Chemical vapor deposition of tungsten and tungsten silicides: for VLSI ULSI applications
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Westwood, NJ
Noyes
1992
|
| Ausgabe: | Reprint ed. |
| Schriftenreihe: | Materials science and process technology series
|
| Schlagworte: | |
| Beschreibung: | XVI, 235 S. Ill., graph. Darst. |
| ISBN: | 0815512880 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV013636080 | ||
| 003 | DE-604 | ||
| 005 | 20010315 | ||
| 007 | t | ||
| 008 | 010315s1992 ad|| |||| 00||| eng d | ||
| 020 | |a 0815512880 |9 0-8155-1288-0 | ||
| 035 | |a (OCoLC)23732152 | ||
| 035 | |a (DE-599)BVBBV013636080 | ||
| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 | ||
| 050 | 0 | |a TK7871.15.T85 | |
| 082 | 0 | |a 621.39/5 |2 20 | |
| 084 | |a UP 7550 |0 (DE-625)146434: |2 rvk | ||
| 100 | 1 | |a Schmitz, John E. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Chemical vapor deposition of tungsten and tungsten silicides |b for VLSI ULSI applications |c by John E. J. Schmitz |
| 250 | |a Reprint ed. | ||
| 264 | 1 | |a Westwood, NJ |b Noyes |c 1992 | |
| 300 | |a XVI, 235 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Materials science and process technology series | |
| 650 | 4 | |a Integrated circuits |x Ultra large scale integration |x Materials | |
| 650 | 4 | |a Integrated circuits |x Very large scale integration |x Materials | |
| 650 | 4 | |a Tungsten | |
| 650 | 4 | |a Vapor-plating | |
| 650 | 0 | 7 | |a CVD-Verfahren |0 (DE-588)4009846-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a VLSI |0 (DE-588)4117388-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wolfram |0 (DE-588)4066862-9 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Wolfram |0 (DE-588)4066862-9 |D s |
| 689 | 0 | 1 | |a CVD-Verfahren |0 (DE-588)4009846-1 |D s |
| 689 | 0 | 2 | |a VLSI |0 (DE-588)4117388-0 |D s |
| 689 | 0 | |5 DE-604 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-009316599 | ||
Datensatz im Suchindex
| _version_ | 1804128445734584320 |
|---|---|
| any_adam_object | |
| author | Schmitz, John E. |
| author_facet | Schmitz, John E. |
| author_role | aut |
| author_sort | Schmitz, John E. |
| author_variant | j e s je jes |
| building | Verbundindex |
| bvnumber | BV013636080 |
| callnumber-first | T - Technology |
| callnumber-label | TK7871 |
| callnumber-raw | TK7871.15.T85 |
| callnumber-search | TK7871.15.T85 |
| callnumber-sort | TK 47871.15 T85 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | UP 7550 |
| ctrlnum | (OCoLC)23732152 (DE-599)BVBBV013636080 |
| dewey-full | 621.39/5 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.39/5 |
| dewey-search | 621.39/5 |
| dewey-sort | 3621.39 15 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | Reprint ed. |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01516nam a2200445 c 4500</leader><controlfield tag="001">BV013636080</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20010315 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">010315s1992 ad|| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0815512880</subfield><subfield code="9">0-8155-1288-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)23732152</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV013636080</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7871.15.T85</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.39/5</subfield><subfield code="2">20</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">UP 7550</subfield><subfield code="0">(DE-625)146434:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Schmitz, John E.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Chemical vapor deposition of tungsten and tungsten silicides</subfield><subfield code="b">for VLSI ULSI applications</subfield><subfield code="c">by John E. J. Schmitz</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">Reprint ed.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Westwood, NJ</subfield><subfield code="b">Noyes</subfield><subfield code="c">1992</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XVI, 235 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Materials science and process technology series</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Ultra large scale integration</subfield><subfield code="x">Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Very large scale integration</subfield><subfield code="x">Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Tungsten</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Vapor-plating</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">CVD-Verfahren</subfield><subfield code="0">(DE-588)4009846-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wolfram</subfield><subfield code="0">(DE-588)4066862-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Wolfram</subfield><subfield code="0">(DE-588)4066862-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">CVD-Verfahren</subfield><subfield code="0">(DE-588)4009846-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-009316599</subfield></datafield></record></collection> |
| id | DE-604.BV013636080 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:49:22Z |
| institution | BVB |
| isbn | 0815512880 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009316599 |
| oclc_num | 23732152 |
| open_access_boolean | |
| owner | DE-703 |
| owner_facet | DE-703 |
| physical | XVI, 235 S. Ill., graph. Darst. |
| publishDate | 1992 |
| publishDateSearch | 1992 |
| publishDateSort | 1992 |
| publisher | Noyes |
| record_format | marc |
| series2 | Materials science and process technology series |
| spelling | Schmitz, John E. Verfasser aut Chemical vapor deposition of tungsten and tungsten silicides for VLSI ULSI applications by John E. J. Schmitz Reprint ed. Westwood, NJ Noyes 1992 XVI, 235 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Materials science and process technology series Integrated circuits Ultra large scale integration Materials Integrated circuits Very large scale integration Materials Tungsten Vapor-plating CVD-Verfahren (DE-588)4009846-1 gnd rswk-swf VLSI (DE-588)4117388-0 gnd rswk-swf Wolfram (DE-588)4066862-9 gnd rswk-swf Wolfram (DE-588)4066862-9 s CVD-Verfahren (DE-588)4009846-1 s VLSI (DE-588)4117388-0 s DE-604 |
| spellingShingle | Schmitz, John E. Chemical vapor deposition of tungsten and tungsten silicides for VLSI ULSI applications Integrated circuits Ultra large scale integration Materials Integrated circuits Very large scale integration Materials Tungsten Vapor-plating CVD-Verfahren (DE-588)4009846-1 gnd VLSI (DE-588)4117388-0 gnd Wolfram (DE-588)4066862-9 gnd |
| subject_GND | (DE-588)4009846-1 (DE-588)4117388-0 (DE-588)4066862-9 |
| title | Chemical vapor deposition of tungsten and tungsten silicides for VLSI ULSI applications |
| title_auth | Chemical vapor deposition of tungsten and tungsten silicides for VLSI ULSI applications |
| title_exact_search | Chemical vapor deposition of tungsten and tungsten silicides for VLSI ULSI applications |
| title_full | Chemical vapor deposition of tungsten and tungsten silicides for VLSI ULSI applications by John E. J. Schmitz |
| title_fullStr | Chemical vapor deposition of tungsten and tungsten silicides for VLSI ULSI applications by John E. J. Schmitz |
| title_full_unstemmed | Chemical vapor deposition of tungsten and tungsten silicides for VLSI ULSI applications by John E. J. Schmitz |
| title_short | Chemical vapor deposition of tungsten and tungsten silicides |
| title_sort | chemical vapor deposition of tungsten and tungsten silicides for vlsi ulsi applications |
| title_sub | for VLSI ULSI applications |
| topic | Integrated circuits Ultra large scale integration Materials Integrated circuits Very large scale integration Materials Tungsten Vapor-plating CVD-Verfahren (DE-588)4009846-1 gnd VLSI (DE-588)4117388-0 gnd Wolfram (DE-588)4066862-9 gnd |
| topic_facet | Integrated circuits Ultra large scale integration Materials Integrated circuits Very large scale integration Materials Tungsten Vapor-plating CVD-Verfahren VLSI Wolfram |
| work_keys_str_mv | AT schmitzjohne chemicalvapordepositionoftungstenandtungstensilicidesforvlsiulsiapplications |