINKI,
FINLAND P. 1102 3C2.04 MUCH ENLARGED RESONANT AMPLITUDE OF MICRO-
RESONATOR WITH TWO-DEGREEE-OF-FREEDOM (2-DOF) MECHANICAL COUPLING SCHEME
- X. LI*, T. ONO, AND M. ESASHI, TOHOKU U., SENDAI, JAPAN, R. LIN,
NANYANG TECH. U., SINGAPORE, (* AND CHINESE ACAD. SCI., SHANGHAI, CHINA)
P. 1106 3C2.05 Q-OPTIMIZED LATERAL FREE-FREE BEAM MICRO- MECHANICAL
RESONATORS - W. HSU, J. CLARK, AND C. NGUYEN, U. MICHIGAN, ANN ARBOR,
ML, USA P. 1110 3C2.06P EMBEDDED SOLENOID INDUCTORS FOR RF CMOS POWER
AMPLIFIERS - Y. YOON, E. CHEN, M. ALLEN, AND J. LASKAR, GEORGIA TECH.,
ATLANTA, GA, USA P. 1114 3C2.07P MEASUREMENT TECHNIQUES FOR
CAPACITIVELY- TRANSDUCED VHF-TO-UHF MICROMECHANICAL RESONATORS - J.
CLARK, W. HSU, AND C. NGUYEN, U. MICHIGAN, ANN ARBOR, ML, USA P. 1118
3D2 POLYMER-BASED MICROSYSTEMS | WEDNESDAY, JUNE 13, 2001 (10:20 A.M. -
12:00 P.M.) 3D2.01 A FOLDABLE ARTIFICIAL LENS WITH AN INTEGRATED
TRANSPONDER SYSTEM FOR MEASURING INTRAOCULAR PRESSURE - S. ULLERICH, W.
MOKWA*, AND U. SCHNAKENBERG, AACHEN U. TECH., AACHEN, GERMANY, G. VOM
BOGEL (AND *), FRAUNHOFER IMS, DUISBURG, GERMANY P. 1224 3D2.02 DESIGN
OF A SELF-CONTAINED 3D MICROVALVE IN PDMS- V. NAMASIVAYAM, U. MICHIGAN,
ANN ARBOR, ML, USA, R. LIU, AND P. GRODZINSKI, MOTOROLA PSRL, TEMPE, AZ,
USA, B. TOWE, ARIZONA STATE U., TEMPE, AZ, USA P. 1228 3D2.03 NOVEL
LIQUID INJECTION METHOD WITH WEDGE- SHAPED MICROCHANNEL ON A PDMS
MICROCHIP SYSTEM FOR DIAGNOSTIC ANALYSES - R. AOYAMA, M. SEKI, J. HONG,
AND T. FUJII, U. TOKYO, TOKYO, JAPAN, I. ENDO, INST. PHYS. CHEM. RES.,
SAITAMA, JAPAN P. 1232 D2.04 MODULAR BIOSYSTEM FOR THE CULTURE AND
CHARACTERISATION OF SCARCE EPITHELIAL CELL TISSUES - S. HEDIGER, G.
CHAMBON, A. SAYAH, AND M. GIJS, SWISS FED. INST. TECH., LAUSANNE,
SWITZERLAND, W. HUNZIKER, U. LAUSANNE, LAUSANNE, SWITZERLAND P. 1236
3D2.05 A NEW FIXED-VOLUME METERING MICRO- DISPENSER MODULE BASED ON
SPROMS TECHNOLOGY - A. PUNTAMBEKAR, H. CHO, C. HONG, J. CHOI, AND C.
ANN, U. CINCINNATI, CINCINNATI, OH, USA, S. KIM, AND V. MAKHIJANI, CFD
RES. CORP., HUNTSVILLE, AL, USA P. 1240 3A3 MICROFLUIDICS - SYSTEMS
WEDNESDAY, JUNE 13, 2001 (1:30 P.M. - 3:10 P.M.) 3A3.01 A
PNEUMATICALLY-ACTUATED SILICON MICROVALVE AND ITS APPLICATION TO
FUNCTIONAL FLUIDIC INTEGRATED CIRCUITS - H. TAKAO, M. ISHIDA, AND K.
SAWADA, TOYOHASHI U. TECH., TOYOHASHI, JAPAN P. 946 3A3.02
CHARACTERIZATION OF A MICRO-MIXING, PUMPING, AND VALVING SYSTEM - A.
DESHMUKH, D. LIEPMANN, AND A. PISANO, U. CALIFORNIA, BERKELEY, CA, USA
P. 950 3A3.03 SMART PASSIVE MICROFLUIDIC SYSTEMS BASED ON FERROFLUIDS
FOR UTAS APPLICATIONS - R. PEREZ-CASTILLEJOS, J. ESTEVE, AND M. ACERO,
CSIC, BARCELONA, SPAIN, A. MENZ, IMSAS, BREMEN, GERMANY, K. KRIZ, LUND
U., LUND, SWEDEN P. 954 . 3A3.04 A FREQUENCY ADDRESSABLE ULTRASONIC
MICROFLUIDIC ACTUATOR ARRAY - V. KAAJAKARI, A. SATHAYE, AND A. LAI, U.
WISCONSIN, MADISON, WL, USA P. 958 3A3.05 STAINLESS STEEL-BASED
INTEGRATED MASS-FLOW CONTROLLER FOR REACTIVE AND CORROSIVE GASES - K.
HIRATA, D. SIM, AND M. ESASHI, TOHOKU U., SENDAI, JAPAN P. 962 3A3.06P
THERMAL BUBBLE POWERED MICROFLUIDIC MIXER WITH GAS BUBBLE FILTER - J.
