Verfügbarkeit: Micro-system technologies 2001

Micro-system technologies 2001:

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Bibliographische Detailangaben
Format:	Tagungsbericht Buch
Sprache:	English
Veröffentlicht:	Berlin u.a. VDE-Verl. 2001
Schlagworte:	Mikrosystemtechnik - Kongress - Düsseldorf <2001> Mikrosystemtechnik Konferenzschrift > 2001 > Düsseldorf
Online-Zugang:	Inhaltsverzeichnis
Beschreibung:	613 S. Ill., graph. Darst. 1 CD-Rom (12 cm)
Format:	Systemvoraussetzungen der CD-ROM-Beil.:. - für Acrobat Reader 4.0 für Windows
ISBN:	3800726017

Internformat

MARC


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245	1	0	\|a Micro-system technologies 2001 \|c International Conference & Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Düsseldorf, March 27 - 29, 2001. Herbert Reichl (ed.). [Organized by Messe Düsseldorf GmbH ...]
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Datensatz im Suchindex

_version_	1804128444107194368
adam_text	HERBERT REICHL (EDITOR) CRO SYSTE TECHNOLOGIES 2001 INTERNATIONAL CONFERENCE & EXHIBITION ON MICRO ELECTRO, OPTO, MECHANICAL SYSTEMS AND COMPONENTS DIISSELDORF, MARCH 27 - 29, 2001 INCL. CD-ROM ! . .... ** R- I VDE VERLAG * BERLIN * OFFENBACH TABLE OF CONTENTS OPENING PLENARY SESSION CHAIRMAN: HERBERT REICHL, FRAUNHOFER-LNSTITUT FUR ZUVERLASSIGKEIT U. MIKROINTEGRATION IZM, BERLIN, GERMANY SAFETY RELEVANT MICROSYSTEMS FOR AUTOMOTIVE APPLICATIONS 29 HELMUT SEIDEL, TEMIC TELEFUNKEN MIKROELEKTRONIK GMBH, MUNCHEN, GERMANY MATTHIAS AIKELE, TEMIC TELEFUNKEN MIKROELEKTRONIK GMBH, MUNCHEN, GERMANY MATTHIAS ROSE, TEMIC TELEFUNKEN MIKROELEKTRONIK GMBH, MUNCHEN, GERMANY SEBASTIAN TOELG, TEMIC TELEFUNKEN MIKROELEKTRONIK GMBH, MUNCHEN, GERMANY MICROSENSOR PACKAGING 37 OLIVER BRAND, PHYSICAL ELECTRONICS LABORATORY, ETH ZURICH, SWITZERLAND HENRY BALTES, PHYSICAL ELECTRONICS LABORATORY, ETH ZURICH, SWITZERLAND FUEL CELL USING MICRO-STRUCTURED FLOW FIELDS 43 MARKUS MILLLER, INSTITUTE FOR MICROSYSTEM TECHNOLOGY IMTEK, ALBERT-LUDWIGS-UNIVERSITAT, FREIBURG, GERMANY CLAAS MIILLER, INSTITUTE FOR MICROSYSTEM TECHNOLOGY IMTEK, ALBERT-LUDWIGS-UNIVERSITAT, FREIBURG, GERMANY WOLFGANG MENZ, INSTITUTE FOR MICROSYSTEM TECHNOLOGY IMTEK, ALBERT-LUDWIGS-UNIVERSITAT, FREIBURG, GERMANY CHRISTOPHER HEBLING, FRAUNHOFER INSTITUTE FOR SOLAR ENERGY SYSTEMS ISE, FREIBURG, GERMANY ANGELIKA HEINZEL, FRAUNHOFER INSTITUTE FOR SOLAR ENERGY SYSTEMS ISE, FREIBURG, GERMANY FROM MICROSYSTEMS TO BIOSENSORS: THE KEY TO MEDICAL AND CLINICAL DIAGNOSTICS 49 ANDREW CAMPITELLI, IMEC VZW, LEUVEN, BELGIUM CHARACTERIZATION AND TESTING CHAIRMAN: KLAUS D. MULLER-GLASER, UNIVERSITAT KARLSRUHE, GERMANY NEW DIMENSION IN RADIOSCOPIC QUALITY INSPECTION FOR MICROELECTRONICS AND PACKAGING 55 TILO BAUMBACH, FRAUNHOFER INSTITUTE FOR NONDESTRUCTIVE TESTING, DRESDEN, GERMANY LUKAS HELFEN, FRAUNHOFER INSTITUTE FOR NONDESTRUCTIVE TESTING, DRESDEN, GERMANY RANDOLF HANKE, FRAUNHOFER DEVELOPMENT CENTER FOR X-RAY TECHNOLOGY, ERLANGEN/ SAARBRIICKEN, GERMANY 9 A TESTING STAGE FOR THE ASSESSMENT OF ROTATING MICRO ELECTRO-MECHANICAL COMPONENTS 59 GERHARD ABRAHAM, MTE MESSGERATE ENTWICKL.- U. VERTRIEBS GMBH, WIEN, AUSTRIA YANNICK ANSEL, INSTITUT FUR MIKROTECHNIK MAINZ GMBH, MAINZ-HECHTSHEIM, GERMANY ROLAND DUFFAIT, CENTRE DE TRANSFERT DES MICROTECHNIQUES, BESANCON, FRANCE SERGIO MONUX, INSTITUT FUR MIKROTECHNIK MAINZ GMBH, MAINZ-HECHTSHEIM, GERMANY MATTHIAS NIENHAUS, MYMOTORS&ACTUATORS, WENDELSHEIM, GERMANY STEPHAN KLEEN, MYMOTORS&ACTUATORS, WENDELSHEIM, GERMANY PETER WURMSDOBLER, CENTRE DE TRANSFERT DES MICROTECHNIQUES, BESANCON, FRANCE SYMBOLIC ANALYSIS OF ELECTROMAGNETIC INTERFERENCE IN ELECTRONIC CIRCUITS FOR SENSOR APPLICATIONS 65 JURGEN KIRCHHOF, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, PADERBORN, GERMANY WERNER JOHN, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, PADERBORN, GERMANY HERBERT REICHL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY COMPONENT AND SYSTEM DESIGN, RELIABILITY MODELLING CHAIRMAN: WERNER JOHN, FHG-IZM, PADERBORN, GERMANY SIMULATION AND MODELING OF A CHAMBER OF ANALYSIS OF AN IR-GAS SENSOR 71 INGO SIEBER, FORSCHUNGSZENTRUM KARLSRUHE, EGGENSTEIN-LEOPOLDSHAFEN, GERMANY HORST EGGERT, FORSCHUNGSZENTRUM KARLSRUHE, EGGENSTEIN-LEOPOLDSHAFEN, GERMANY KARL-HEINZ SUPHAN, MICROHYBRID, HERMSDORF, GERMANY STEPHAN BECHTOLD, ITEM, UNIVERSITAT BREMEN, GERMANY OPTICAL SURFACE-PROFILING WITH HALF A MILLION MICROMIRRORS 77 FRANK BITTE, FRAUNHOFER INSTITUTE OF PRODUCTION TECHNOLOGY, AACHEN, GERMANY GERD DUSSLER, FRAUNHOFER INSTITUTE OF PRODUCTION TECHNOLOGY, AACHEN, GERMANY TILO PFEIFER, FRAUNHOFER INSTITUTE OF PRODUCTION TECHNOLOGY, AACHEN, GERMANY CO-SIMULATION OF PACKAGING AND MEMS WITHIN A MEMS SYSTEM DESIGN SUITE 83 RIDHA HAMZA, MEMSCAP S.A., SAINT ISMIER, FRANCE MARY-ANN MAHER, MEMSCAP S.A., SAINT ISMIER, FRARTCE MARTA RENCZ, MICRED, BUDAPEST, HUNGARY VLADIMIR SZEKELY, MICRED, BUDAPEST, HUNGARY GER KELLY, NMRC, CORK, IRELAND GEROLD SCHROPFER, SENSONOR, HORTEN, NORWAY BERNARD COURTOIS, TIMA, GRENOBLE, FRANCE MODERN DESIGN TOOLS FOR MICROSYSTEMS - USER NEEDS AND EXAMPLES ... 