Molded interconnect devices: 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings]
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Bamberg
Meisenbach
2000
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | 325 S. Ill., graph. Darst. |
| ISBN: | 3875251350 |
Internformat
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| 245 | 1 | 0 | |a Molded interconnect devices |b 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] |c MID 2000. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... |
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Datensatz im Suchindex
| _version_ | 1804128248546721792 |
|---|---|
| adam_text | Table
of
Contents
Part
1:
Introduction
Advance of MID by Innovative Products
1
and Production Technologies
Prof. Dr. K.
Feldmann, FAPS,
Univ. of
Erlangen - Nürnberg (D)
Intensified Integration of Mechanics, Electronics and Software
- 15
New Chances for MID
Dr. K.
Wucherer,
Senior Vice President, Siemens,
Nürnberg (D)
Actual Joint Research Projects of the Research Association
25
Molded Interconnect Devices
3-D
MID
e.V.
Roland Meier,
3-D
MID
e.V., Erlangen
(D)
Part
2:
Design
&
Project Realisation
Realisation of
a Microdosage
System in MID-Technology
37
H. Ashauer, HSG
IMIT,
Villingen-Schwenningen (D)
G. Raffa, HSG
IMIT,
Villingen-Schwenningen (D)
M.
Schmitt,
HSG
IMIT,
Villingen-Schwenningen (D)
T.
Strobelt,
HSG
IMIT,
Villingen-Schwenningen (D)
H. Sandmaier, HSG
IMIT,
Villingen-Schwenningen (D)
Cost Effective Solutions to Reflow Solderable Surface Mount
49
Applications Using Selective Metalization
A. Verrioli, MID LLC, Rochester (USA)
Manufacturing of Working 3D-MID Prototypes Using Rapid
61
Prototyping Techniques Demonstrated on an Automatic
Transmission Gear Diplay
Dr. K.
Rüter,
DST
Dräxlmaier Systemtechnik, Vilsbiburg
(D)
Dr. M.
Flieser,
DST
Dräxlmaier Systemtechnik, Vilsbiburg
(D)
J.
Folz,
DST
Dräxlmaier Systemtechnik, Vilsbiburg (D)
Part
3:
Application I
Approach for an Automotive Mechatronic MID solution
71
M.
Heyer, FCI
Automotive
Deutschland, Nürnberg (D)
Cost Reduction by MID Antennas for
85
Hand Held Personal and Mobile RF Wireless Devices
E. P. Geoca, MID LLC, Rochester (USA)
Product Development of an Oil-Level-Sensor:
95
Advantages of Laser Structuring
G.
Eßer,
LFT, University of
Erlangen - Nürnberg
(D),
H.
Schultheis, Bedia Motorentechnik, Leinburg
(D)
Application
of MID-Technology in Connector Field
109
S. Kumagai, SONY Corporation (J)
K.
Sueki, FCI Japan (J)
T. Yumoto, SANKYOKASEI (J)
Part
4:
Applications II
From the Idea to Series Part
- 115
a Two Component MID with a Weight Lower Than
0,1
g
J. Wahode, Heraeus,
Hanau (D)
MID Techonlogy to Miniaturize Electro-Optical Devices
129
H. Yamanaka, Matsushita Electric Works, Ltd., Osaka (J)
S. Matsushima, Matsushita Electric Works, Ltd., Osaka (J)
T. Suzuki, Matsushita Electric Works, Ltd., Osaka (J)
Innovative Sensor and Actuator Devices Using MID Technology
141
W. Eberhardt. HSG IFZ, Stuttgart (D)
M. Giousouf. HSG IFZ, Stuttgart (D)
P. Schilling. HSG IFZ. Stuttgart (D)
T.
Gerhäuser.
HSG IFZ, Stuttgart (D)
Prof. H.
Kück,
HSG IFZ, Stuttgart (D)
Dr.
F. Pöhlau. MOS.
Ansbach (D)
C. Hanisch,
FESTO,
Esslingen
(D)
M. Maichl.
FESTO.
Esslingen
(D)
P,
Post.
FESTO
,
Esslingen
(D)
Η.
Vollmer.
FESTO.
Esslingen
(D)
M. Weinmann,
FESTO.
Esslingen
(D)
Part
5: MID-Manufacturing
Using Two-Shot Molding for Manufacturing of Micro-MIDs
145
V.
Zippmann,
Buss
Werkstofftechnik, Münzenberg (D)
Selective Plateable Plastic Combinations
147
R.
Dörfler,
LKT, Univ. of
Erlangen - Nürnberg
(D)
I. Vercucque, LKT, Univ. of
Erlangen - Nürnberg
(D)
Prof. Dr. Dr.
h.c. G.
W.
Ehrenstein, LKT,
Univ. of
Erlangen - Nürnberg
(D))
Mass Production of Hot Embossed MIDs: Challenges and
161
Perspectives
Dr.
F. Pöhlau, MOS,
Ansbach
(D)
Part
6:
Qualification and Product Implementation
3-D
MID Application in a Fiber Optic Transceiver
173
M. Nadeau, Lucent Technologies, Breinigsville (USA)
J. Osenbach, Lucent Technologies, Breinigsville (USA)
J. Keska, Lucent Technologies, Breinigsville (USA)
S.
