Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 2 Thermal and mechanical behavior and modeling
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York, NY
American Soc. of Mechanical Engineers
1994
|
| Schriftenreihe: | American Society of Mechanical Engineers, Applied Mechanics Division: AMD
187 |
| Schlagworte: | |
| Beschreibung: | VI, 229 S. Ill., graph. Darst. |
| ISBN: | 0791814270 |
Internformat
MARC
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| 245 | 1 | 0 | |a Mechanics and materials for electronic packaging |b presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |n 2 |p Thermal and mechanical behavior and modeling |c ed. by Michael A. Schen ... |
| 264 | 1 | |a New York, NY |b American Soc. of Mechanical Engineers |c 1994 | |
| 300 | |a VI, 229 S. |b Ill., graph. Darst. | ||
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| 700 | 1 | |a Chen, William T. |e Sonstige |4 oth | |
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Datensatz im Suchindex
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
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| genre_facet | Konferenzschrift |
| id | DE-604.BV013566680 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:48:07Z |
| institution | BVB |
| institution_GND | (DE-588)5148257-5 |
| isbn | 0791814270 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009265907 |
| oclc_num | 33863169 |
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| physical | VI, 229 S. Ill., graph. Darst. |
| publishDate | 1994 |
| publishDateSearch | 1994 |
| publishDateSort | 1994 |
| publisher | American Soc. of Mechanical Engineers |
| record_format | marc |
| series | American Society of Mechanical Engineers, Applied Mechanics Division: AMD |
| series2 | American Society of Mechanical Engineers, Applied Mechanics Division: AMD AMD / Applied Mechanics Division, American Society of Mechanical Engineers |
| spelling | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 2 Thermal and mechanical behavior and modeling ed. by Michael A. Schen ... New York, NY American Soc. of Mechanical Engineers 1994 VI, 229 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier American Society of Mechanical Engineers, Applied Mechanics Division: AMD 187 AMD / Applied Mechanics Division, American Society of Mechanical Engineers ... Electronic packaging Congresses Electronic packaging Materials Congresses (DE-588)1071861417 Konferenzschrift gnd-content Chen, William T. Sonstige oth Schen, Michael A. Sonstige oth International Mechanical Engineering Congress and Exposition 1994 Chicago, Ill. Sonstige (DE-588)5148257-5 oth (DE-604)BV013566572 2 American Society of Mechanical Engineers, Applied Mechanics Division: AMD 187 (DE-604)BV001894732 187 |
| spellingShingle | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 American Society of Mechanical Engineers, Applied Mechanics Division: AMD Electronic packaging Congresses Electronic packaging Materials Congresses |
| subject_GND | (DE-588)1071861417 |
| title | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_auth | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_exact_search | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_full | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 2 Thermal and mechanical behavior and modeling ed. by Michael A. Schen ... |
| title_fullStr | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 2 Thermal and mechanical behavior and modeling ed. by Michael A. Schen ... |
| title_full_unstemmed | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 2 Thermal and mechanical behavior and modeling ed. by Michael A. Schen ... |
| title_short | Mechanics and materials for electronic packaging |
| title_sort | mechanics and materials for electronic packaging presented at 1994 international mechanical engineering congress and exposition chicago illinois november 6 11 1994 thermal and mechanical behavior and modeling |
| title_sub | presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| topic | Electronic packaging Congresses Electronic packaging Materials Congresses |
| topic_facet | Electronic packaging Congresses Electronic packaging Materials Congresses Konferenzschrift |
| volume_link | (DE-604)BV013566572 (DE-604)BV001894732 |
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