89 PATRIC SALOMON, MEMSCAP GMBH, BERLIN, GERMANY 10 ADVANCED MST PACKAGING AND INTERCONNECTIONS I CHAIRMEN: ROLF ASCHENBRENNER, FHG-IZM, BERLIN, GERMANY FRANCO A. MORI, MAGNETI MARELLI, ITALY DIODE LASER BAR PACKAGING AND COOLING WITH CVD-DIAMOND 95 DIRK LORENZEN, JENOPTIK LASERDIODE GMBH, JENA, GERMANY SMART OPTICAL INTERCONNECT SOLUTION 101 KARL GERDOM, HARTING KGAA, ESPELKAMP, GERMANY ULRICH WALLENHORST, HARTING KGAA, ESPELKAMP, GERMANY MULTICHIP MODULE WITH FREE-SPACE OPTICAL INTERCONNECTS AND VCSELS BURIED INTO THE SOLDER JOINTS 107 CHRISTIANE GIMKIEWICZ, UNIVERSITAT HAGEN, GERMANY DETLEV HAGEDORN, UNIVERSITAT HAGEN, GERMANY SPIRAL INDUCTORS AND COUPLERS IN THIN FILM 113 JURGEN WOLF, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY J. SCHMIICKLE, FERDINAND-BRAUN-LNSTITUT, BERLIN, GERMANY D. PETTER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY T. KASAP, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY W. HEINRICH, FERDINAND-BRAUN-LNSTITUT, BERLIN, GERMANY H. REICHL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY ADVANCED MST PACKAGING AND INTERCONNECTIONS II CHAIRMEN: ROLF ASCHENBRENNER, FHG-IZM, BERLIN, GERMANY FRANCO A. MORI, MAGNETI MARELLI, ITALY 3D PACKAGING FOR HIGH PERFORMANCE COMPUTING AND MICROSYSTEMS ... 119 CHRISTIAN M. VAL, 3D PLUS, BUC, FRANCE ECO-ANALYSIS OF WAFER LEVEL BUMPING 125 KARSTEN SCHISCHKE, TECHNISCHE UNIVERSITAT BERLIN, GERMANY HANSJORG GRIESE, FRAUNHOFER INSTITUT FUR ZUVERLASSIGKEIT UND MIKROINTEGRATION, BERLIN, GERMANY JUTTA MULLER, FRAUNHOFER INSTITUT FUR ZUVERLASSIGKEIT UND MIKROINTEGRATION, BERLIN, GERMANY 11 INVESTIGATION OF UBM (UNDER BUMP METALLURGY) SYSTEMS FOR ELECTROPLATED SN/37PB AND SN/3.5AG SOLDER BUMPS 131 SE-YOUNG JANG, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, TAEJON, SOUTH KOREA JURGEN WOLF, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY OSWIN EHRMANN, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY HERBERT REICHL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY KYUNG-WOOK PAIK, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, TAEJON, SOUTH KOREA HIGH DENSITY BUMPING FOR ADVANCED PACKAGING - A N INDUSTRIAL VIEW TOM RITZDORF, SEMITOOL, KALISPELL, USA [FOR TECHNICAL REASONS YOU WILL FIND THIS MANUSCRIPT AT THE END OF THE PROCEEDINGS.] MICROFLUIDICAL DEVICES CHAIRMEN: STEFFEN HARDT, IMM - INSTITUT FUR MIKROTECHNIK MAINZ GMBH, GERMANY VOLKER SAILE, FORSCHUNGSZENTRUM KARLSRUHE GMBH, GERMANY SIMULATION OF CAPILLARY DRIVEN FLOWS IN STRUCTURED MICROCHANNELS 137 SILKE HALSTENBERG, UNIVERSITAT KARLSRUHE, EGGENSTEIN-LEOPOLDSHAFEN, GERMANY ALEXANDER QUINTE, FORSCHUNGSZENTRUM KARLSRUHE, GERMANY HORST EGGERT, FORSCHUNGSZENTRUM KARLSRUHE, GERMANY MICROFABRICATION OF SINGLE-USE PLASTIC MICROFLUIDIC DEVICES FOR HIGH-THROUGHPUT SCREENING AND DNA ANALYSIS 143 ANDREAS GERLACH, GREINER BIO-ONE GMBH, FRICKENHAUSEN, GERMANY GIINTHER KNEBEL, GREINER BIO-ONE GMBH, FRICKENHAUSEN, GERMANY ANDREAS E. GUBER, FORSCHUNGSZENTRUM KARLSRUHE, INSTITUT FUR MIKROSTRUKTURTECHNIK, KARLSRUHE, GERMANY MATHIAS HECKELE, FORSCHUNGSZENTRUM KARLSRUHE, INSTITUT FUR MIKROSTRUKTURTECHNIK, KARLSRUHE, GERMANY DIRK HERRMANN, FORSCHUNGSZENTRUM KARLSRUHE, INSTITUT FUR MIKROSTRUKTURTECHNIK, KARLSRUHE, GERMANY ALBAN MUSLIJA, FORSCHUNGSZENTRUM KARLSRUHE, INSTITUT FUR MIKROSTRUKTURTECHNIK, KARLSRUHE, GERMANY THOMAS SCHALLER, FORSCHUNGSZENTRUM KARLSRUHE, HAUPTABTEILUNG VERSUCHSTECHNIK, KARLSRUHE, GERMANY ANALYTICAL CHEMISTRY: A NEW APPLICATION FIELD FOR MICROSTRUCTURED DEVICES 149 HOLGER BARTOS, STEAG MICROPARTS GMBH, DORTMUND, GERMANY MANFRED BERNDT, AGILENT TECHNOLOGIES GMBH, WALDBRONN, GERMANY MARIO HEMPEL, STEAG MICROPARTS GMBH, DORTMUND, GERMANY RALF-PETER PETERS, STEAG MICROPARTS GMBH, DORTMUND, GERMANY 12 NANOSYNTEST*: AN INTEGRATED PLATFORM FOR CHEMICAL SYNTHESIS AND BIOLOGICAL TESTING IN NANOTITERPLATES 151 ANDREAS SCHOBER, INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY GREGOR SCHLINGLOFF, INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY DIRK TOMANDL, INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY ANDREAS GROFI, INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY JOHANN-MICHAEL KOHLER, INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY THOMAS HENKEL, INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY JENS ALBERT, INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY GIINTHER MAYER, INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY HOLGER DEPPE, MERCK KGAA, DARMSTADT, GERMANY ANDRAS WILLEMS, MERCK KGAA, DARMSTADT, GERMANY HANNS WURZINGER, MERCK KGAA, DARMSTADT, GERMANY MICHAEL DORING, MICRODROP GMBH, NORDERSTEDT, GERMANY HANS TIETZ, VIDEO AND IMAGE PROCESSING, GAUTING, GERMANY MICROOPTICAL DEVICES CHAIRMAN: WOLFGANG KOWALSKI, TU BRAUNSCHWEIG, GERMANY HIGH SPEED ELECTROSTATIC MICRO-OPTICAL SWITCHES 157 STEPHAN GONSETH, COLIBRYS SA, NEUCHATEL, SWITZERLAND PATRICK DEBERGH, COLIBRYS SA, NEUCHATEL, SWITZERLAND GREGOIRE PERREGAUX, COLIBRYS SA, NEUCHATEL, SWITZERLAND YVES DUPRAZ, COLIBRYS SA, NEUCHATEL, SWITZERLAND HENRI VUILLIOMENET, COLIBRYS SA, NEUCHATEL, SWITZERLAND MICHEL DEPRAZ, COLIBRYS SA, NEUCHATEL, SWITZERLAND ELECTROSTATIC MICROSHUTTERS ARRAY FOR DISPLAY APPLICATIONS 163 MARCO PIZZI, CENTRA RICERCHE FIAT, ORBASSANO, ITALY VALERIAN KONIACHKINE, SIBERIAN BRANCH OF RUSSIAN ACADEMY OF SCIENCES, SOBOLEV INSTITUTE, NOVOSIBIRSK, RUSSIA MARCO NIERI, CENTRA RICERCHE