Copper - fundamental mechanisms for microelectronic applications:
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
Wiley
2000
|
| Schriftenreihe: | A Wiley Interscience publication
|
| Schlagworte: | |
| Beschreibung: | XIX, 337 S. Ill., graph. Darst. |
| ISBN: | 0471252565 |
Internformat
MARC
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| 100 | 1 | |a Murarka, Shyam P. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Copper - fundamental mechanisms for microelectronic applications |c Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann |
| 264 | 1 | |a New York [u.a.] |b Wiley |c 2000 | |
| 300 | |a XIX, 337 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
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| 650 | 4 | |a Metallizing | |
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| 700 | 1 | |a Verner, Igor V. |e Verfasser |4 aut | |
| 700 | 1 | |a Gutmann, Ronald J. |e Verfasser |4 aut | |
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Datensatz im Suchindex
| _version_ | 1804128018072862720 |
|---|---|
| any_adam_object | |
| author | Murarka, Shyam P. Verner, Igor V. Gutmann, Ronald J. |
| author_facet | Murarka, Shyam P. Verner, Igor V. Gutmann, Ronald J. |
| author_role | aut aut aut |
| author_sort | Murarka, Shyam P. |
| author_variant | s p m sp spm i v v iv ivv r j g rj rjg |
| building | Verbundindex |
| bvnumber | BV013254652 |
| callnumber-first | T - Technology |
| callnumber-label | TK7871 |
| callnumber-raw | TK7871.85 |
| callnumber-search | TK7871.85 |
| callnumber-sort | TK 47871.85 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| ctrlnum | (OCoLC)42296592 (DE-599)BVBBV013254652 |
| dewey-full | 621.3815/2 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815/2 |
| dewey-search | 621.3815/2 |
| dewey-sort | 3621.3815 12 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV013254652 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:42:34Z |
| institution | BVB |
| isbn | 0471252565 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009034714 |
| oclc_num | 42296592 |
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| owner_facet | DE-703 |
| physical | XIX, 337 S. Ill., graph. Darst. |
| publishDate | 2000 |
| publishDateSearch | 2000 |
| publishDateSort | 2000 |
| publisher | Wiley |
| record_format | marc |
| series2 | A Wiley Interscience publication |
| spelling | Murarka, Shyam P. Verfasser aut Copper - fundamental mechanisms for microelectronic applications Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann New York [u.a.] Wiley 2000 XIX, 337 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier A Wiley Interscience publication Copper Metallizing Microelectronics Semiconductors Junctions Semiconductors Materials Kupfer (DE-588)4033734-0 gnd rswk-swf Chemische Eigenschaft (DE-588)4371174-1 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Physikalische Eigenschaft (DE-588)4134738-9 gnd rswk-swf Halbleiter (DE-588)4022993-2 gnd rswk-swf Metallisieren (DE-588)4169599-9 gnd rswk-swf Kupfer (DE-588)4033734-0 s Metallisieren (DE-588)4169599-9 s Halbleiter (DE-588)4022993-2 s Mikroelektronik (DE-588)4039207-7 s DE-604 Physikalische Eigenschaft (DE-588)4134738-9 s 1\p DE-604 Chemische Eigenschaft (DE-588)4371174-1 s 2\p DE-604 Verner, Igor V. Verfasser aut Gutmann, Ronald J. Verfasser aut 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Murarka, Shyam P. Verner, Igor V. Gutmann, Ronald J. Copper - fundamental mechanisms for microelectronic applications Copper Metallizing Microelectronics Semiconductors Junctions Semiconductors Materials Kupfer (DE-588)4033734-0 gnd Chemische Eigenschaft (DE-588)4371174-1 gnd Mikroelektronik (DE-588)4039207-7 gnd Physikalische Eigenschaft (DE-588)4134738-9 gnd Halbleiter (DE-588)4022993-2 gnd Metallisieren (DE-588)4169599-9 gnd |
| subject_GND | (DE-588)4033734-0 (DE-588)4371174-1 (DE-588)4039207-7 (DE-588)4134738-9 (DE-588)4022993-2 (DE-588)4169599-9 |
| title | Copper - fundamental mechanisms for microelectronic applications |
| title_auth | Copper - fundamental mechanisms for microelectronic applications |
| title_exact_search | Copper - fundamental mechanisms for microelectronic applications |
| title_full | Copper - fundamental mechanisms for microelectronic applications Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann |
| title_fullStr | Copper - fundamental mechanisms for microelectronic applications Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann |
| title_full_unstemmed | Copper - fundamental mechanisms for microelectronic applications Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann |
| title_short | Copper - fundamental mechanisms for microelectronic applications |
| title_sort | copper fundamental mechanisms for microelectronic applications |
| topic | Copper Metallizing Microelectronics Semiconductors Junctions Semiconductors Materials Kupfer (DE-588)4033734-0 gnd Chemische Eigenschaft (DE-588)4371174-1 gnd Mikroelektronik (DE-588)4039207-7 gnd Physikalische Eigenschaft (DE-588)4134738-9 gnd Halbleiter (DE-588)4022993-2 gnd Metallisieren (DE-588)4169599-9 gnd |
| topic_facet | Copper Metallizing Microelectronics Semiconductors Junctions Semiconductors Materials Kupfer Chemische Eigenschaft Mikroelektronik Physikalische Eigenschaft Halbleiter Metallisieren |
| work_keys_str_mv | AT murarkashyamp copperfundamentalmechanismsformicroelectronicapplications AT vernerigorv copperfundamentalmechanismsformicroelectronicapplications AT gutmannronaldj copperfundamentalmechanismsformicroelectronicapplications |