TSAI, U. MICHIGAN, ANN ARBOR, ML, USA, L LIN, U. CALIFORNIA, BERKELEY,
CA, USA P. 966 3A3.07P A PORTABLE DRUG DELIVERY SYSTEM WITH SILICON
CAPILLARIES AS KEY COMPONENTS - M. RIEHTER, A. LEUKERT, U. SCHABER, AND
M. WACKERLE, FRAUNHOFER IMS, MUNICH, GERMANY, N. LUTTER AND E. KOZMA, U.
ERLANGEN-NUREMBERG, GERMANY, K. NEUDER, LRE TECH. GMBH, MUNICH, GERMANY
P. 970 3A3.08P DEVELOPMENT OF A HIGH DENSITY, PLANAR, MODULAR
MICROFLUIDIC INTERCONNECT SYSTEM - R. DARLING, U. WASHINGTON, SEATTLE,
WA, USA P. 974 3B3 SURFACE MODIFICATION WEDNESDAY, JUNE 13, 2001 (1:30
P.M. - 3:10 P.M.) 3B3.01 LOW FORCE ELECTRICAL CONTACT MEASUREMENTS USING
PIEZORESISTIVE MEMS CANTILEVERS TO CHARACTERIZE THIN-FILM METALLIZATION
- B. PRUITT, D. CHOI, J. FLORANDO, W. NIX, AND T. KENNY, STANFORD U.,
STANFORD, CA, USA, R. MARTENS, S. WENZEL, AND C. REYNOLDS, FORMFACTOR
INC., USA P. 1032 3B3.02 ANALYSIS AND EXPERIMENTS FOR EVALUATING
ADHESION OF ARBITRARY SHAPE MICROSTRUCTURES USING OPTIMIZATION METHOD -
S. TEZUKA, S. KATO, T. WATANABE, AND H. IWAOKA, YOKOGAWA ELEC. CORP.,
NAGANO, JAPAN P. 1036 3B3.03 CONTROLLED PART-TO-SUBSTRATE MICRO-ASSEMBLY
VIA ELECTROCHEMICAL MODULATION OF SURFACE ENERGY - X. XIONG, Y. HANEIN,
W. WANG, D. SCHWARTZ, AND K. BOHRINGER, U. WASHINGTON, SEATTLE, WA, USA
P. 1040 3B3.04 ULTRAHYDROPHOBIC SURFACE SELECTIVELY MODIFIED BY PULSE
ELECTRODEPOSITION FROM AQUEOUS DISPERSION OF PTFE PARTICLES - T. ABE AND
M. ESASHI, TOHOKU U., SENDAI, JAPAN P. 1044 3B3.05 CONFORMAL COATING
PROCESS OF ANTI-STICKING THIN FILM USING C 4 F 8 AND AR PLASMA WITHOUT
ADDITIONAL EQUIPMENT - C. CHO, W. KIM, AND H. SHIN, SAMSUNG ELEC. CO.,
SUWON, KOREA P. 1048 3C3 HIGH ASPECT RATIO MEMS WEDNESDAY, JUNE 13, 2001
(1:30 P.M. - 3:10 P.M.) 3C3.01 HONEYCOMB-SHAPED DEEP-TRENCH OXIDE POSTS
COMBINED WITH THE SBM TECHNOLOGY FOR MICROMACHINING SINGLE-CRYSTAL
SILICON WITHOUT USING SOI - S. LEE, S. PARK, AND D. CHO, SEOUL NAT. U.,
SEOUL, KOREA P. 1124 3C3.02 A NOVEL HIGH ASPECT RATIO TECHNOLOGY FOR
MEMS FABRICATION USING STANDARD SILICON WAFERS - A. BERTZ, R. KNOFLER,
AND I GESSNER*, CHEMNITZ U. TECH., CHEMNITZ, GERMANY, M. KUCHLER, AND
(*), FRAUNHOFER IZM, CHEMNITZ, GERMANY P. 1128 3C3.03 PILLAR STRUCTURES
WITH THE SPACE OF SUB-MICRONS FABRICATED BY THE MACROPOROUS BASED
MICROMACHINING - H. OHJI, S. IZUO, AND K. TSUTSUMI, MITSUBISHI ELEC.
CORP., HYOGO, JAPAN, P. FRENCH, DELFT TECH. U., DELFT, THE NETHERLANDS
P. 1132 3C3.04 EXTENSION OF SURFACE/BULK MICROMACHINING: ONE-MASK
FABRICATION TECHNOLOGY ENABLING THE INTE- GRATION OF 6-DOF INERTIAL
SENSORS ON A SINGLE WAFER - S. LEE, B. LEE, K. JUNG, J. CHOI, T. CHUNG,
AND Y. CHO, SAMSUNG ADV. INST. TECH., SUWON, KOREA P. 1136 3C3.05
THREE-DIMENSIONAL MICROMACHINING OF SILICON NITRIDE FOR POWER
MICROELECTROMECHANICAL SYSTEMS - S. SUGIMOTO, S. TANAKA, J. LI, T.
GENDA, R. WATANABE, AND M. ESASHI, TOHOKU U., SENDAI, JAPAN P. 1140 3D3
ELECTROCHEMICAL SENSORS WEDNESDAY, JUNE 13, 2001 (1:30 P.M. - 3:10 P.M.)
3D3.01 IMPROVED RECOVERY TIME FOR ISFET GLUCOSE SENSOR - K. PARK, Y.
LEE, M. LEE, S. CHOI, AND B. SOHN, KYUNGPOOK NAT. U., TAEGU, KOREA P.
1246 3D3.02 A SIMPLE PH DETECTOR BASED ON AN ORGANIC FIELD-EFFECT
TRANSISTOR - C. BARTIC, A. CAMPITELLI, AND S. BORGHS, IMEC, LEUVEN,
BELGIUM, B. PALAN, CZECH TECH. U., PRAGUE, CZECH REPUBLIC P. 1250 3D3.03
SINGLE DROP ACID-RAIN ANALYSIS USING MICRO- SENSORS - S. WAKIDA, M.
YAMANE, Y. TSUJIMURA, AND X. WU, NAT. INST. ADV. IND. SCI. TECH., OSAKA,
JAPAN, J. LIU, BEIJING U. AERO. ASTRO., BEIJING, CHINA P. 1254 3D3.04
STUDY OF GAS LONIZATION FOR MICRO-DEVICES - R. LONGWITZ, H. VAN LINTEL,
P. RENAUD, AND C. HOLLENSTEIN, SWISS FED. INST. TECH., LAUSANNE,
SWITZERLAND, R. CARR, SLAC, STANFORD, CA, USA P. 1258 3D3.05 THERMOLYSIN
AS A RECOGNITION ELEMENT FOR MICRODETERMINATION OF ZINC(LL) IONS BASED
ON THE APOENZYME REACTIVATION METHODS - I. SATOH, T. ISHIGAMI, S.
OYANAGI, AND Y. LIDA, KANAGAWA INST. TECH., ATSUGI, JAPAN P. 1262 4A1
COMMERCIALIZATION THURSDAY, JUNE 14, 2001 (8:30 A.M. - 10:00 A.M.)
4A1.01 INCREASING PROBABILITY OF A SUCCESS FOR HIGH-TECH STARTUP
COMPANIES - J. BRYZEK , TRANSPARENT NETWORKS INC., SANTA CLARA, CA, USA
P. 1268 4A1.02 COMPETITIVE POSITION OF THE MICRO SYSTEM TECHNOLOGIES FOR
WAVELENGTH HANDLING IN ALL-OPTICAL NETWORKS FOR TELECOM - E. MOUNIER AND
J. ELOY, YOLE DEV., LYON, FRANCE P. 1276 4A1.03 DEVELOPMENT OF
MICRO-MACHINED THREE-AXIS SENSORS IN VENTURE BUSINESS - K. OKADA, N.
TANIGUCHI, S. TAKAGI, AND H. ITANO, WAC0H CORP., SAITAMA, JAPAN P. 1280
4A1.04 MEMS COMMERCIALIZATION: SLOW BUT STEADY - R. PAYNE, ANDOVER, MA,
USA P. 1284 4B1 MATERIALS CHARACTERIZATION THURSDAY, JUNE 14, 2001 (8:30
A.M. - 10:00 A.M.) 4B1.01 FRICTION AND WEAR PROPERTIES OF MICRO-
STRUCTURES IN MEMS - W. WANG , Y. WANG, H. BAO, AND B. XIONG, CHINESE
ACAD. SCI., SHANGHAI, CHINA, M. BAO, FUDAN U., SHANGHAI, CHINA P. 1354
4B1.02 ELECTRONIC TRANSPORT MECHANISMS IN W0 3 -BASED ULTRA-THIN FILM
CHEMIRESISTIVE SENSORS - S. MOULZOLF AND R. LAD, U. MAINE, ORONO, ME,
USA P. 1358 4B1.03 FAST THERMAL CHARACTERIZATION OF NANO-LITER FLUID
VOLUMES - H. ERNST, A. JACHIMOWICZ, B. BIRKENMEIER, B. BOHL, AND G.
