Reflow soldering processes and troubleshooting: SMT, BGA, CSP and flip chip technologies
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Boston [u.a.]
Newnes
2002
|
| Schlagworte: | |
| Beschreibung: | IX, 270 S. Ill., graph. Darst. |
| ISBN: | 0750672188 |
Internformat
MARC
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|---|---|---|---|
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| 003 | DE-604 | ||
| 005 | 20030115 | ||
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| 041 | 0 | |a eng | |
| 049 | |a DE-703 |a DE-83 | ||
| 050 | 0 | |a TK7836 | |
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| 084 | |a ZN 4125 |0 (DE-625)157354: |2 rvk | ||
| 100 | 1 | |a Lee, Ning-Cheng |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Reflow soldering processes and troubleshooting |b SMT, BGA, CSP and flip chip technologies |c Ning-Cheng Lee |
| 264 | 1 | |a Boston [u.a.] |b Newnes |c 2002 | |
| 300 | |a IX, 270 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Electric connectors | |
| 650 | 4 | |a Electronic apparatus and appliances |x Design and construction | |
| 650 | 4 | |a Electronic packaging | |
| 650 | 4 | |a Solder and soldering | |
| 650 | 0 | 7 | |a Oberflächenmontiertes Bauelement |0 (DE-588)4132685-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Oberflächenmontage |0 (DE-588)4248071-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Reflow-Löten |0 (DE-588)4273607-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Löten |0 (DE-588)4036162-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Reflow-Löten |0 (DE-588)4273607-9 |D s |
| 689 | 0 | 1 | |a Oberflächenmontage |0 (DE-588)4248071-1 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Oberflächenmontiertes Bauelement |0 (DE-588)4132685-4 |D s |
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| 999 | |a oai:aleph.bib-bvb.de:BVB01-009071444 | ||
Datensatz im Suchindex
| _version_ | 1804128074723229696 |
|---|---|
| any_adam_object | |
| author | Lee, Ning-Cheng |
| author_facet | Lee, Ning-Cheng |
| author_role | aut |
| author_sort | Lee, Ning-Cheng |
| author_variant | n c l ncl |
| building | Verbundindex |
| bvnumber | BV013305462 |
| callnumber-first | T - Technology |
| callnumber-label | TK7836 |
| callnumber-raw | TK7836 |
| callnumber-search | TK7836 |
| callnumber-sort | TK 47836 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZM 8455 ZN 4125 |
| ctrlnum | (OCoLC)247360904 (DE-599)BVBBV013305462 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
| format | Book |
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| id | DE-604.BV013305462 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:43:28Z |
| institution | BVB |
| isbn | 0750672188 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009071444 |
| oclc_num | 247360904 |
| open_access_boolean | |
| owner | DE-703 DE-83 |
| owner_facet | DE-703 DE-83 |
| physical | IX, 270 S. Ill., graph. Darst. |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | Newnes |
| record_format | marc |
| spelling | Lee, Ning-Cheng Verfasser aut Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee Boston [u.a.] Newnes 2002 IX, 270 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd rswk-swf Oberflächenmontage (DE-588)4248071-1 gnd rswk-swf Reflow-Löten (DE-588)4273607-9 gnd rswk-swf Löten (DE-588)4036162-7 gnd rswk-swf Reflow-Löten (DE-588)4273607-9 s Oberflächenmontage (DE-588)4248071-1 s DE-604 Oberflächenmontiertes Bauelement (DE-588)4132685-4 s Löten (DE-588)4036162-7 s |
| spellingShingle | Lee, Ning-Cheng Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd Oberflächenmontage (DE-588)4248071-1 gnd Reflow-Löten (DE-588)4273607-9 gnd Löten (DE-588)4036162-7 gnd |
| subject_GND | (DE-588)4132685-4 (DE-588)4248071-1 (DE-588)4273607-9 (DE-588)4036162-7 |
| title | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies |
| title_auth | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies |
| title_exact_search | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies |
| title_full | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_fullStr | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_full_unstemmed | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_short | Reflow soldering processes and troubleshooting |
| title_sort | reflow soldering processes and troubleshooting smt bga csp and flip chip technologies |
| title_sub | SMT, BGA, CSP and flip chip technologies |
| topic | Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd Oberflächenmontage (DE-588)4248071-1 gnd Reflow-Löten (DE-588)4273607-9 gnd Löten (DE-588)4036162-7 gnd |
| topic_facet | Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering Oberflächenmontiertes Bauelement Oberflächenmontage Reflow-Löten Löten |
| work_keys_str_mv | AT leeningcheng reflowsolderingprocessesandtroubleshootingsmtbgacspandflipchiptechnologies |