FIAT, ORBASSANO, ITALY SABINO SINESI, CENTRA RICERCHE FIAT, ORBASSANO, ITALY PIETRO PERLO, CENTRA RICERCHE FIAT, ORBASSANO, ITALY AUTOMATIC ASSEMBLY OF LENSES IN FRONT OF MINIATURE FLEXIBLE FIBRE-SCOPES 169 GERD DUSSLER, AACHEN UNIVERSITY OF TECHNOLOGY, LABORATORY FOR MACHINE TOOLS AND PRODUCTION ENGINEERING, AACHEN, GERMANY TILO PFEIFER, AACHEN UNIVERSITY OF TECHNOLOGY, LABORATORY FOR MACHINE TOOLS AND PRODUCTION ENGINEERING, AACHEN, GERMANY S. DRIESSEN, AACHEN UNIVERSITY OF TECHNOLOGY, LABORATORY FOR MACHINE TOOLS AND PRODUCTION ENGINEERING, AACHEN, GERMANY T. LAN, AACHEN UNIVERSITY OF TECHNOLOGY, LABORATORY FOR MACHINE TOOLS AND PRODUCTION ENGINEERING, AACHEN, GERMANY M. WEEK, FRAUNHOFER INSTITUTE OF PRODUCTION TECHNOLOGY IPT, AACHEN, GERMANY BERND PETERSEN, FRAUNHOFER INSTITUTE OF PRODUCTION TECHNOLOGY IPT, AACHEN, GERMANY 13 PLENARY SESSION CHAIRMAN: GIINTER ZIMMER, FHG IMS, DUISBURG, GERMANY EWALD PETTENPAUL, INFINEON TECHNOLOGIES AG, MUNCHEN GERMANY MICROSYSTEMS: DEVELOPMENT IN A CHANGING ENVIRONMENT 175 GISELE ROESEMS, CEC MICROMACHINE SYSTEM TECHNOLOGIES: WIRELESS LINK AND MANAGEMENT TECHNOLOGIES 177 NAOKI MITUMOTO, MICROMACHINE CENTER, TOKYO, JAPAN KIYOSHI NEMOTO, MICROMACHINE CENTER, TOKYO, JAPAN KIMIHIDE NAKATSU, MICROMACHINE CENTER, TOKYO, JAPAN HOME AUTOMATION, AN APPEALING STARTING POINT FOR INTELLIGENT HOME WALTER P. VON PATTAY, SIEMENS AG, MIINCHEN.GERMANY [FOR TECHNICAL REASONS YOU WILL FIND THIS MANUSCRIPT AT THE END OF THE PROCEEDINGS.] MICRO MATERIALS AND PROPERTIES I CHAIRMEN: ROBERT MERTENS, IMEC VZW, LEUVEN, BELGIUM BERND MICHEL, FHG-IZM, BERLIN, GERMANY INTERFACE CRACKS AND RELIABILITY ISSUES IN MICROSYSTEMS 183 BERND MICHEL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY JURGEN AUERSPERG, AMIC GMBH, BERLIN, GERMANY ANDREAS SCHUBERT, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY ROLF KUHNERT, IMAGE VISION GMBH, CHEMNITZ, GERMANY DYNAMIC BEHAVIOUR OF MICRO MATERIALS UNDER LOW VELOCITY IMPACT LOADING 187 THOMAS AUZANNEAU, PRECISION AND INTELLIGENCE LABORATORY, TOKYO INSTITUTE OF TECHNOLOGY, YOKOHAMA, JAPAN CHIAKI SATO, PRECISION AND INTELLIGENCE LABORATORY, TOKYO INSTITUTE OF TECHNOLOGY, YOKOHAMA, JAPAN THREE-DIMENSIONAL METROLOGY FOR MICROSYSTEM COMPONENTS 193 UWE BRAND, PHYSIKALISCH-TECHNISCHE BUNDESANSTALT, BRAUNSCHWEIG, GERMANY THOMAS KLEINEBESTEN, PHYSIKALISCH-TECHNISCHE BUNDESANSTALT, BRAUNSCHWEIG, GERMANY SHIZHI CAO, PHYSIKALISCH-TECHNISCHE BUNDESANSTALT, BRAUNSCHWEIG, GERMANY WOLFGANG HOFFMANN, PHYSIKALISCH-TECHNISCHE BUNDESANSTALT, BRAUNSCHWEIG, GERMANY HEINRICH SCHWENKE, PHYSIKALISCH-TECHNISCHE BUNDESANSTALT, BRAUNSCHWEIG, GERMANY 14 DETERMINATION OF COEFFICIENTS OF THERMAL EXPANSION AND POISSONS RATIOS ON MICRO MATERIAL SPECIMENS 199 DIETMAR VOGEL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY ASTRID GOLLHARDT, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY HANS WALTER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY KARL-FRIEDRICH BECKER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY TANJA BRAUN, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY BERND MICHEL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY MICRO MATERIALS AND PROPERTIES II CHAIRMEN: ROBERT MERTENS, IMEC VZW, LEUVEN, BELGIUM BERND MICHEL, FHG-IZM, BERLIN, GERMANY CYANATE ESTER BASED RESIN SYSTEMS FOR SNAP-CURE APPLICATIONS 20 5 JORG BAUER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY MONIKA BAUER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY THE EFFECT OF SIDE REACTIONS ON THE OPTICAL LOSS OF POLYCYANURATE THERMOSETS USED IN INTEGRATED OPTICS 211 CHRISTIAN DREYER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY MONIKA BAUER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY JORG BAUER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY NORBERT KEIL, HEINRICH-HERTZ-LNSTITUT FUR NACHRICHTENTECHNIK GMBH, BERLIN, GERMANY HUIHAI YAO, HEINRICH-HERTZ-LNSTITUT FUR NACHRICHTENTECHNIK GMBH, BERLIN, GERMANY CRISPIN ZAWADZKI, HEINRICH-HERTZ-LNSTITUT FUR NACHRICHTENTECHNIK GMBH, BERLIN, GERMANY DEVELOPMENT OF FE-CO-BASED FERROMAGNETIC FILMS FOR APPLICATIONS IN HIGH FREQUENCY - MICROINDUCTORS 217 KLAUS SEEMANN, FORSCHUNGSZENTRUM KARLSRUHE GMBH, KARLSRUHE, GERMANY A. VON DER WETH, FORSCHUNGSZENTRUM KARLSRUHE GMBH, KARLSRUHE, GERMANY I. FERGEN, FORSCHUNGSZENTRUM KARLSRUHE GMBH, KARLSRUHE, GERMANY PB-FREE LASER-BEAM SOLDERING WITH AN ADVANTAGEOUS SUBSTITUTION OF PBSN60 223 FRITZ HERBERT, TU BERLIN, INSTITUTSBEREICH FUR FUGETECHNIK UND BESCHICHTUNGSTECHNIK, GERMANY LUTZ DORN, TU BERLIN, INSTITUTSBEREICH FUR FUGETECHNIK UND BESCHICHTUNGSTECHNIK, GERMANY SHIVA SHRESTHA, TU BERLIN, INSTITUTSBEREICH FUR FUGETECHNIK UND BESCHICHTUNGSTECHNIK, GERMANY 15 MICRO MATERIALS AND PROPERTIES III CHAIRMEN: ROBERT MERTENS, IMEC VZW, LEUVEN, BELGIUM BERND MICHEL, FHG-IZM, BERLIN, GERMANY PIEZOELECTRIC PROPERTIES OF PZT THIN FILM 229 HIDETOSHI KOTERA, KYOTO UNIVERSITY, KYOTO, JAPAN THERMO-ELECTRO-MECHANICAL ANALYSIS OF PIEZOELECTRIC MICROCOMPONENTS BY HARMONIC OSCILLATIONS 237 RUBEN KEOSCHKERJAN, LLMENAU TECHNICAL UNIVERSITY, LLMENAU, GERMANY MICHAEL HARUTYUNYAN, STATE ENGINEERING UNIVERSITY OF ARMENIA, EREVAN, ARMENIA HELMUT WURMUS, LLMENAU TECHNICAL UNIVERSITY, LLMENAU, GERMANY SUB-MICRON COATINGS WITH LOW FRICTION AND WEAR FOR MICRO ACTUATORS 243 RALF BANDORF, FRAUNHOFER INSTITUTE FOR THIN FILMS AND SURFACE ENGINEERING, BRAUNSCHWEIG, GERMANY H. LUTHJE, FRAUNHOFER INSTITUTE FOR THIN FILMS AND SURFACE ENGINEERING, BRAUNSCHWEIG, GERMANY K. SCHIFF MANN, FRAUNHOFER INSTITUTE FOR THIN FILMS AND SURFACE ENGINEERING, BRAUNSCHWEIG, GERMANY TH. STAEDLER, FRAUNHOFER INSTITUTE FOR THIN FILMS AND SURFACE ENGINEERING, BRAUNSCHWEIG, GERMANY A. WORTMANN, FRAUNHOFER INSTITUTE FOR THIN FILMS AND SURFACE ENGINEERING, BRAUNSCHWEIG MATERIAL PARAMETERS FOR MICROSYSTEMS COLLECTED IN A PC-DATABASE ... 