URBAN, U. FREIBURG, FREIBURG, GERMANY P. 1362 4B1.04 EFFECT OF
TEMPERATURE ON MECHANICAL PROPERTIES OF POLYSILICON - W. SHARPE JR., M.
EBY, AND G. COLES, JOHNS HOPKINS U., BALTIMORE, MD, USA P. 1366 4B1.05P
THE DESIGN AND ANALYSIS OF SHOCK RESISTANT MICROSYSTEMS (MEMS) - V.
SRIKAR AND S. SENTURIA, MIT, CAMBRIDGE, MA, USA P. 1370 4B1.06P IN-SITU
MECHANICAL CHARACTERIZATION OF A 100 NANOMETER THICK FREE STANDING
ALUMINUM FILM IN TEM USING MEMS FORCE SENSORS - M. HAQUE AND M. SAIF, U.
ILLINOIS, URBANA, IL, USA P. 1374 4B1.07P TENSILE TESTING SYSTEM FOR
SUB-MICROMETER THICK FILMS - I TSUCHIYA*, M. SHIKIDA, AND K. SATO,
NAGOYA U., NAGOYA, JAPAN, (* AND TOYOTA INC., JAPAN) P. 1378 4B1.08P
FABRICATION, TEST AND SIMULATION OF A PARYLENE DIAPHRAGM - W. SIM, B.
KIM, AND J. PARK, KOREAN INST. SCI. TECH., SEOUL, KOREA, D. KIM, AND B.
CHOI, SOGANG U., SEOUL, KOREA, K. KIM, K. KWON, AND S. YANG, AJOU U.,
AJOU, KOREA P. 1382 4B1.09P SILICON, PARYLENE, AND SILICON/PARYLENE
MICRO-NEEDLES FOR STRENGTH AND TOUGHNESS - P. STUPAR AND A. PISANO, U.
CALIFORNIA, BERKELEY, CA, USA P. 1386 4B1.10P UNIAXIAL STRESS EFFECT ON
COPPER ENERGY LEVELS IN SILICON - Y. KANDA, T. MATSUURA, K. MIYAKE, AND
T. KATSUMATA, TOYO U., KAWAGOE, JAPAN, T. YOSHIDA, SHINETSU SEMICON.
CO., GUNMA, JAPAN P. 1390 4B1.11 P FRACTURE PROPERTIES OF LPCVD SILICON
NITRIDE THIN FILMS FROM THE LOAD-DEFLECTION OF LONG MEMBRANES - J.YANG,
C. PETERS, AND 0. PAUL, U. FREIBURG, FREIBURG, GERMANY P. 1394 4B1.12P
TEMPERATURE DEPENDENT THERMAL CONDUC- TIVITIES OF CMOS LAYERS BY
MICROMACHINED THERMAL VAN DER PAUW TEST STRUCTURES - S. HAFIZOVIC AND 0.
PAUL, U. FREIBURG, FREIBURG, GERMANY P. 1398 4B1.13P A STUDY ON
NONLINEAR TORSIONAL CHARACTER- ISTICS OF POLYIMIDE HINGES - H. MIYAJIMA,
T. ARIKAWA, T. HIDAKA, K. TOKUDA, AND K. MATSUMOTO, OLYMPUS OPT. CO.
LTD., TOKYO, JAPAN P. 1402 4B1.14P DIE-LEVEL CHARACTERIZATION OF
BULK-ETCHED MEMS USING RESONANT ULTRASOUND SPECTROSCOPY - H. GUO AND A.
LAI, U. WISCONSIN, MADISON, WL, USA P. 1406 4B1.15P THE SILICON OPTICAL
ABSORPTION COEFFICIENT REVISITED - R. WOLFFENBUTTEL, DELFT U. TECH.,
DELFT, THE NETHERLANDS P. 1410 4B1.16P N-TYPE B-SIC PIEZORESISTANCE
ANALYSIS UNDER HIGH TEMPERATURE AND HIGH IMPURITY CONCENTRATION - I
TORIYAMA, NEW ENERGY IND. TECH. DEV. ORG., TOKYO, JAPAN, S. SUGIYAMA,
RITSUMEIKAN U., SHIGA, JAPAN P. 1414 4B1.17P STRENGTH AND LEAK TESTING
OF PLASMA ACTIVATED BONDED INTERFACES - M. VISSER AND A. HANNEBORG, U.
OSLO, OSLO, NORWAY, S. WEICHEL AND R. DE REUS, ADC DENMARK, FARUM,
DENMARK P. 1418 4B1.18P CHARACTERISTICS OF LOW FORCE CONTACT PROCESS FOR
MEMS PROBE CARDS - T. ITOH, K. KATAOKA, AND T. SUGA, U. TOKYO, TOKYO,
JAPAN P. 1422 4B1.19P ANALYSIS OF ULTRASONIC WIRE BONDING BY IN-SITU
PIEZORESISTIVE MICROSENSORS - J. SCHWIZER, 0. BRAND, AND H. BALTES, ETH
ZURICH, ZURICH, SWITZERLAND, M. MAYER, ESEC CHAM, SWITZERLAND P. 1426
4B1.20P A TACTILE SENSOR INSTANTANEOUSLY EVALUATING FRICTION
COEFFICIENTS - K. NAKAMURA AND H. SHINODA, U. TOKYO, TOKYO, JAPAN P.
1430 4C1 RF MEMS THURSDAY, JUNE 14, 2001 (8:30 A.M. - 10:00 A.M.) 4C1.01
INTEGRATED RF MEMS FOR SINGLE CHIP RADIO - K. GRENIER*, B. BARBER, H.
SAFAR, AND P. GAMMEL SPEAKER , AGERE SYS., MURRAY HILL, NJ, USA, V.
LUBECKE, AND M. ZIERDT, LUCENT TECH., MURRAY HILL, NJ, USA, P. PONS, AND
(*), LAAS-CNRS, TOULOUSE, FRANCE P. 1528 4C1.02 FABRICATION OF A 94 GHZ
LIGA KLYSTRINO - Y. CHENG, SYNCH. RAD. RES. CENT., HSINCHU, TAIWAN, G.
SCHEITRUM, G. CARYOTAKIS, AND A. HASSE, STANFORD LIN. ACE. CEN., MENLO
PARK, CA, USA, L SONG, U. CALIFORNIA, DAVIS, CA, USA, B. ARFIN, ARFIN
ASSOCIAT, SAN CARLOS, CA, USA, B. JAMES, COMM. POW. IND., PALO ALTO, CA,
USA P. 1532 4C1.03 SCALABILITY OF CAPACITIVE RF MEMS SWITCHES - M. ULM,
M. REIMANN, T. WALTER, AND R. MULLER-FIEDLER, ROBERT BOSCH GMBH,
STUTTGARD, GERMANY, E. KASPER, U. STUTTGART, STUTTGARD, GERMANY P. 1536
4C1.04 A 3-VOLTAGE ACTUATED MICROMACHINED RF SWITCH FOR
TELECOMMUNICATIONS APPLICATIONS - J. PARK, K. KANG, N. KANG, Y. KWON,
AND Y. KIM, SEOUL NAT. U., SEOUL, KOREA, C. KIM, AND C. SONG, SAMSUNG
ADV. INST. TECH., KOREA, C. CHEON, U. SEOUL, SEOUL, KOREA P. 1 540
4C1.05P A NOVEL MEMS LC TANK FOR RF VOLTAGE CONTROLLED OSCILLATOR (VCO)
- S. SEOK, C. NAM, W. CHOI, AND K. CHUN, SEOUL NAT. U., SEOUL, KOREA, S.
