Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York, NY
American Soc. of Mechanical Engineers
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| Schriftenreihe: | AMD / Applied Mechanics Division, American Society of Mechanical Engineers
... |
| Schlagworte: |
Internformat
MARC
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Datensatz im Suchindex
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| spelling | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 New York, NY American Soc. of Mechanical Engineers txt rdacontent n rdamedia nc rdacarrier AMD / Applied Mechanics Division, American Society of Mechanical Engineers ... Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1994 Chicago Ill. gnd-content Elektronisches Bauelement (DE-588)4014360-0 s DE-604 Chen, William T. Sonstige oth Schen, Michael A. Sonstige oth International Mechanical Engineering Congress and Exposition 1994 Chicago, Ill. Sonstige (DE-588)5148257-5 oth |
| spellingShingle | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)1071861417 |
| title | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_auth | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_exact_search | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_full | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_fullStr | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_full_unstemmed | Mechanics and materials for electronic packaging presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| title_short | Mechanics and materials for electronic packaging |
| title_sort | mechanics and materials for electronic packaging presented at 1994 international mechanical engineering congress and exposition chicago illinois november 6 11 1994 |
| title_sub | presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6 - 11, 1994 |
| topic | Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Elektronisches Bauelement Konferenzschrift 1994 Chicago Ill. |
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