249 JIIRGEN VILLAIN, UNIVERSITY OF APPLIED SCIENCES AUGSBURG, GERMANY THORSTEN MULLER, UNIVERSITY OF APPLIED SCIENCES MITTWEIDA, MITTWEIDA, GERMANY WERNER TOTZAUER, UNIVERSITY OF APPLIED SCIENCES MITTWEIDA, MITTWEIDA, GERMANY BERND MICHEL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY SENSORS I CHAIRMAN: THOMAS GEBNER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY UNCERTAINTY IN MEASUREMENT OF SEMICONDUCTOR PIEZORESISTIVE SENSORS . 255 PHAN LE PHUONG HOA, TECHNISCHE UNIVERSITAT DRESDEN, GERMANY GERALD GERLACH, TECHNISCHE UNIVERSITAT DRESDEN, GERMANY GUNNAR SUCHANECK, TECHNISCHE UNIVERSITAT DRESDEN, GERMANY PACKAGED SINGLE CRYSTALLINE MICRORESONATOR FOR FORCE SENSING 261 M. HAUEIS, ETH ZURICH INSTITUTE OF MECHANICAL SYSTEMS, ZURICH, SWITZERLAND J. DUAL, ETH ZURICH INSTITUTE OF MECHANICAL SYSTEMS, ZURICH, SWITZERLAND C. CAVALLONI, KISTLER INSTRUMENTE AG, WINTERTHUR, SWITZERLAND M. GNIELKA, KISTLER INSTRUMENTE AG, WINTERTHUR, SWITZERLAND RUDOLF BUSER, INTERSTATE UNIVERSITY OF APPLIED SCIENCE, BUCHS, SWITZERLAND 16 SILICON VIBRATION SENSOR ARRAYS WITH ELECTRICALLY TUNABLE BAND SELECTIVITY 267 JAN MEHNER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY DIRK SCHEIBNER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY JURGEN WIBBELER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY DESIGN AND DEVELOPMENT OF A PIEZORESISTIVE PRESSURE SENSOR ON MICROMACHINED SILICON FOR HIGH-TEMPERATURE APPLICATION AND OF THE SIGNAL CONDITIONING ELECTRONICS 273 ANGELO BORGESE, UNIVERSITA DEGLI STUDI DI BRESCIA, ITALY D. CRESCINI, UNIVERSITA DEGLI STUDI DI BRESCIA, ITALY V. FERRARI, UNIVERSITA DEGLI STUDI DI BRESCIA, ITALY ZS. KOVACS VAJNA, UNIVERSITA DEGLI STUDI DI BRESCIA, ITALY D. MARIOLI, UNIVERSITA DEGLI STUDI DI BRESCIA, ITALY A. TARONI, UNIVERSITA DEGLI STUDI DI BRESCIA, ITALY M. MARINELLI, UNIVERSITA DI ROMA TOR VERGATA E. MILANI, UNIVERSITA DI ROMA TOR VERGATA A. PAOLETTI, UNIVERSITA DI ROMA TOR VERGATA A. TUCCIARONE, UNIVERSITA DI ROMA TOR VERGATA G. VERONA-RINATI, UNIVERSITA DI ROMA TOR VERGATA SENSORS II CHAIRMAN: THOMAS GEBNER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY FIBRE OPTICAL SENSORS FOR MONITORING CHEMICAL ATTACKS ON CONCRETE STRUCTURES 279 WALTER GRAHN, TECHNISCHE UNIVERSITAT BRAUNSCHWEIG, GERMANY WOLFGANG KOWALSKY, TECHNISCHE UNIVERSITAT BRAUNSCHWEIG, GERMANY JURGEN WICHERN, TECHNISCHE UNIVERSITAT BRAUNSCHWEIG, GERMANY STEFAN WIESE, TECHNISCHE UNIVERSITAT BRAUNSCHWEIG, GERMANY BULK MICROMACHINED AND WAFER BONDED RESONATORS FOR VACUUM PRESSURE MEASUREMENT 285 KARLA HILLER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY S. KURTH, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY N. ZICHNER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY T. GESSNER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY W. DOTZEL, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY T. IWERT, U-SEN MIKROSYSTEMTECHNIK GMBH, RUDOLSTADT, GERMANY H. FRITSCH, U-SEN MIKROSYSTEMTECHNIK GMBH, RUDOLSTADT, GERMANY S. BIEHL, U-SEN MIKROSYSTEMTECHNIK GMBH, RUDOLSTADT, GERMANY DESIGN AND OPTIMIZATION OF A CAPACITIVE MICRO-ELECTROMECHANICAL GYROSCOPE 291 RAINER SCHMID, FRAUNHOFER INSTITUT IMS, MUNCHEN, GERMANY LARS VOBKAMPER, DOLPHIN INTEGRATION GMBH, DUISBURG, GERMANY GEORG PELZ, GERHARD-MERCATOR-UNIVERSITY-GH, DUISBURG, GERMANY 17 MODELING, OPTIMUM DESIGN AND FABRICATION FOR A BIAXIAL FREQUENCY-SHIFTED MICROACCELEROMETER 297 YI-CHUNG LO, SYNCHROTRON RADIATION RESEARCH CENTER, HSINCHU, TAIWAN DENG-HUEI HWANG, NATIONAL CHIAO-TUNG UNIVERSITY, HSINCHU, TAIWAN KANPING CHIN, NATIONAL CHIAO-TUNG UNIVERSITY, HSINCHU, TAIWAN MOULDING CHAIRMEN: PETER BLEY, FORSCHUNGSZENTRUM KARLSRUHE GMBH, GERMANY ANTONIO PAOLETTI, UNIVERSITA DEGLI STUDI DI ROMA TOR VERGATA , ROMA, ITALY NEW PLASTIFICATION CONCEPTS FOR MICRO INJECTION MOULDING 303 WALTER MICHAELI, INSTITUT FUR KUNSTSTOFFVERARBEITUNG, AACHEN, GERMANY ALRUN SPENNEMANN, INSTITUT FUR KUNSTSTOFFVERARBEITUNG, AACHEN, GERMANY RALF GARTNER, INSTITUT FUR KUNSTSTOFFVERARBEITUNG, AACHEN, GERMANY MICRO ASSEMBLY INJECTION MOULDING FOR THE GENERATION OF HYBRID MICROSTRUCTURES 309 WALTER MICHAELI, INSTITUT FUR KUNSTSTOFFVERARBEITUNG, AACHEN, GERMANY CHRISTIAN ZIEGMANN, INSTITUT FUR KUNSTSTOFFVERARBEITUNG, AACHEN, GERMANY INJECTION MOLDING FOR MICRO STRUCTURES CONTROLLING MOLD-CORE EXTRUSION AND CAVITY HEAT-FLUX 315 CHIN YAN, R & D CENTER, MATSUI MFG.CO., LTD., ITABASHI-KU, TOKYO, JAPAN MASAYUKI NAKAO, UNIVERSITY OF TOKYO, TOKYO, JAPAN TAIHEI GO, UNIVERSITY OF TOKYO, TOKYO, JAPAN KIYOSHI MATSUMOTO, UNIVERSITY OF TOKYO, TOKYO, JAPAN YOTARO HATAMURA, UNIVERSITY OF TOKYO, TOKYO, JAPAN LASER MICROMACHINING & LIGHT INDUCED