CHOI, YEUNGNAM U., KYONGBUK, KOREA P. 1544 4C1.06P COPPER INTERCONNECT
LOW-K DIELECTRIC POST- CMOS MICROMACHINING - X. ZHU, S. SANTHANAM, H.
LAKDAWALA, H. LUO, AND G. FEDDER, CARNEGIE MELLON U., PITTSBURGH, PA,
USA P. 1548 4C1.07P A MICROMACHINED MILLIMETER WAVE PHASE SHIFTER USING
SEMI-LUMPED ELEMENTS - J. PARK, H. KIM, K. KANG, Y. KWON, AND Y. KIM,
SEOUL NAT. U., SEOUL, KOREA P. 1552 4C1.08P REDUCING THE EFFECT OF
PARASITIC CAPACITANCE ON MEMS MEASUREMENTS - P. RANTAKARI, M.
KOSKENVUORI, T. LAMMINMAKI, AND I. TITTONEN, HELSINKI U. TECH.,
HELSINKI, FINLAND, J. KIIHAMAKI, VTT, FINLAND P. 1556 4C1.09P
PERFORMANCE AND DYNAMICS OF A RF MEMS SWITCH - F. PLOTZ*, S. MICHAELIS,
G. FATTINGER, AND R. AIGNER, INFINEON TECH. AG, MUNICH, GERMANY, R. NOE,
AND (*), U. PADERBORN, PADERBORN, GERMANY P. 1560 4C1.10P FABRICATION OF
A SOLENOID-TYPE MICROWAVE TRANSFORMER - Y. CHOI, J. YOON, B. KIM, E.
YOON, AND C. HAN, KAIST, DAEJON, KOREA P. 1564 4D1 BIOMIMETIC FT
BIOMEDICAL SYSTEMS THURSDAY, JUNE 14, 2001 (8:30 A.M. - 10:00 A.M.)
4D1.01 BIOMIMETIC SENSING SYSTEMS FOR ACOUSTIC MEASUREMENT AND VISUAL
TRACKING - W. MITSUHASHI , U. ELEETRO.-COMMUN., TOKYO, JAPAN P. 1650
4D1.02 SOUND SOURCE LOCALIZATION SENSOR WITH MIMICKING BARN OWLS - N.
ONO AND S. ANDO, U. TOKYO, TOKYO, JAPAN P. 1654 4D1.03 MULTI-PARAMETER
CATHETER SENSOR SYSTEM WITH INTRAVASCULAR NAVIGATION - D. TANASE, J.
GOOSEN, P. TRIMP, AND P. FRENCH, DELFT U. TECH., DELFT, THE NETHERLANDS
P. 1658 4D1.04 EXPLORING INSECT BIOMECHANICS WITH MICRO- MACHINED FORCE
SENSORS - M. BARTSCH AND T. KENNY, STANFORD U., STANFORD, CA, USA, W.
FEDERLE AND R. FULL, U. CALIFORNIA, BERKELEY, CA, USA P. 1 662 4D1.05P
THE MECHANICAL PROPERTY OF THE COILED AXON OF MEISSNER CORPUSCLES FOR
HUMAN TACTILE SENSING AND ITS APPLICATION TO A BIOMIMETIC TACTILE SENSOR
WITH A HELICAL STRUCTURE - I NARA AND S. ANDO, U. TOKYO, TOKYO, JAPAN P.
1666 4A2 OPTICAL MEMS 1 THURSDAY, JUNE 14, 2001 (10:20 A.M. - 12:00
P.M.) 4A2.01 MICROMIRRORS FOR ADAPTIVE-OPTICS ARRAYS - M. HELMBRECHT, U.
SRINIVASAN, C. REMBE, R. HOWE, AND R. MULLER, U. CALIFORNIA, BERKELEY,
CA, USA P. 1290 4A2.02 DUAL-MODE MICROMIRRORS FOR OPTICAL PHASED ARRAY
APPLICATIONS - U. KRISHNAMOORTHY, K. LI, AND J. HERITAGE, U. CALIFORNIA,
DAVIS, CA, USA, K. YU, D. LEE, AND 0. SOLGAARD, STANFORD U., STANFORD,
CA, USA P. 1294 4A2.03 TORSIONAL MICROMIRRORS WITH LATERAL ACTUATORS -
V. MILANOVIC, ADRIATIC RES. INST., BERKELEY, CA, USA, M. LAST, AND K.
PISTER, U. CALIFORNIA, BERKELEY, CA, USA P. 1298 4A2.04 MICROMACHINED
MULTI-LEVER LINKAGE ANGULAR MOTION AMPLIFIER - H. LIN, M. WU, W. FANG,
AND R. HUANG, NAT. TSING HUA U., HSINCHU, TAIWAN P. 1302 4A2.05
MECHANICAL BEHAVIOR OF A SILICON MICRO-OPICAL ATTENUATOR - K. SUZUKI, T.
MERCIER, T. OGUMA, AND T. SHIBUYA, NEC CORP., IBARAKI, JAPAN P. 1306
4A2.06P HIGH RESOLUTION MICROMACHINED SCANNING MIRROR - H. LIN, H. HU,
W. FANG, AND R. HUANG, NAT. TSING HUA U., HSINCHU, TAIWAN P. 1310
4A2.07P INTEGRATED MICROMACHINED TUNABLE LASERS FOR ALL-OPTICAL NETWORK
APPLICATIONS - X. ZHANG, A. LIU, V. MURUKESHAN, AND F. CHOLLET, NANYANG
TECH. U., SINGAPORE P. 1314 4B2 FLOW FT THERMAL SENSORS THURSDAY, JUNE
14, 2001 (10:20 A.M.- 12:00 P.M.) 4B2.01 SENSITIVE THERMAL FLOW SENSOR
BASED ON A MICROMACHINED TWO-DIMENSIONAL RESISTOR ARRAY - J. VAN BAAR,
R. WIEGERINK, G. KRIJNEN, T. LAMMERINK, AND M. ELWENSPOEK, U. TWENTE,
ENSEHEDE, THE NETHERLANDS P. 1436 4B2.02 A NOVEL MICROMACHINED FLOW
SENSOR USING PERIODIC FLAPPING MOTION OF A PLANAR JET IMPINGING ON A
V-SHAPED PLATE - G. LEE, T. KUO, AND W. WU, NAT. CHENG-KUNG U., TAINAN,
TAIWAN P. 1440 4B2.03 TIME OF FLIGHT MICRO FLOW SENSOR FOR AQUEOUS
FLUIDS USING IN-SITU PRODUCED TRACER - J. WU AND W. SANSEN, K. U.
LEUVEN, HEVERLEE, BELGIUM P. 1444 4B2.04 AC-DRIVEN TEMPERATURE-BALANCE
FLOW SENSOR - T. LAMMERINK, N. TAS, J. VAN HONSCHOTEN, G. KRIJNEN, J.
