Proceedings of the technical program: March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California
Gespeichert in:
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| Format: | Tagungsbericht Buch |
| Sprache: | English |
| Veröffentlicht: |
Northbrook, Ill.
IPC
2000
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| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Getr. Zählung Ill., graph. Darst. |
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| adam_text | ^PRINTED CIRCUITS IPC PRINTED CIRCUITS EXPO 2000 TECHNICAL PROCEEDINGS
APRIL 2-6, 2000 SAN DIEGO CONVENTION CENTER SAN DIEGO, CA REPUBLICATION
RIGHTS FOR ANY OF THE TECHNICAL PAPERS INCLUDED IN THESE PROCEEDINGS ARE
RETAINED BY THE AUTHORS AND/OR THEIR EMPLOYERS. PERMISSION TO REPRINT
MUST BE OBTAINED FROM THEM AND CREDIT MUST BE GIVEN TO THE APEX
CONFERENCE AND THESE PROCEEDINGS AS THE SOURCE. THE OPINIONS EXPRESSED
IN THE PROCEEDINGS ARE THOSE OF THE CONTRIBUTORS AND ARE NOT NECESSARILY
THOSE OF IPC. IPC DOES NOT UNDERTAKE TO RESEARCH, REVIEW OR OTHERWISE TO
VERIFY ANY OF THE INFORMATION CONTAINED IN THE PAPERS. IPC IS NOT
RESPONSIBLE FOR ERRORS OR FOR OPINIONS EXPRESSED IN THE PROCEEDINGS. ANY
QUESTIONS OR REQUESTS FOR ADDITIONAL INFORMATION CONCERNING ANY OF THE
PAPERS IN THE PROCEEDINGS SHOULD BE ADDRESSED DIRECTLY TO THE
CONTRIBUTORS. IPC EXPRESSLY DISCLAIMS ANY WARRANTIES OR GUARANTEES,
EXPRESS OR IMPLIED, AND SHALL NOT BE LIABLE FOR DAMAGES OF ANY KIND IN
CONNECTION WITH THE MATERIAL, INFORMATION, CONCLUSIONS, TECHNIQUES OR
PROCEDURES SET FORTH IN THE PROCEEDINGS. UB/TIB HANNOVER 121267 30X
PRINTED IN USA TABLE OF CONTENTS SESSION 01 - CLEANING / CLEANLINESS
SESSION LEADER: PAT KANE, CSL, INC. THE EFFECTS OF SOLDER MASK SELECTION
ON CLEANLINESS S01-1 DOUGLAS PAULS, CONTAMINATION STUDIES LABORATORIES
THE CONSEQUENCES OF IGNORING RESIDUES SO 1-2 DOUGLAS PAULS,
CONTAMINATION STUDIES LABORATORIES PCB CLEANING EQUIPMENT
CONFIGURATIONS, TECHNIQUES AND WHY CLEANING IS IMPORTANT S01-3 MARK
PALMER, ENVIRO SENSE INC. SESSION 02 - HDI IMAGING I SESSION LEADER:
MATS EHLIN, DUPONT PHOTOPOLYMERS & ELECTRONIC MATERIALS APPLICATION
TECHNOLOGIES FOR COATING LIQUID MICROVIA DIELECTRICS S02-1 TORSTEN
RECKERT, CIBA SPECIALTY CHEMICALS DIRECT IMAGING : WILL IT FLY OR NOT?
S02-2 CHRISTOPHE VOUCHER, DI WORK GROUP RESOLUTION OPTIMIZATION FOR STEP
AND REPEAT PROJECTION LITHOGRAPHY S02-3 MARVIN KILGO, TAMARACK
SCIENTIFIC CO. MIKE MOREAU, TAMARACK SCIENTIFIC CO. SESSION 03 -
SOLDERABILITY SURFACE FINISHES SESSION LEADER: FOSTER GRAY, PC
INTERCONNECTS RISK ASSESSMENT OF PRINTED WIRING BOARD ALTERNATIVE
FINISHES S03-1 JIMMY REED, RAYTHEON SYSTEMS COMPANY NOVEL IMMERSION TIN
FINISH FOR MULTIPLE SOLDERING OF SURFACE MOUNT PACKAGES S03-2 KULDIP
JOHAL, ATOTECH USA INC. HANS-JUERGEN SCHREIER, ATOTECH USA INC. OSPS:
ENABLING ADVANCED TECHNOLOGIES S03-3 KARL WENGENROTH, ENTHONE-OMI, INC.