REACTION INJECTION MOLDING AS SUITABLE PROCESS SEQUENCE FOR THE RAPID FABRICATION OF MICROCOMPONENTS 321 THOMAS HANEMANN, FORSCHUNGSZENTRUM KARLSRUHE, GERMANY ASSEMBLY AND MICROINTEGRATION I CHAIRMEN: TOSHIO FUKUDA, NAGOYA UNIVERSITY, JAPAN RANDOLF SCHLIESSER, VDI/VDE TECHNOLOGIEZENTRUM INFORMATIONSTECHNOLOGIE GMBH, TELTOW, GERMANY CURRENT DEVELOPMENTS OF ULTRATHIN RFID SYSTEMS 327 RUDOLF LEUTENBAUER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY S. CICHOS, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY CH. KALLMAYER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY K. BUSCHICK, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY H. REICHL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY 18 MONOLITHIC INTEGRATION OF VIBRATION SENSORS IN NEAR SURFACE BULK SILICON MICROMACHINING WITH MICROELECTRONICS 333 CARMEN STEINIGER, ZENTRUM FUR MIKROTECHNOLOGIEN, TU CHEMNITZ, GERMANY ANDREAS BERTZ, ZENTRUM FUR MIKROTECHNOLOGIEN, TU CHEMNITZ, GERMANY THOMAS GESSNER, ZENTRUM FUR MIKROTECHNOLOGIEN, TU CHEMNITZ, GERMANY CONTACTLESS FEEDING OF MICROPARTS BY MEANS OF AN ELECTROSTATIC CONVEYOR 339 ULRICH GENGENBACH, FORSCHUNGSZENTRUM KARLSRUHE GMBH, KARLSRUHE, GERMANY BERND KOHLER, FORSCHUNGSZENTRUM KARLSRUHE GMBH, KARLSRUHE, GERMANY JAMES BOOLE, THE UNIVERSITY OF THE WEST OF ENGLAND, BRISTOL, GREAT BRITAIN HIGH PRECISION ASSEMBLY FOR A NOVEL MINIATURISED ELECTRON LENS SYSTEM 345 YANNICK ANSEL, INSTITUT FUR MIKROTECHNIK MAINZ GMBH, MAINZ-HECHTSHEIM, GERMANY F. SCHMITZ, INSTITUT FUR MIKROTECHNIK MAINZ GMBH, MAINZ-HECHTSHEIM, GERMANY L. SINGLETON, INSTITUT FUR MIKROTECHNIK MAINZ GMBH, MAINZ-HECHTSHEIM, GERMANY R. BARON, INSTITUT FUR MIKROTECHNIK MAINZ GMBH, MAINZ-HECHTSHEIM, GERMANY A. SCHMIDT, INSTITUT FUR MIKROTECHNIK MAINZ GMBH, MAINZ-HECHTSHEIM, GERMANY M. NIENHAUS, INSTITUT FIIR MIKROTECHNIK MAINZ GMBH, MAINZ-HECHTSHEIM, GERMANY G.K.L. MARX, JOHANNES-GUTENBERG-UNIVERSITAT MAINZ, GERMANY G. SCHONHENSE, JOHANNES-GUTENBERG-UNIVERSITAT MAINZ, GERMANY ASSEMBLY AND MICROINTEGRATION II CHAIRMEN: TOSHIO FUKUDA, NAGOYA UNIVERSITY, JAPAN RANDOLF SCHLIESSER, VDI/VDE TECHNOLOGIEZENTRUM INFORMATIONSTECHNOLOGIE GMBH, TELTOW, GERMANY ELECTROSTATIC GRIPPER WITH PART HOLDING AND RELEASING MECHANISM IN MICROASSEMBLY 351 HYEON-SEOK OH, LG PRODUCTION ENGINEERING RESEARCH CENTER, KYUNGGI-DO, KOREA JURGEN HESSELBACH, TECHNISCHE UNIVERSITAT BRAUNSCHWEIG, GERMANY A CONCEPT FOR MODULAR FABRICATION EQUIPMENT FOR FLUIDIC MICROSYSTEMS 357 ANDREAS HOFMANN, FORSCHUNGSZENTRUM KARLSRUHE GMBH, GERMANY FRIEDHELM ENGELHARDT, FORSCHUNGSZENTRUM KARLSRUHE GMBH, GERMANY ULRICH GENGENBACH, FORSCHUNGSZENTRUM KARLSRUHE GMBH, GERMANY RUDOLF SCHARNOWELL, FORSCHUNGSZENTRUM KARLSRUHE GMBH, GERMANY MANFRED BAR, IEF WERNER GMBH, FURTWANGEN, GERMANY 19 DEVELOPMENT OF AN ASSEMBLY PROCESS AND RELIABILITY INVESTIGATIONS FOR FLIP-CHIP LEDS USING THE AUSN SOLDERING 363 ROLF ASCHENBRENNER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY GORDON ELGER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY MATTHIAS HUTTER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY ERWIN JAGER, EPIGAP OPTOELEKTRONIK GMBH, BERLIN, GERMANY HERMANN OPPERMANN, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY HERBERT REICHL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY MOTION FROM THE NANOSCALE WORLD 369 VOLKER KLOCKE, FA. KLOCKE NANOTECHNIK, AACHEN, GERMANY PLENARY SESSION CHAIRMEN: WERNER JOHN, FHG-IZM, PADERBORN, GERMANY WOLFGANG KARTHE, FHG I0F, JENA, GERMANY OPPORTUNITIES FOR MICROSYSTEMS IN TELECOMMUNICATIONS MARY-ANN MAHER, MEMSCAP INC., OAKLAND, USA [FOR TECHNICAL REASONS YOU WILL FIND THIS MANUSCRIPT AT THE END OF THE PROCEEDINGS.] OPTICAL AND RF TELECOMMUNICATION DEVELOPMENT TOOLS AND SERVICES 375 JOOST VAN KUIJK, CONVENTOR BV, AMSTERDAM, THE NETHERLANDS ART MORRIS III, CONVENTOR INC. CARY, NC, USA PROCESS TECHNOLOGIES I CHAIRMAN: WILFRIED MOKWA, RWTH, AACHEN, GERMANY PHOTO INITIATED ADHESIVES - HIGH PERFORMANCE ADHESIVES FOR MICROELECTRONICS 379 TORSTEN USKE, DELO INDUSTRIEKLEBSTOFFE GMBH & CO. KG, LANDSBERG, GERMANY HIGH QUALITY LASERBEAM SOLDERING 387 LIIDGER BOSSE, FRAUNHOFER INSTITUTE LASERTECHNOLOGY, AACHEN, GERMANY ARMIN SCHILDECKER, FRAUNHOFER INSTITUTE LASERTECHNOLOGY, AACHEN, GERMANY ARNOLD GILLNER, FRAUNHOFER INSTITUTE LASERTECHNOLOGY, AACHEN, GERMANY REINHART POPRAWE, FRAUNHOFER INSTITUTE LASERTECHNOLOGY, AACHEN, GERMANY A SIMPLE METHOD FOR THE CHARACTERIZATION OF THIN FILMS DURING HEAT TREATMENT 393 CHI HSIANG PAN, NATIONAL CHIN-YI INSTITUTE OF TECHNOLOGY, TAICHUNG, TAIWAN 20 WEAR RESISTANT TOOLS FOR REPRODUCTION TECHNOLOGIES PRODUCED BY MICRO POWDER METALLURGY 395 ASTRID ROTA, FRAUNHOFER INSTITUT FUR FERTIGUNGSTECHNOLOGIE UND ANGEWANDTE MATERIALFORSCHUNG, BREMEN, GERMANY THOMAS HARTWIG, FRAUNHOFER INSTITUT FUR FERTIGUNGSTECHNOLOGIE UND ANGEWANDTE MATERIALFORSCHUNG, BREMEN, GERMANY PROCESS TECHNOLOGIES II CHAIRMAN: WILFRIED MOKWA, RWTH, AACHEN, GERMANY POLYMER MICROFABRICATION TECHNOLOGIES 401 HOLGER BECKER, MILDENO GMBH, JENA, GERMANY WILFRIED ROPKE, MILDENO GMBH, JENA, GERMANY OLIVER ROTTING, MILDENO GMBH, JENA, GERMANY CLAUDIA GARTNER, APPLIKATIONSZENTRUM MIKROTECHNIK JENA, JENA, GERMANY INVESTIGATION OF THE DEPOSITION PROCESS AND THE MICRODEPOSITS