VAN BAAR, AND M. ELWENSPOEK, U. TWENTE, ENSEHEDE, THE NETHERLANDS P.
1448 4B2.05 A THERMAL FLOW SENSOR FOR COMMON RAIL INJECTION SYSTEMS - U.
SCHMID, G. KROTZ, AND R. HOFFMANN, EADS, DEUTSCHL. GMBH, MUNICH,
GERMANY, D. SCHMITT-LANDSIEDEL, MUNICH U. TECH., MUNICH, GERMANY P. 1452
4B2.06P HIGH RESOLUTION LEVEL SENSORS FOR HARSH ENVIRONMENTS - M.
SESTERHENN, M. SCHMITT, AND H. SANDMAIER*, U. STUTTGART, STUTTGARD,
GERMANY, H. ASHAUER, G. RAFFA, T. STROBELT, AND (*), HSG-IMIT,
VILLINGEN-SCHWENNINGEN, GERMANY P. 1456 4B2.07P A MICROMACHINED
CORIOLIS-FORCE-BASED MASS FLOWMETER FOR DIRECT MASS FLOW AND FLUID
DENSITY MEASUREMENT - Y. ZHANG AND N. NAJAFI, INTEGR. SENS. SYS. INC.,
YPSILANTI, ML, USA, S. TADIGADAPA, PENN U., PA, USA P. 1460 4B2.08P
THERMAL FLOW SENSORS FOR VERY SMALL FLOW RATE - M. ASHAUER, H. SCHOLZ,
R. BRIEGEL, H. SANDMAIER*, AND W. LANG, HSG-IMIT,
VILLINGEN-SCHWENNINGEN, GERMANY, (* AND U. STUTTGART, STUTTGARD,
GERMANY) P. 1464 4B2.09P A NOVEL LOW COST LEAD-FRAME AIR FLOW ANEMOMETER
- M. DOMINGUEZ, F. MASANA, V. JIMENEZ, S. BERMEJO, J. AMIROLA, AND L
CASTAIIER, U. POLITEC. CATALUNA, BARCELONA, SPAIN P. 1468 4B2.10P
LOW-COST FLOW TRANSDUCER FABRICATED WITH THE AMANDA-PROCESS - D.
DITTMANN, R. AHRENS, Z. RUMMLER, K. SCHLOTE-HOLUBEK, AND W. SCHOMBURG,
FZK, KARLSRUHE, GERMANY P. 1472 4B2.11 P A MEMS SURFACE FENCE SENSOR FOR
WALL SHEAR STRESS MEASUREMENT IN TURBULENT FLOW AREAS - T. VON PAPEN, H.
NGO, E. OBERMEIER, M. SCHOBER, S. PIRSKAWETZ, AND H. FERNHOLZ, BERLIN U.
TECH., BERLIN, GERMANY P. 1476 4B2.12P AN ELECTRONICAL CHARACTERISATION
METHOD FOR AN ACOUSTIC AND THERMAL FLOW SENSOR - J. VAN HONSEHOTEN, T.
LAMMERINK, H. DE BREE, G. KRIJNEN, AND M. ELWENSPOEK, U. TWENTE,
ENSEHEDE, THE NETHERLANDS P. 1480 4B2.13P A RESONANT TEMPERATURE SENSOR
BASED ON ELECTRICAL SPRING SOFTENING - W. HSU, J. CLARK, AND C. NGUYEN,
U. MICHIGAN, ANN ARBOR, ML, USA P. 1484 4B2.14P MICROMACHINED
INCLINOMETER WITH HIGH SENSITIVITY AND VERY GOOD STABILITY - S. BILLAT,
H. GLOSEH, M. KUNZE, F. HEDRICH, J. FREEH, J. AUBER, H. SANDMAIER*, AND
W. LANG, HSG-IMIT, VILLINGEN-SCHWEN- NINGEN, GERMANY, (* AND U.
STUTTGART, STUTTGARD, GERMANY) P. 1488 4B2.15P THERMAL AND GAS-SENSING
PROPERTIES OF A MICROMACHINED THERMAL CONDUCTIVITY SENSOR - I. SIMON AND
M. ARNDT, ROBERT BOSCH GMBH, REUTLINGEN, GERMANY P. 1492 4B2.16P THERMAL
PERFORMANCE AND STABILITY OF POLY SI/PT(NI) THIN FILM TEMPERATURE
SENSORS ON GAAS - T. LALINSKY, P. HRKUT, Z. MOZOLOVA, T. KOVACIK, AND A.
KRAJCER, SLOVAK ACAD. SCI., BRATISLAVA, SLOVAK REPUBLIC P. 1496 4B2.17P
TEMPERATURE SENSORS WITH HIGH IRRADIATION RESISTANCE FOR ATOMIC
APPLICATION - Y. SHWARTS, V. SOKOLOV, M. SHWARTS, AND E. VENGER, NAT.
ACAD. SCI. UKRAINE, KIEV, UKRAINE P. 1500 4C2 3D MEMS THURSDAY, JUNE 14,
2001 (10:20 A.M. - 12:00 P.M.) 4C2.01 3D MEMS FABRICATION USING
LOW-TEMPERATURE WAFER BONDING WITH BENZOCYCLOBUTENE (BCB) - I CHOU AND
K. NAJAFI, U. MICHIGAN, ANN ARBOR, ML, USA P. 1570 4C2.02 NOVEL SHAPED
MICROSTRUCTURES PROCESSED BY DEEP X-RAY LITHOGRAPHY - S. SUGIYMA AND H.
UENO, RITSUMEIKAN U., SHIGA, JAPAN P. 1574 4C2.03 DIRECT
MICROFABRICATION USING AN X-RAY MICRO-BEAM - T. KATOH AND Y. ZHANG,
SUMITOMO HEAVY IND. LTD., TOKYO, JAPAN, Y. KAGOSHIMA, Y. TSUSAKA, AND J.
MATSUI, HIMEJI INST. TECH., HYOGO, JAPAN P. 1578 4C2.04 PLASTIC
DEFORMATION MAGNETIC ASSEMBLY (PDMA) OF 3-D MICROSTRUCTURES: TECHNOLOGY
DEVELOPMENT FT APPLICATION - J. ZOU, J. CHEN, AND C. LIU, U. ILLINOIS,
URBANA, IL, USA P. 1582 4C2.05 FABRICATION OF AN ELECTROSTATIC LENS
ARRAY WITH SEPARATE ELECTRODES AND SHIELD MEMBRANES USING UV- LIGA
PROCESS - H. ONO, K. NAGAE, Y. SHIMADA, H. MAEHARA, T. YAGI, M. MURAKI,
AND M. OKUNUKI, CANON INC., KANAGAWA, JAPAN P. 1586 4C2.06P A
3-DIMENSIONAL WAFER-LEVEL STACKING TECHNOLOGY WITH PRECISE VERTICAL
INTERCONNECTIONS TO MEMS APPLICATIONS - K. PARK, K. LEE, T. NAKAMURA, Y.
YAMADA, T. MOROOKA, Y. IGARASHI, H. KURINO, AND M. KOYANAGI, TOHOKU U.,
SENDAI, JAPAN P. 1590 4C2.08P A LOW TEMPERATURE, WAFER LEVEL TRANSFER
INTEGRATION TECHNOLOGY - F. NIKLAUS, P. ENOKSSON, P. GRISS, E.