Salko,
Lucent Technologies, Breinigsville (USA)
P.
Pappas,
Lucent Technologies, Breinigsville (USA)
D. Stackhouse, Lucent Technologies, Breinigsville (USA)
S.
Trapani,
Lucent Technologies, Breinigsville (USA)
K. Yanushefski, Lucent Technologies, Breinigsville (USA)
Application of
UFE
Molded Circuit Technology®
183
in a Fiber Optic Transceiver
K.
Maurer,
UFE
Incorporated, Stillwater (USA)
J. Osenbach. Lucent Technologies, Breinigsville (USA)
M. Nadeau. Lucent Technologies, Breinigsviile (USA)
Polymer Stud Grid Array (PSGA
)-
A new
ЗО-Раскаде
191
Technology for BGA- and CSP-Applications
С
Wegener. Siemens, Berlin (D)
Two Shot Plated Plastic Investigation on Connector Technology
203
D.
Zito,
Motorola AIEG, Northbrook (USA)
Part
7:
Functional Materials
Magnetizable Polymers: Integrate
Sensorie
Rationally in 3D-MIDS
217
D. Drummer, LKT, Univ. of
Erlangen - Nürnberg (D)
Prof. Dr. Dr.
h.c. G.
W.
Ehrenstein, LKT,
Univ. of
Erlangen - Nürnberg
(D)
Molded Interconnect Devices Made by Flexible Copper Foil
229
Dr. M.
lida,
Hitachi Ltd., Yokohama (J)
N.
Ebinuma, Hitachi Ltd., Yokohama (J)
K. Nakamura, Hitachi Ltd., Yokohama (J)
S. Nakamura, Hiroshima Institute of Technologgy (J)
A Fundamentally New Mechanism for Additive Metallization of
243
Polymeric Substrates in Ultra Fine Line Technology Illustrated for
3D-MIDS
Prof. Dr. G. Naundorf, FH
Lippe,
Lemgo (D)
Prof. Dr. H.
Wissbrock,
FH
Lippe,
Lemgo (D)
Part
8:
Metallization
Selective Plating of LCP
251
W. Leonhard, FhG
IPA,
Stuttgart (D)
Dr. E.
Maaßen, AHC-Oberflächentechnik
Holding GmbH Kerpen (D)
A New Method for Measuring the Adhesive Strength
263
of Plated Metal Layer on Plastics.
F. Baba,
Mitsubishi, Hyogo (J)
С
Abe, Mitsubishi, Hyogo (J)
A. Yamada Mitsubishi, Hyogo (J)
Metallization of High Temperature Resistant
273
Thermoplastic Polymers for Electronic Applications
С
Weiß,
LSP, University of
Erlangen-Nürnberg (D)
Prof. Dr. Helmut Miinstedt, LSP, University of
Erlangen-Nürnberg
(D)
Part
9:
Production Techniques
Alternative Interconnection Technologies for MID
285
M. Reichenberger, (FAPS), University of
Erlangen-Nürnberg (D)
M.
Eisenbarth, (FAPS),
University of
Erlangen-Nürnberg
(D)
R.
Meier, (FAPS), University of
Erlangen-Nürnberg
(D)
J.
Friedrich, ERSA , Wertheim
(D)
Temperature Control for Semi-Indirect
299
Heating Soldering Using Disturbance Observer
Prof. Dr. M. Shiraishi, Ibaraki
Universität,
Hitachi (J)
M. Kikuchi, Ibaraki
Universität,
Hitachi (J)
Dr. K. Tsuchiya, Ibaraki
Universität,
Hitachi (J)
SMD-Assembly of MID-Circuits
311
R. Pollack, REPOTECH, Radolfzell (D)
New Applications Using Hot Embossing Technology
321
J. Hacked,
Bolta-Werke, Gottmadingen (D)
|
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| indexdate | 2024-07-09T18:46:14Z |
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| physical | 325 S. Ill., graph. Darst. |
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| spelling | Molded interconnect devices 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] MID 2000. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... MID 2000 Bamberg Meisenbach 2000 325 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 2000 Erlangen gnd-content Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 s DE-604 Feldmann, Klaus Sonstige oth MID 4 2000 Erlangen Sonstige (DE-588)1801047-7 oth Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009185414&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Molded interconnect devices 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd |
| subject_GND | (DE-588)4550503-2 (DE-588)1071861417 |
| title | Molded interconnect devices 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] |
| title_alt | MID 2000 |
| title_auth | Molded interconnect devices 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] |
| title_exact_search | Molded interconnect devices 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] |
| title_full | Molded interconnect devices 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] MID 2000. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... |
| title_fullStr | Molded interconnect devices 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] MID 2000. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... |
| title_full_unstemmed | Molded interconnect devices 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] MID 2000. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... |
| title_short | Molded interconnect devices |
| title_sort | molded interconnect devices 4 international congress 27 28 september 2000 erlangen germany proceedings |
| title_sub | 4. International Congress ; 27. - 28. September 2000, Erlangen, Germany ; [proceedings] |
| topic | Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd |
| topic_facet | Dreidimensionaler spritzgegossener Schaltungsträger Konferenzschrift 2000 Erlangen |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009185414&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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