OF NIFE ELECTROLYTES IN DEPENDENCE OF THEIR COMPOSITION 407 GUNTER ENGELMANN, FRAUNHOFER INSTITUTE OF RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY V. SCHULZ, FRAUNHOFER INSTITUTE OF RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY J.K. DOHRMANN, FB BIOLOGIE, CHEMIE, PHARMAZIE DER FREIEN UNIVERSITAT BERLIN, GERMANY J. WOLF, FRAUNHOFER INSTITUTE OF RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY 0. EHRMANN, FRAUNHOFER INSTITUTE OF RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY H. REICHL, FRAUNHOFER INSTITUTE OF RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY CHEMICAL MECHANICAL POLISHING AS A TOOLBOX FOR THIN FILM MAGNETIC HEADS MANUFACTURING 413 HENNE VAN HEEREN, ONSTREAM B.V., EINDHOVEN, THE NETHERLANDS FRANS PRANK, ONSTREAM B.V., EINDHOVEN, THE NETHERLANDS THEO BERTENS, ONSTREAM B.V., EINDHOVEN, THE NETHERLANDS SACRIFICIAL MASK FAB ETCHING FOR HOLOGRAM DIFFRACTION GRATING WITH TRIANGULAR GROOVES 419 KIYOSHI MATSUMOTO, UNIVERSITY OF TOKYO, TOKYO, JAPAN MASAYUKI NAKAO, UNIVERSITY OF TOKYO, TOKYO, JAPAN YUKI SAKAMAKI, UNIVERSITY OF TOKYO, TOKYO, JAPAN YOTARO HATAMURA, UNIVERSITY OF TOKYO, TOKYO, JAPAN SHUJI TANAKA, TOHOKU UNIVERSITY, MIYAGI, JAPAN TAKESHI MIYAWAKI, ENGINEERING CENTER, ASAHI GLASS CO., LTD., KANAGAWA, JAPAN 21 ADVANCED ETCH TOOL FOR HIGH ETCH RATE DEEP REACTIVE ION ETCHING IN SILICON MICROMACHINING PRODUCTION ENVIRONMENT 425 ANDREA SCHILP, ROBERT BOSCH GMBH, STUTTGART, GERMANY MARTIN HAUSNER, PERKINELMER OPTOELECTRONICS GMBH, WIESBADEN, GERMANY MICHEL PUECH, ALCATEL VACUUM TECHNOLOGY FRANCE, ANNECY, FRANCE NICOLAS LAUNAY, ALCATEL VACUUM TECHNOLOGY FRANCE, ANNECY, FRANCE HERMANN KARAGOEZOGLU, PERKINELMER OPTOELECTRONICS GMBH, WIESBADEN, GERMANY FRANZ LAERMER, ROBERT BOSCH GMBH, STUTTGART, GERMANY ULTRA-THIN SYSTEMS CHAIRMAN: HEINRICH BRENNINGER, TEXAS INSTRUMENTS DEUTSCHLAND GMBH, FREISING, GERMANY NEW PROCESS SCHEME FOR WAFER THINNING AND STRESS-FREE SEPARATION OF ULTRA THIN ICS 431 CHRISTOF LANDESBERGER, FRAUNHOFER INST. FUR ZUVERLASSIGKEIT UND MIKROINTEGRATION, MUNCHEN, GERMANY S. SCHERBAUM, FRAUNHOFER INST. FU R ZUVERLASSIGKEIT UND MIKROINTEGRATION, MUNCHEN, GERMANY G. SCHWINN, FRAUNHOFER INST. FUR ZUVERLASSIGKEIT UND MIKROINTEGRATION, MUNCHEN, GERMANY H. SPOHRLE, FRAUNHOFER INST. FUR ZUVERLASSIGKEIT UND MIKROINTEGRATION, MUNCHEN, GERMANY INTERCONNECTION TECHNIQUES FOR ULTRA THIN ICS AND MEMS ELEMENTS .... 437 MICHAEL FEIL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, MUNICH, GERMANY CLIFF ADLER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, MUNICH, GERMANY GERHARD KLINK, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, MUNICH, GERMANY MARTIN KONIG, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, MUNICH, GERMANY ULTRA THIN CHIPS FOR MINIATURIZED PRODUCTS 443 ERIK JUNG, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY A. OSTMANN, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY D. WOJAKOWSKI, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY C. LANDESBERGER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, MUNICH, GERMANY R. ASCHENBRENNER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY H. REICHL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY A NEW APPROACH FOR HANDLING AND TRANSFERRING OF THIN SEMICONDUCTOR MATERIALS 449 MATTHIAS PETZOLD, FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS, HALLE, GERMANY DIETER KATZER, FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS, HALLE, GERMANY JORG BAGDAHN, JOHNS HOPKINS UNIVERSITY, BALTIMORE MD, USA MAIK WIEMER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, CHEMNITZ, GERMANY MARIN ALEXE, MAX-PLANCK-INSTITUTE OF MICROSTRUCTURE PHYSICS, HALLE, GERMANY VIOREL DRAGOI, MAX-PLANCK-LNSTITUTE OF MICROSTRUCTURE PHYSICS, HALLE, GERMANY ULRICH GOSELE, MAX-PLANCK-LNSTITUTE OF MICROSTRUCTURE PHYSICS, HALLE, GERMANY 22 ACTUATORS CHAIRMAN: EBERHARD KALLENBACH, TECHNISCHE UNIVERSITAT LLMENAU, GERMANY OPTIMIZATION OF AN ELECTRO-THERMALLY AND LATERALLY DRIVEN MICROACTUATOR 455 CHENG-CHANG LEE, NATIONAL CHIAO TUNG UNIVERSITY, HSINCHU, TAIWAN WENSYANG HSU, NATIONAL CHIAO TUNG UNIVERSITY, HSINCHU, TAIWAN AN ELECTRO-THERMALLY DRIVEN MICROACTUATOR WITH TWO DIMENSIONAL MOTION 461 CHIEN-TAI WU, NATIONAL CHIAO TUNG UNIVERSITY, HSINCHU, TAIWAN WENSYANG HSU, NATIONAL CHIAO TUNG UNIVERSITY, HSINCHU, TAIWAN A NOVEL OUT-OF-PLANE ELECTROTHERMAL MICROACTUATOR 467 CHIUNGCHENG LO, WALSIN LIHWA CORP., TAIPEI, TAIWAN HUNG-YI LIN, NATIONAL TSING HUA UNIVERSITY, HSINCHU, TAIWAN WEILEUN FANG, NATIONAL TSING HUA UNIVERSITY, HSINCHU, TAIWAN A LINEAR MICROACTUATOR WITH ENHANCED DESIGN 473 JENS EDLER, INSTITUTE FOR DRIVING SYSTEMS AND POWER ELECTRONICS, HANOVER UNIVERSITY, GERMANY MARTIN FOHSE, INSTITUTE FOR MICROTECHNOLOGY, HANOVER UNIVERSITY, GERMANY HANS HEINRICH GATZEN, INSTITUTE FOR MICROTECHNOLOGY, HANOVER UNIVERSITY, GERMANY HANS-DIETER STOLTING, INSTITUTE FOR DRIVING SYSTEMS AND POWER ELECTRONICS, HANOVER UNIVERSITY, GERMANY MECHATRONIC DRIVE SYSTEMS WITH INTEGRATED MICROSYSTEM TECHNOLOGY COMPONENTS 479 VEIT ZOPPIG, TECHNISCHE UNIVERSITAT LLMENAU, GERMANY KARSTEN FEINDT, TECHNISCHE UNIVERSITAT LLMENAU, GERMANY HARALD KUBE, TECHNISCHE UNIVERSITAT LLMENAU, GERMANY EBERHARD KALLENBACH, TECHNISCHE