KALVESTEN, AND G. STEMME, ROYAL INST. TECH., STOCKHOLM, SWEDEN P. 1594
4C2.09P PARALLEL DISCHARGE WITH PARTITIONED ELECTRODE ARRAYS FOR
ACCELERATED BATCH MODE MICRO-EDM - K. TAKAHATA, MATSUSHITA CO. LTD.,
OSAKA, JAPAN, Y. GIANCHANDANI, U. WISCONSIN, MADISON, WL, USA P. 1598
4C2.10P FABRICATION METHOD FOR OUT-OF-PLANE COIL BY SURFACE
MICROMACHINING - M. GEL, S. TAKEUEHI, AND I. SHIMOYAMA, U. TOKYO, TOKYO,
JAPAN P. 1602 4C2.11P DEMONSTRATION OF MICROSCALE HEAT EXCHANGER FOR A
SILICON MICRO GAS TURBINE ENGINE - S. SULLIVAN, X. ZHANG, A. AYON, AND
J. BRISSON, MIT, CAMBRIDGE, MA, USA P. 1606 4C2.12P MAGNETIC FLUX
GENERATOR FOR BALANCED MEMBRANE LOUDSPEAKER - J. REHDER AND P. ROMBACH,
MICROTRONIC A/S, LYNGBY, DENMARK, 0. HANSEN, TECH. U. DENMARK, LYNGBY,
DENMARK P. 1610 4D2 GAS SENSORS 1 THURSDAY, JUNE 14, 2001 (10:20 A.M.-
12:00 P.M.) 4D2.01 WAVELET TRANSFORM AND FUZZY ARTMAP BASED PATTERN
RECOGNITION FOR FAST GAS IDENTIFICATION USING A MICRO-HOTPLATE GAS
SENSOR - E. LLOBET, J. BREZMES, R. LONESCU, X. VILANOVA, AND X CORREIG,
U. ROVIRA I VIRGILI, TARRAGONA, SPAIN, S. AL-KHALIFA, AND J. GARDNER, U.
WARWICK, COVENTRY, UK, N. BARSAN, TUEBINGEN U., TUEBINGEN, GERMANY P.
1672 4D2.02 IMPROVEMENT OF OLFACTORY VIDEO CAMERA - GAS/ODOR FLOW
VISUALIZATION SYSTEM - T. TOKUHIRO, H. ISHIDA, T. NAKAMOTO, AND T.
MORIIZUMI, TOKYO INST. TECH., TOKYO, JAPAN P. 1676 4D2.03 DIFFUSION
EQUATION-BASED STUDY OF THIN FILM SEMICONDUCTOR GAS SENSOR - RESPONSE
TRANSIENT - N. MATSUNAGA, G. SAKAI, K. SHIMANOE, AND N. YAMAZOE, KYUSHU
U., FUKUOKA, JAPAN P. 1680 4D2.04 SELECTIVE AMMONIA EXHAUST GAS SENSOR
FOR AUTOMOTIVE APPLICATIONS - R. MOOS, R. MULLER, AND C. PLOG, DORNIER
GMBH, FRIEDRICHS- HAFEN, GERMANY, A. KNEZEVIC, H. LEYE, AND E. IRION,
TEMIC SENSORSYS., KIRCHHEIM/TEEK, GERMANY, T. BRAUN, K. MARQUARDT, AND
K. BINDER, DAIMLERCHRYSLER AG, STUTTGARD, GERMANY P. 1684 4D2.05
SOI-BASED MICRO-HOTPLATE MICROCALORIMETER GAS SENSOR WITH INTEGRATED
BICMOS TRANSDUCER - J. GARDNER AND J. COVINGTON, U. WARWICK, COVENTRY,
UK, F. UDREA, T. DOGARU, C. LU, AND W. MILNE, CAMBRIDGE U., CAMBRIDGE,
UK P. 1688 4D2.06P SOLID STATE DISSOLVED OXYGEN SENSOR TEST MATRIX USING
A PULSED-PLASMA DEPOSITED PTFE FILM - G. MCLAUGHLIN, K. BRADEN, B.
FRANC, AND G. KOVACS, STANFORD U., STANFORD, CA, USA P. 1692 4D2.07P
HIGHLY SENSITIVE AND SELECTIVE GAS SENSORS USING THE POLYTHIOPHEN
DERIVATIVES CONTROLLED THE TEMPERATURE - Y. SAKURAI AND K. NATSUKAWA,
TECH. RES. INST. OSAKA, OSAKA, JAPAN, H. JUNG, I INOGUCHI, T.
SHIMANOUCHI, M. UMAKOSHI, AND R. KUBOI, OSAKA U., OSAKA, JAPAN P. 1 696
4D2.08P THERMAL OPTIMIZATION OF A NOVEL MICRO GAS SENSOR ARRAY WITH
DIFFERENT OPERATING TEMPERATURES - W. CHUNG, DONGSEO U., PUSAN, KOREA,
J. LIM, AND D. LEE, KYUNGPOOK NAT. U., TAEGU, KOREA P. 1700 4D2.09P A
NEW MICRO SENSOR ARRAY WITH POROUS TIN OXIDE THIN FILMS AND
MICRO-HOTPLATE DANGLED BY WIRES IN AIR - D. LEE, ELEC. TELECOM. RES.
INST., TAEJON, KOREA, C. SHIM, J. LIM, J. HUH, AND D. LEE, KYUNGPOOK
NAT. U., TAEGU, KOREA P. 1704 4D2.10P A NOVEL MICRO GAS SENSOR ARRAY
USING TEMPERATURE GRADIENT ON THE SINGLE GLASS - J. LIM, B. JOO, H.
JUNG, D. LEE, J. HUH, AND D. LEE, KYUNGPOOK NAT. U., TAEGU, KOREA, W.
CHUNG, DONGSEO U., PUSAN, KOREA P. 1708 4D2.11P A DATA ACQUISITION
SYSTEM FOR A HAND-HELD ELECTRONIC NOSE (H?EN) - H. CHUEH, J. HATFIELD,
P. WAREHAM, K. PERSAUD, AND P. PAYNE, UMIST, MANCHESTER, UK P. 1712 4A3
OPTICAL MEMS 2 THURSDAY, JUNE 14, 2001 (1:30 P.M. - 3:10 P.M.) 4A3.01
FABRICATION AND EXPERIMENTS ON ELECTRO- MAGNETIC MICROMIRROR ARRAY WITH
BULK SILICON MIRROR PLATE AND ALUMINUM SPRING - C. JI AND Y. KIM, SEOUL
NAT. U., SEOUL, KOREA P. 1320 4A3.02 OPTICAL SWITCH USING DRAW-BRIDGE
MICRO- MIRROR FOR LARGE ARRAY CROSSCONNECTS - A. LIU, X. ZHANG, AND V.
MURUKESHAN, NANYANG TECH. U., SINGAPORE, Q. ZHANG, Q. ZOU, AND S.
