CAE CAD and thermal management issues in electronic systems: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York, NY
ASME
1997
|
| Schriftenreihe: | HTD / Heat Transfer Division, ASME
356 EEP / Electrical and Electronic Packaging Division, ASME 23 |
| Schlagworte: | |
| Beschreibung: | V, 109 S. graph. Darst. |
| ISBN: | 0791818527 |
Internformat
MARC
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| 245 | 1 | 0 | |a CAE CAD and thermal management issues in electronic systems |b presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |c ed. by Dereje Agonafer ... |
| 264 | 1 | |a New York, NY |b ASME |c 1997 | |
| 300 | |a V, 109 S. |b graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a HTD / Heat Transfer Division, ASME |v 356 | |
| 490 | 1 | |a EEP / Electrical and Electronic Packaging Division, ASME |v 23 | |
| 650 | 4 | |a Datenverarbeitung | |
| 650 | 4 | |a Computer-aided engineering |v Congresses | |
| 650 | 4 | |a Electronic apparatus and appliances |x Temperature control |v Congresses | |
| 650 | 4 | |a Electronic packaging |x Design |x Data processing |v Congresses | |
| 650 | 4 | |a Heat sinks (Electronics) |v Congresses | |
| 650 | 4 | |a Heat |x Transmission |x Data processing |v Congresses | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 700 | 1 | |a Agonafer, Dereje |e Sonstige |4 oth | |
| 711 | 2 | |a International Mechanical Engineering Congress and Exposition |d 1997 |c Dallas, Tex. |j Sonstige |0 (DE-588)5277575-6 |4 oth | |
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| 810 | 2 | |a Electrical and Electronic Packaging Division, ASME |t EEP |v 23 |w (DE-604)BV012594760 |9 23 | |
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Datensatz im Suchindex
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| ctrlnum | (OCoLC)38156158 (DE-599)BVBBV013633525 |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
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| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV013633525 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:49:18Z |
| institution | BVB |
| institution_GND | (DE-588)5277575-6 |
| isbn | 0791818527 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009314404 |
| oclc_num | 38156158 |
| open_access_boolean | |
| owner | DE-703 |
| owner_facet | DE-703 |
| physical | V, 109 S. graph. Darst. |
| publishDate | 1997 |
| publishDateSearch | 1997 |
| publishDateSort | 1997 |
| publisher | ASME |
| record_format | marc |
| series2 | HTD / Heat Transfer Division, ASME EEP / Electrical and Electronic Packaging Division, ASME |
| spelling | CAE CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas ed. by Dereje Agonafer ... New York, NY ASME 1997 V, 109 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier HTD / Heat Transfer Division, ASME 356 EEP / Electrical and Electronic Packaging Division, ASME 23 Datenverarbeitung Computer-aided engineering Congresses Electronic apparatus and appliances Temperature control Congresses Electronic packaging Design Data processing Congresses Heat sinks (Electronics) Congresses Heat Transmission Data processing Congresses (DE-588)1071861417 Konferenzschrift gnd-content Agonafer, Dereje Sonstige oth International Mechanical Engineering Congress and Exposition 1997 Dallas, Tex. Sonstige (DE-588)5277575-6 oth Heat Transfer Division, ASME HTD 356 (DE-604)BV001895916 356 Electrical and Electronic Packaging Division, ASME EEP 23 (DE-604)BV012594760 23 |
| spellingShingle | CAE CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas Datenverarbeitung Computer-aided engineering Congresses Electronic apparatus and appliances Temperature control Congresses Electronic packaging Design Data processing Congresses Heat sinks (Electronics) Congresses Heat Transmission Data processing Congresses |
| subject_GND | (DE-588)1071861417 |
| title | CAE CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |
| title_auth | CAE CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |
| title_exact_search | CAE CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |
| title_full | CAE CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas ed. by Dereje Agonafer ... |
| title_fullStr | CAE CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas ed. by Dereje Agonafer ... |
| title_full_unstemmed | CAE CAD and thermal management issues in electronic systems presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas ed. by Dereje Agonafer ... |
| title_short | CAE CAD and thermal management issues in electronic systems |
| title_sort | cae cad and thermal management issues in electronic systems presented at the 1997 asme international mechanical engineering congress and exposition november 16 21 1997 dallas texas |
| title_sub | presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |
| topic | Datenverarbeitung Computer-aided engineering Congresses Electronic apparatus and appliances Temperature control Congresses Electronic packaging Design Data processing Congresses Heat sinks (Electronics) Congresses Heat Transmission Data processing Congresses |
| topic_facet | Datenverarbeitung Computer-aided engineering Congresses Electronic apparatus and appliances Temperature control Congresses Electronic packaging Design Data processing Congresses Heat sinks (Electronics) Congresses Heat Transmission Data processing Congresses Konferenzschrift |
| volume_link | (DE-604)BV001895916 (DE-604)BV012594760 |
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