UNIVERSITAT LLMENAU, GERMANY MARKETS AND PRODUCT VISIONS I CHAIRMAN: CHRISTINE NEUY, IVAM NRW E.V., DORTMUND, GERMANY COMPETITIVE POSITION OF THE MICROSYSTEM TECHNOLOGIES FOR WAVELENGTH HANDLING IN ALL-OPTICAL NETWORKS FOR TELECOM 485 ERIC MOUNIER, YOLE DEVELOPPEMENT, LYON, FRANCE MICHEL PROVENCE, YOLE DEVELOPPEMENT, LYON, FRANCE 23 TECHNICAL TRENDS, POTENTIAL APPLICATIONS AND MARKET DEVELOPMENT IN OPTICAL FIBRE SENSOR TECHNOLOGY 491 REINHARDT WILLSCH, INSTITUTE FOR PHYSICAL HIGH TECHNOLOGY (IPHT), JENA, GERMANY NEXUS TASK FORCE MST MARKET ANALYSIS - EVALUATION AND UPDATE OF THE 1998 REPORT 497 REINER WECHSUNG, STEAG MICROPARTS GMBH, DORTMUND, GERMANY MARKETS AND PRODUCT VISIONS II CHAIRMAN: CHRISTINE NEUY, IVAM NRW E.V., DORTMUND, GERMANY FROM RESEARCH TO INDUSTRY: START-UP COMPANIES IN MICROSYSTEMS TECHNOLOGY (MST) 501 HENNING WICHT, WTC - WICHT TECHNOLOGIE CONSULTING, MUNCHEN, GERMANY JEREMIE BOUCHAUD, WTC - WICHT TECHNOLOGIE CONSULTING, MUNCHEN, GERMANY CYRILLE LE FLOCH, WTC - WICHT TECHNOLOGIE CONSULTING, MUNCHEN, GERMANY COMMERCIALIZATION ISSUES OF MEMS/MST/MICROMACHINES: AN UPDATED INDUSTRY REPORT CARD ON THE BARRIERS TO COMMERCIALIZATION WITH A FOCUS ON THE US MARKET 507 ROGER H. GRACE, ROGER GRACE ASSOCIATES, SAN FRANCISCO, USA EUROPRACTICE MICROSYSTEM DESIGN AND FOUNDRY SERVICES - STATUS AND OVERVIEW 515 PATRIC SALOMON, MEMSCAP GMBH, BERLIN, GERMANY POSTER PRESENTATIONS ELECTROLESS NISN - A LOW COST SOLUTION FOR FLIP CHIP BUMPING 521 PETRA GRATZ, TECHNISCHE UNIVERSITAT DRESDEN, GERMANY G. SADOWSKI, TECHNISCHE UNIVERSITAT DRESDEN, GERMANY M. BERTRAM, TECHNISCHE UNIVERSITAT DRESDEN, GERMANY CHEMICAL RESISTANCE OF THIN PLASMA POLYMERIZED FLUOROCARBON FILMS IN INORGANIC ETCHING SOLUTIONS USED IN MICROSTRUCTURE TECHNOLOGY 523 VASSIL LANEV, TECHNISCHE UNIVERSITAT LLMENAU, GERMANY NORBERT SCHWESINGER, TECHNISCHE UNIVERSITAT MUNCHEN, GERMANY HELMUT WURMUS, TECHNISCHE UNIVERSITAT LLMENAU, GERMANY 24 VARIANTS OF MICRO INJECTION MOLDING 527 VOLKER PIOTTER, FORSCHUNGSZENTRUM KARLSRUHE, INST. F. MATERIALFORSCHUNG III, GERMANY THOMAS HANEMANN, FORSCHUNGSZENTRUM KARLSRUHE, INST. F. MATERIALFORSCHUNG III, GERMANY JUERGEN HAUSSELT, FORSCHUNGSZENTRUM KARLSRUHE, INST. F. MATERIALFORSCHUNG III, GERMANY KLAUS MUELLER, FORSCHUNGSZENTRUM KARLSRUHE, INST. F. MATERIALFORSCHUNG III, GERMANY ROBERT RUPRECHT, FORSCHUNGSZENTRUM KARLSRUHE, INST. F. MATERIALFORSCHUNG III, GERMANY A NEW APPROACH TO ANISOTROPIC ETCH PING-ZOU HUANG, NATIONAL CHIAO TUNG UNIVERSITY, HSIN-CHU, TAIWAN [FOR TECHNICAL REASONS YOU WILL FIND THIS MANUSCRIPT AT THE END OF THE PROCEEDINGS.] REAL TIME AND IN-SITU CONTROL OF THE ETCHING DEPTH IN DYNAMIC DRY ETCHING PROCESSES OF MICRO- AND OPTO-ELECTRONICS 531 GOTTFRIED FRANKOWSKI, GFMESSTECHNIK GMBH, TELTOW/BERLIN, GERMANY ASPECTS OF MATERIAL INFLUENCE AND STRUCTURE GEOMETRY REGARDING THE DRY HYDROFLUORIC ETCHING OF SACRIFICIAL LAYERS FOR MICROSYSTEMS ... 533 OLIVER KRAMPITZ, UNIVERSITY OF BREMEN, GERMANY A. BUHRDORF, UNIVERSITY OF BREMEN, GERMANY A. BODECKER, UNIVERSITY OF BREMEN, GERMANY J. BINDER, UNIVERSITY OF BREMEN, GERMANY DESIGN AND PROTOTYPING OF A HIGHLY INTEGRATED MICROPROPULSION SYSTEM FOR MICROSATELLITES ATTITUDE CONTROL AND ORBIT CORRECTION 537 GIULIO MANZONI, MECHATRONIC GMBH, VILLACH, AUSTRIA ENZO DI FABRIZIO, INFM - ELETTRA SINCROTRONE, TRIESTE, ITALY INTEGRATED HIGH VOLTAGE AMPLIFIERS TO DRIVE CAPACITIVE MICROACTUATORS 541 STEPHAN BUSCHNAKOWSKI, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY GUNTER EBEST, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY STEFFEN HEINZ, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY CARSTEN SCHLEGEL, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANY A NEW ELECTROMAGNETIC MICROMIRROR PING-ZOU HUANG, NATIONAL CHIAO TUNG UNIVERSITY, HSIN-CHU, TAIWAN [FOR TECHNICAL REASONS YOU WILL FIND THIS MANUSCRIPT AT THE END OF THE PROCEEDINGS.] ALUMINIUM TEMPERATURE SENSORS OF RESISTANCE 545 IGOR VRUBLEVSKY, UNIVERSITY OF INFORMATICS AND RADIOELECTRONICS, MINSK, RUSSIA V. PARKOUN, UNIVERSITY OF INFORMATICS AND RADIOELECTRONICS, MINSK, RUSSIA K. MOSKVICHEV, UNIVERSITY OF INFORMATICS AND RADIOELECTRONICS, MINSK, RUSSIA 25 REFLECTIVE BISTABLE LIQUID CRYSTAL DISPLAYS ON FLEXIBLE PRODUCTS 547 MONIKA BAUER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY CHRISTINE BOEFFEL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY FRANK KUSCHEL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY CARSTEN NIELAND, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, TELTOW, GERMANY ADVANCED MODULAR MICRO-PRODUCTION SYSTEM 551 T. GAUGEL, FRAUNHOFER INST. PRODUKTIONSTECHNIK UND AUTOMATISIERUNG, STUTTGART, GERMANY NEW LABORATORY STAND FOR FLIP-CHIP ON BOARD ASSEMBLY 55 5 ZDZISLAW DROZD, WARSAW UNIVERSITY OF TECHNOLOGY, WARSZAWA, POLAND ENVIRONMENTAL FRIENDLY PLATING AND DEPLATING OF GOLD IN PCB MANUFACTURING 559 K.