UPPILI, INST. MICROELEC, SINGAPORE P. 1324 4A3.03 A NOVEL OPTICAL
SCANNER WITH INTEGRATED TWO- DIMENSIONAL MAGNETOSTRICTIVE ACTUATION AND
TWO- DIMENSIONAL PIEZORESISTIVE DETECTION - T. BOUROUINA, E. LEBRASSEUR,
G. REYNE, H. FUJITA, AND T. MASUZAWA, U. TOKYO, JAPAN, A. LUDWIG, AND E.
QUANDT, CAESAR, BONN, GERMANY, H. MURO, T. OKI, AND A. ASAOKA, NISSAN
MOTOR CO., YOKOSUKA, JAPAN P. 1328 4A3.04 4X4 MATRIX SWITCH BASED ON
MEMS SWITCHES AND INTEGRATED WAVEGUIDES - L. DELLMANN, W. NOELL, AND N.
DE ROOIJ, U. NEUCHATEL, NEUCHATEL, SWITZERLAND, C. MARXER, SERCALO
MICROTECH. LTD., SCHAAN, LIECHTENSTEIN, K. WEIBLE, WEIBLE OPTECH,
NEUCHATEL, SWITZERLAND, M. HOFFMANN, U. DORTMUND, DORTMUND, GERMANY P.
1332 4A3.05 TECHNOLOGY OF REFLECTIVE MEMBRANES FOR SPATIAL LIGHT
MODULATORS - S. SAKARYA, G. VDOVIN, AND P. SARRO, DELFT U. TECH., DELFT,
THE NETHERLANDS P. 1336 4A3.06P A LATCHING, BISTABLE OPTICAL FIBER
SWITCH COMBINING LIGA TECHNOLOGY WITH MICROMACHINED PERMANENT MAGNETS -
K. FISCHER, B. CHAUDHURI, S. MCNAMARA, H. GUCKEL, Y. GIANCHANDANI, AND
D. NOVOTNY, U. WISCONSIN, MADISON, WL, USA P. 1340 4A3.07P WAVEGUIDING
IN MEMS COMPATIBLE 3-D, SILICON PHOTONIC LATTICES - J. FLEMING AND S.
LIN, SANDIA NAT. LABS, ALBUQUERQUE, NM, USA P. 1344 4A3.08P FOCAL LENGTH
CONTROL BY MICROFABRICATED PLANAR ELECTRODES-BASED LIQUID LENS (UPELL) -
S. KWON AND L LEE, U. CALIFORNIA, BERKELEY, CA, USA P. 1348 4B3 ANALYSIS
OF FLUID-SOLID INTERACTIONS THURSDAY, JUNE 14, 2001 (1:30 P.M. - 3:10
P.M.) 4B3.01 COMPACT SQUEEZED-FILM DAMPING MODEL FOR PERFORATED SURFACE
- T. VEIJOLA, HELSINKI U. TECH., HELSINKI, FINLAND, T. MATTILA, VTT,
FINLAND P. 1506 4B3.02 PLANAR MICRO-FLUIDIC DEVICES FOR CONTROLLED
VORTEX GENERATION - G. LETTIERI, E. VERPOORTE, AND N. DE ROOIJ, U.
NEUCHATEL, NEUCHATEL, SWITZERLAND P. 1510 4B3.03 STUDY OF BOILING
REGIMES AND TRANSIENT SIGNAL MEASUREMENTS IN MICROCHANNELS - L ZHANG, J.
KOO, L JIANG, K. GOODSON, J. SANTIAGO, AND T. KENNY, STANFORD U.,
STANFORD, CA, USA P. 1514 4B3.04 FLUID FILLING INTO MICROFABRICATED
RESERVOIRS - F. TSENG, I. YANG, K. LIN, K. MA, M. LU, AND C. CHIENG,
NAT. TSING-HUA U., HSINCHU, TAIWAN P. 1518 4B3.05 MECHANISTIC MODEL OF
DIFFUSION AND REACTION IN THIN SENSOR LAYERS - THE DIRMAS-MODEL - P.
BOEKER AND 0. WALLENFANG, U. BONN, BONN, GERMANY, G. HOMER, HKR
SENSORSYS., MUNICH, GERMANY P. 1522 4C3 POLYMER MEMS THURSDAY, JUNE 14,
2001 (1:30 P.M. - 3:10 P.M.) 4C3.01 APPLICATION AND INVESTIGATION OF
IN-PLANE COMPLIANT SU8-STRUCTURES FOR MEMS - V. SEIDEMANN, S.
BCITEFISCH, AND S. BIITTGENBACH, TECH. U. BRAUNSCHWEIG, BRAUNSCHWEIG,
GERMANY P. 1616 4C3.02 FABRICATION OF ULTRATHICK MICROMOLDS USING JSR
THB-430N NEGATIV UV PHOTORESIST - F. TSENG AND C. YU, NAT. TSING-HUA U.,
HSINCHU, TAIWAN P. 1620 4C3.03 FABRICATION OF COMPLEX MICRO CHANNEL
SYSTEMS INSIDE OPTICALLY-TRANSPARENT 3D SUBSTRATES BY LASER PROCESSING -
W. LI AND J. QIN, CHINESE U. HONG KONG, HONG KONG, SAR, I MEI, CHINESE
ACAD. SCI., ANHUI, CHINA P. 1624 4C3.04 INNOVATIVE CONCEPT FOR THE
FABRICATION OF MICROMECHANICAL SENSOR AND ACTUATOR DEVICES USING
SELECTIVELY METALLIZED POLYMERS - W. EBERHARDT, I GERHAUSSER, AND M.
GIOUSOUF, HSG-IFZ, STUTTGARD, GERMANY, H. KUEK, R. MOHR, AND D.
WARKENTIN, U. STUTTGART, STUTTGARD, GERMANY P. 1628 4C3.05 PHOTOPLASTIC
SHADOW MASKS FOR RAPID RESISTLESS MULTI-LAYER MICROPATTERNING - G. KIM
AND J. BRUGGER, U. TWENTE, ENSEHEDE, THE NETHERLANDS, B. KIM, U. TOKYO,
TOKYO, JAPAN P. 1632 4C3.06P A NOVEL UV-LIGA PROCESS USING PMER AS A
MOLD MATERIAL FOR OPTICAL SWITCH APPLICATION - K. CHAE*, H. KIM, AND S.
MOON, KOREA INST. SCI. TECH., SEOUL, KOREA, S. HAN, J. PAK, AND (*),
KOREA U., KOREA P. 1636 4C3.07P MICRO PLASTIC EMBOSSING PROCESS:
EXPERIMENTAL AND THEORETICAL CHARACTERIZATIONS - X. SHEN AND L LIN, U.
CALIFORNIA, BERKELEY, CA, USA P. 1640 4C3.08P DERIVATIZATION OF
FLUORINATED POLYMERS AND THEIR POTENTIAL USE FOR THE CONSTRUCTION OF
BIOSENSORS - M. KEUSGEN, J. GLODEK, P. MILKA, AND I. KREST, U. BONN,
BONN, GERMANY P. 1644 4D3 GAS SENSORS 2 THURSDAY, JUNE 14, 2001 (1:30
P.M. - 3:10 P.M.) 4D3.01 SENSING PROPERTIES TO DILUTE CHLORINE GAS OF
INDIUM OXIDE BASED THIN FILM SENSORS PREPARED BY EB EVAPORATION - J.
TAMAKI, C. NARUO, Y. YAMAMOTO, AND M. MATSUOKA, RITSUMEIKAN U., SHIGA,
JAPAN P. 1718 4D3.02 DIFFUSION EQUATION-BASED ANALYSIS OF THIN FILM
SEMICONDUCTOR GAS SENSOR - SENSITIVITY DEPENDENCE ON FILM THICKNESS AND
OPERATING TEMPERATURE - G. SAKAI, N. MATSUNAGA, K. SHIMANOE, AND N.
