APA (7th ed.) Citation

(1994). Mechanics and materials for electronic packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994. American Soc. of Mechanical Engineers.

Chicago Style (17th ed.) Citation

Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994. New York, NY: American Soc. of Mechanical Engineers, 1994.

MLA (9th ed.) Citation

Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994. American Soc. of Mechanical Engineers, 1994.