Third International Conference on Thin Film Physics and Applications: 15 - 17 April 1997 Shanghai, China
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Bibliographic Details
Corporate Author: International Conference on Thin Film Physics and Applications Schanghai (Author)
Format: Conference Proceeding Book
Language:English
Published: Bellingham, Wash. SPIE 1998
Series:SPIE proceedings series 3175
Subjects:
Physical Description:XXI, 476 S. Ill., graph. Darst.
ISBN:0819426733

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