Thermal stresses:
Gespeichert in:
Hauptverfasser: | , , |
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Format: | Buch |
Sprache: | English |
Veröffentlicht: |
Rochester, NY
Lastran
2000
|
Schlagworte: | |
Beschreibung: | XII, 455 S. graph. Darst. |
ISBN: | 189300001X |
Internformat
MARC
LEADER | 00000nam a2200000 c 4500 | ||
---|---|---|---|
001 | BV013770830 | ||
003 | DE-604 | ||
005 | 20011107 | ||
007 | t| | ||
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020 | |a 189300001X |9 1-893000-01-X | ||
035 | |a (OCoLC)42726179 | ||
035 | |a (DE-599)BVBBV013770830 | ||
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041 | 0 | |a eng | |
049 | |a DE-703 |a DE-83 | ||
050 | 0 | |a TA418.58 | |
082 | 0 | |a 620.1/121 |2 21 | |
084 | |a UF 3200 |0 (DE-625)145573: |2 rvk | ||
100 | 1 | |a Noda, Naotake |e Verfasser |4 aut | |
245 | 1 | 0 | |a Thermal stresses |c Naotake Noda ; Richard B. Hetnarski ; Yoshinobu Tanigawa |
264 | 1 | |a Rochester, NY |b Lastran |c 2000 | |
300 | |a XII, 455 S. |b graph. Darst. | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
650 | 4 | |a Thermal stresses | |
650 | 0 | 7 | |a Wärmespannung |0 (DE-588)4188868-6 |2 gnd |9 rswk-swf |
689 | 0 | 0 | |a Wärmespannung |0 (DE-588)4188868-6 |D s |
689 | 0 | |5 DE-604 | |
700 | 1 | |a Hetnarski, Ryszard B. |d 1928-2024 |e Verfasser |0 (DE-588)127175946 |4 aut | |
700 | 1 | |a Tanigawa, Yoshinobu |e Verfasser |4 aut | |
943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-009412357 |
Datensatz im Suchindex
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---|---|
adam_text | |
any_adam_object | |
author | Noda, Naotake Hetnarski, Ryszard B. 1928-2024 Tanigawa, Yoshinobu |
author_GND | (DE-588)127175946 |
author_facet | Noda, Naotake Hetnarski, Ryszard B. 1928-2024 Tanigawa, Yoshinobu |
author_role | aut aut aut |
author_sort | Noda, Naotake |
author_variant | n n nn r b h rb rbh y t yt |
building | Verbundindex |
bvnumber | BV013770830 |
callnumber-first | T - Technology |
callnumber-label | TA418 |
callnumber-raw | TA418.58 |
callnumber-search | TA418.58 |
callnumber-sort | TA 3418.58 |
callnumber-subject | TA - General and Civil Engineering |
classification_rvk | UF 3200 |
ctrlnum | (OCoLC)42726179 (DE-599)BVBBV013770830 |
dewey-full | 620.1/121 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 620 - Engineering and allied operations |
dewey-raw | 620.1/121 |
dewey-search | 620.1/121 |
dewey-sort | 3620.1 3121 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Physik |
format | Book |
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id | DE-604.BV013770830 |
illustrated | Illustrated |
indexdate | 2025-01-07T19:00:17Z |
institution | BVB |
isbn | 189300001X |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009412357 |
oclc_num | 42726179 |
open_access_boolean | |
owner | DE-703 DE-83 |
owner_facet | DE-703 DE-83 |
physical | XII, 455 S. graph. Darst. |
publishDate | 2000 |
publishDateSearch | 2000 |
publishDateSort | 2000 |
publisher | Lastran |
record_format | marc |
spelling | Noda, Naotake Verfasser aut Thermal stresses Naotake Noda ; Richard B. Hetnarski ; Yoshinobu Tanigawa Rochester, NY Lastran 2000 XII, 455 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Thermal stresses Wärmespannung (DE-588)4188868-6 gnd rswk-swf Wärmespannung (DE-588)4188868-6 s DE-604 Hetnarski, Ryszard B. 1928-2024 Verfasser (DE-588)127175946 aut Tanigawa, Yoshinobu Verfasser aut |
spellingShingle | Noda, Naotake Hetnarski, Ryszard B. 1928-2024 Tanigawa, Yoshinobu Thermal stresses Thermal stresses Wärmespannung (DE-588)4188868-6 gnd |
subject_GND | (DE-588)4188868-6 |
title | Thermal stresses |
title_auth | Thermal stresses |
title_exact_search | Thermal stresses |
title_full | Thermal stresses Naotake Noda ; Richard B. Hetnarski ; Yoshinobu Tanigawa |
title_fullStr | Thermal stresses Naotake Noda ; Richard B. Hetnarski ; Yoshinobu Tanigawa |
title_full_unstemmed | Thermal stresses Naotake Noda ; Richard B. Hetnarski ; Yoshinobu Tanigawa |
title_short | Thermal stresses |
title_sort | thermal stresses |
topic | Thermal stresses Wärmespannung (DE-588)4188868-6 gnd |
topic_facet | Thermal stresses Wärmespannung |
work_keys_str_mv | AT nodanaotake thermalstresses AT hetnarskiryszardb thermalstresses AT tanigawayoshinobu thermalstresses |