APA (7th ed.) Citation

(2000). Molded interconnect devices: 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings]. Meisenbach.

Chicago Style (17th ed.) Citation

Molded Interconnect Devices: 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings]. Bamberg: Meisenbach, 2000.

MLA (9th ed.) Citation

Molded Interconnect Devices: 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings]. Meisenbach, 2000.

Warning: These citations may not always be 100% accurate.