-H. ZUBER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY H. GRIESE, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY M. HANNEMANN, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY J. MULLER, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY R. SCHMIDT, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY LASER DIRECT PATTERNING (LPD) - A NEW PROCESS FOR THE FAST AND EFFICIENT FABRICATION OF MICROSTRUCTURES 565 DIETER MEIER, LPKF LASER & ELECTRONICS AG, GARBSEN, GERMANY ON A RECIPE FOR SU8-5 PHOTORESIST TO FABRICATE THE ELECTROPLATING MICROMOLDS OF A BI-AXIAL MICROACCELEROMETER 567 YI-CHUNG LO, SYNCHROTRON RADIATION RESEARCH CENTER, HSINCHU, TAIWAN DENG-HUEI HWANG, NATIONAL CHIAO-TUNG UNIVERSITY, HSINCHU, TAIWAN KANPING CHIN, NATIONAL CHIAO-TUNG UNIVERSITY, HSINCHU, TAIWAN FABRICATION OF MICRO FLUIDIC STRUCTURES BY HIGH PRECISION EMBOSSING 571 ANDREAS SCHUBERT, FRAUNHOFER IWU, CHEMNITZ, GERMANY THOMAS OTTO, FRAUNHOFER IZM, CHEMNITZ, GERMANY JULIANE BOHM, FRAUNHOFER IWU, CHEMNITZ, GERMANY REIMUND NEUGEBAUER, FRAUNHOFER IWU, CHEMNITZ, GERMANY THOMAS GESSNER, TECHNISCHE UNIVERSITAT CHEMNITZ, GERMANYS SPECIAL SESSION: MODULAR MEMS MODULAR OPTIC DEVICECS AND OPTIC INTERFACES 577 ACHIM STOCK, MATTHIAS SCHUENEMANN, GERD BAUER, WOLFGANG SCHAEFER,FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION IPA, STUTTGART, GERMANY RUDOLF LEUTENBAUER, VOLKER GROSSER, FRAUNHOFER INSTITUTE FOR MECHANICAL RELIABILITY AND MICROINTEGRATION IZM, BERLIN, GERMANY ANDREAS BRAEUER, CHRISTOPH WAECHTER, RAMONA EBERHARDT, FRAUNHOFER INSTITUTE FOR APPLIED OPTICS AND PRECISION ENGINEERING IOF, JENA, GERMANY 26 DESIGN METHODOLOGY OF MODULAR MICRO-SYSTEMS 583 KOUROSH AMIRI JAM, RUDOLF LEUTENBAUER, VOLKER GROBER, HERBERT REICHL, DEPT. ASE, FRAUNHOFER INSTITUT FHG/IZM, BERLIN, GERMANY RELIABILITY AND LIFETIME OF MODULAR MEMS 589 V. HILLMANN, C. BOMBACH, D. HEINRICH, W. FAUST, FRAUNHOFER IZM, BERLIN, GERMANY E. KAULFERSCH, AMIC GMBH, BERLIN, GERMANY MODULAR FLUIDIC DEVICES AND FLUIDIC INTERFACES 595 GERD BAUER, MATTHIAS SCHUENEMANN, FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION, DEPARTMENT OF MICROFABRICATION, STUTTGART, GERMANY GOTZ GUNTHER, RHEINISCH-WESTFALISCHE TECHNISCHE HOCHSCHULE AACHEN (RWTH) INSTITUTE OF FLUID POWER TRANSMISSION AND CONTROL, AACHEN, GERMANY VOLKER GROBER, VOLKER HILLMANN, FRAUNHOFER INSTITUTE FOR MECHANICAL RELIABILITY AND MICROINTEGRATION, DEPARTMENT OF MECHANICAL RELIABILITY AND MICROTECHNOLOGY, BERLIN, GERMANY MODULARIZATION OF MICROSYSTEMS 601 MATTHIAS SCHUENEMANN, GERD BAUER, ACHIM STOCK, WOLFGANG SCHAEFER, FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION IPA, STUTTGART, GERMANY VOLKER GROSSER, KOUROSH AMIRI JAM, RUDOLF LEUTENBAUER, HERBERT REICHL, FRAUNHOFER INSTITUTE FOR MECHANICAL RELIABILITY AND MICROINTEGRATION IZM, BERLIN, GERMANY MESSEPROGRAMM 607 INDEX OF AUTHORS 609 27
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spelling	Micro-system technologies 2001 International Conference & Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Düsseldorf, March 27 - 29, 2001. Herbert Reichl (ed.). [Organized by Messe Düsseldorf GmbH ...] Micro system technologies 2001 Berlin u.a. VDE-Verl. 2001 613 S. Ill., graph. Darst. 1 CD-Rom (12 cm) txt rdacontent n rdamedia nc rdacarrier Systemvoraussetzungen der CD-ROM-Beil.:. - für Acrobat Reader 4.0 für Windows Mikrosystemtechnik - Kongress - Düsseldorf <2001> Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 2001 Düsseldorf gnd-content Mikrosystemtechnik (DE-588)4221617-5 s DE-604 Reichl, Herbert 1945- Sonstige (DE-588)108658074 oth Messe Düsseldorf GmbH Sonstige (DE-588)2173119-6 oth International Conference and Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components 2001 Düsseldorf Sonstige (DE-588)10019734-6 oth GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009315407&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis
spellingShingle	Micro-system technologies 2001 Mikrosystemtechnik - Kongress - Düsseldorf <2001> Mikrosystemtechnik (DE-588)4221617-5 gnd
subject_GND	(DE-588)4221617-5 (DE-588)1071861417
title	Micro-system technologies 2001
title_alt	Micro system technologies 2001
title_auth	Micro-system technologies 2001
title_exact_search	Micro-system technologies 2001
title_full	Micro-system technologies 2001 International Conference & Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Düsseldorf, March 27 - 29, 2001. Herbert Reichl (ed.). [Organized by Messe Düsseldorf GmbH ...]
title_fullStr	Micro-system technologies 2001 International Conference & Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Düsseldorf, March 27 - 29, 2001. Herbert Reichl (ed.). [Organized by Messe Düsseldorf GmbH ...]
title_full_unstemmed	Micro-system technologies 2001 International Conference & Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Düsseldorf, March 27 - 29, 2001. Herbert Reichl (ed.). [Organized by Messe Düsseldorf GmbH ...]
title_short	Micro-system technologies 2001
title_sort	micro system technologies 2001
topic	Mikrosystemtechnik - Kongress - Düsseldorf <2001> Mikrosystemtechnik (DE-588)4221617-5 gnd
topic_facet	Mikrosystemtechnik - Kongress - Düsseldorf <2001> Mikrosystemtechnik Konferenzschrift 2001 Düsseldorf
url	http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009315407&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT reichlherbert microsystemtechnologies2001 AT messedusseldorfgmbh microsystemtechnologies2001 AT internationalconferenceandexhibitiononmicroelectrooptomechanicalsystemsandcomponentsdusseldorf microsystemtechnologies2001

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