YAMAZOE, KYUSHU U., FUKUOKA, JAPAN P. 1722 4D3.03 N0 2 AND OZONE
MONITORING IN AN URBAN ATMOS- PHERE USING PD/GE/PD/LNP(P) PSEUDO
SCHOTTKY JUNCTIONS - L TALAZAC, F. BARBARIN, C. VARENNE, AND L MAZET, U.
CLERMONT II, AUBIERE, FRANCE, S. PELLIER, AND C. SOULIER, RESEAU ATMO
AUVERGNE, CLERMONT-FERRAND, FRANCE P. 1726 4D3.04 HIGH-TEMPERATURE NOX
SENSOR BASED ON STABILIZED ZIRCONIA AND ZNFE 2 O 4 ELECTRODE - S.
ZHUIYKOV, M. MUTA, N. YAMAZOE, AND N. MIURA, KYUSHU U., FUKUOKA, JAPAN,
T. ONO, AND A. KUNIMOTO, RIKEN CORP., SAITAMA, JAPAN P. 1730 4D3.05
TRACE BENZENE MONITORING IN THE OUTDOOR AIR: COMPARATIVE RESULTS BETWEEN
MEASUREMENTS CARRIED OUT WITH AN INNOVATIVE APPROACH AND A STD. GC TOOL
- I. ELMI, E. LANZI, AND V. POLUZZI, ARPA, BOLOGNA, ITALY, L DORI, G.
CARDINALI, S. NICOLETTI, S. GUERRI, AND S. ZAMPOLLI, CNR- LAMEL INST,
BOLOGNA, ITALY, A. MASTROGIACOMO, URBINO U., ITALY P. 1734 4D3.06P HIGH
H 2 SENSING PERFORMANCE OF ANODICALLY OXIDIZED TIO 2 FILM CONTACTED WITH
PD - Y. SHIMIZU, N. KUWANO, T. HYODO, AND M. EGASHIRA, NAGASAKI U,
NAGASAKI, JAPAN P. 1738 4D3.07P A SELECTIVE ETHANOL SENSOR DEVICE: TIO 2
AND W/TIO 2 BY A NOVEL SOL-GEL TECHNIQUE - C. GARZELLA, E. COMINI, E.
BONTEMPI, L DEPERO, AND G. SBERVEGLIERI, BRESCIA U., BRESCIA, ITALY, C.
FRIGERI, CNR- MASPEC INST, PARMA, ITALY P. 1742 4D3.08P CLASSIFICATION
OF INDOOR ENVIRONMENTAL GASES USING TEMPERATURE MODULATION OF TWO SN0 2
SENSING FILMS ON A SUBSTRATE - N. CHOI, C. SHIM, K. SONG, D. LEE, J.
HUH, AND D. LEE, KYUNGPOOK NAT. U., TAEGU, KOREA P. 1746 4D3.09P THICK
FILM SENSOR CHIP FOR CO DETECTION IN PULSING MODE: DETECTION MECHANISM,
DESIGN, AND REALIZATION - A. VASILIEV, A. PISLIAKOV, AND A. SOKOLOV, RRC
KURCHATOV INST, MOSCOW, RUSSIA P. 1750 4D3.10P EVALUATION OF ON-LINE HOT
FLUE GAS MEASUREMENTS - L UNEUS, L EKEDAHL, I. LUNDSTROM, AND A. LLOYD
SPETZ, LINKOPING U., LINKOPING, SWEDEN, M. MATTSSON, AND P. LJUNG,
VATTENFALL UTVECKLING AB, ALVKARLEBY, SWEDEN, R. WIGREN, AND P.
MARTENSSON, APPLIEDSENSOR, LINKOPING, SWEDEN P. 1754 4D3.11P INFLUENCE
OF THE GATE MATERIAL AND TEMPERATURE ON THE DIODE PROPERTIES OF SCHOTTKY
DIODES BASED ON SIC IN 0 2 OR CO AMBIENT - S. NAKAGOMI, Y. SANADA, AND
H. SHINOBU, ISHINOMAKI SENSHU U., ISHINOMAKI, JAPAN, L UNEUS, I.
LUNDSTROM, L EKEDAHL, AND A. LLOYD SPETZ, LINKOPING U., LINKOPING,
SWEDEN P. 1758 4D3.12P HYDROCARBON DETECTION USING M0S CAPACITORS IN A
TEMPERATURE-PULSED MODE - P. KREISL, J. SCHALWIG, A. FRIEDBERGER, AND G.
MIILLER, EADS DEUTSCHL. GMBH, MUNICH, GERMANY P. 1762 4D3.13P HIGHLY
SENSITIVE VAPOR SENSOR USING AN INDUCTIVELY COUPLED SURFACE ACOUSTIC
WAVE SENSOR - J. WAGNER, M. VON SCHICKFUS, AND S. HUNKLINGER, U.
HEIDELBERG, HEIDELBERG, GERMANY P. 1766 4D3.14P CHEMICAL SENSOR USING
POLARITY CONTROLLED FRACTAL SURFACE - K. HAYASHI, M. JU, K. HAYAMA, AND
K. TOKO, KYUSHU U., FUKUOKA, JAPAN P. 1770
|
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| spelling | Transducers '01 eurosensors XV digest of technical papers 2 Sessions 3A1 - 4D3, papers 3A1.01 - 4D3.16P the 11th International Conference on Solid State Sensors and Actuators, June 10 - 14, 2001, Munich, Germany. [Ed. Ernst Obermeier] Berlin [u.a.] Springer 2001 S. 881 - 1807 Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Obermeier, Ernst Sonstige oth International Conference on Solid State Sensors and Actuators 11 2001 München Sonstige (DE-588)10023286-3 oth (DE-604)BV013779550 2 GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009420031&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Transducers '01 eurosensors XV digest of technical papers |
| title | Transducers '01 eurosensors XV digest of technical papers |
| title_auth | Transducers '01 eurosensors XV digest of technical papers |
| title_exact_search | Transducers '01 eurosensors XV digest of technical papers |
| title_full | Transducers '01 eurosensors XV digest of technical papers 2 Sessions 3A1 - 4D3, papers 3A1.01 - 4D3.16P the 11th International Conference on Solid State Sensors and Actuators, June 10 - 14, 2001, Munich, Germany. [Ed. Ernst Obermeier] |
| title_fullStr | Transducers '01 eurosensors XV digest of technical papers 2 Sessions 3A1 - 4D3, papers 3A1.01 - 4D3.16P the 11th International Conference on Solid State Sensors and Actuators, June 10 - 14, 2001, Munich, Germany. [Ed. Ernst Obermeier] |
| title_full_unstemmed | Transducers '01 eurosensors XV digest of technical papers 2 Sessions 3A1 - 4D3, papers 3A1.01 - 4D3.16P the 11th International Conference on Solid State Sensors and Actuators, June 10 - 14, 2001, Munich, Germany. [Ed. Ernst Obermeier] |
| title_short | Transducers '01 eurosensors XV |
| title_sort | transducers 01 eurosensors xv digest of technical papers sessions 3a1 4d3 papers 3a1 01 4d3 16p |
| title_sub | digest of technical papers |
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