ERIC STAFSTORM, ENTHONE-OMI, INC. PAGE I TABLE OF CONTENTS SESSION 04 -
QUALITY / RELIABILITY SESSION LEADER: EDWARD KELLEY, HADCO CORPORATION
THE EFFECTS OF SURFACE MORPHOLOGY OF ELECTROLESS NICKEL/IMMERSSION GOLD
DEPOSITS ON SOLDER BALL BONDING FOR BGA APPLICATIONS S04-1 ROBERT
SCHANDLER, UYEMURA INTENATIONAL CORPORATION KOJI MATSUI. UYEMURA
INTENATIONAL CORPORATION DON GUECZAUSKAS, UYEMURA INTENATIONAL
CORPORATION INFORMED CIRCUITS. ACCELERATED FAILURE ANALYSIS S04-2
OCTAVIAN IORDACHE, I IASYSTEMS INC JIANXIONG HIT, VIASYSLEMS INC.
THERMAL CHARACTERIZATION OF INTERNAL ELECTRIC? CONDUCTORS IN
MULTI-LAYER PRINTED WIRING BOARDS S04-3 MICHAEL JOUPPI, LOCKHEAD MARTIN
ASTRONAUTICS ROBERT MASON, LOCKHEAD MARTIN ASTRONAUTICS SESSION 05 -
INCREASING COMPETITIVENESS IN THE YEAR 2000 & BEYOND SEMIMAR SESSION
LEADER: RAY RASMUSSEN. INFO-ELEC USA PCB S IN THE THIRD MILLENIUM S05-1
WILLIAN MILLER. WHITELEYS STRATEGIC PLANNING FOR A GLOBAL INDUSTRY (AND
SOME SUGGESTIONS ON MAKING A PLAN WORK) S05-2 DAN FIENBERG, FEIN-LINE
ASSOCIATES E-COMMERCE AND THE PRINTED CIRCUIT BOARD INDUSTRY S05-3 BRIAN
HAKEN, PC IF SESSION 06 - ITRI PROJECT SESSION LEADERJACK FISHER. ITRI
ITRI HDI FINELINE TEAM RESULTS S06-1 ROLLAND SAVAGE. GOULD ELECTRONICS
PREDICTING RELIABILITY OF PRINTED WIRING BOARDS WITH VARIABLE PARAMETERS
USING FINITE ELEMENT MODELING S06-2 SHINE ROMINGER. XAVAL SURFACE LI
ARFARE CENTER PWB ELECTRICAL TEST CRITERIA ROADMAP S06-3 SABAHU DESAI.
IBM ITRI UNIFORM COPPER PLATING PROJECT S06-4 MARION GRAYBEAL. ITRI M G
COMSUHING. INC. PAGE II TABLE OF CONTENTS SESSION 07 - MATERIALS SESSION
LEADER: ERIC BERGUM, POLYCLAD LAMINATES, INC. IMPROVING PWB PRODUCTIVITY
BY REDUCING PROCESS CYCLE TIME S07-1 MARK TARDIBUONO, LSOLA LAMINATE
SYSTEMS CORP. THIN FILM SUBSTRATE FOR ADVANCED BGA APPLICATIONS S07-2
BILL CHOU, X-LAM TECHNOLOGIES SOLOMON BEILIN, X-LAM TECHNOLOGIES RAO
MAHIDHARA, X-LAM TECHNOLOGIES JAN STRANDBERG, X-LAM TECHNOLOGIES
ALLOWABLE COPPER THICKNESS RELATED TO FINE PITCH PATTERN FORMED BY
SUBTRACTIVE METHOD S07-3 TAKUYA YAMAMOTO, MITSUI MINING AND SMELTING
TAKASHI KATAOKA, MITSUI MINING AND SMELTING JOHN ANDRESAKIS, OAK MITSUI,
INC. THE FABRICATION OF HEATSINKS ON PCBS BY MEANS OF PRINT TECHNOLOGY
CHARACTERISTICS, APPLICATION, RATIONALISATION AND COST SAVING POTENTIAL
S07-4 SVEN KRAMER, LACKWERKE PETERS GMBH + CO KG MANFRED SUPPA,
LACKWERKE PETERS GMBH + CO KG IMPROVED LAMINATE AND INNERLAYER YIELDS
USING A NEW COPPER FOIL S07-5 ROBERT DEMAREE, POLYCLAD LAMINATES INC.
DONALD PUCCI, GOULD ELECTRONICS INC. PAGE IN TABLE OF CONTENTS SESSION
08 - EMBEDDED SUBSTRATES SESSION LEADER: YUEH-LING LEE, DUPONT HIGH
PERFORMANCE FILMS DEVELOPMENT OF A HIGH-K COMPOSITE FOR INTEGRAL
CAPACITORS S08-1 SATOSHI OGITANI, ASAHI CHEMICAL INDUSTRY CO., LTD. SUE
ANN BIDSTRUP ALLEN, GEORGIA INSTITUTE OF TECHNOLOGY PAUL KOHL, GEORGIA
INSTITUTE OF TECHNOLOGY NOVEL, PRACTICAL MATERIALS FOR EMBEDDED
CAPACITORS AND RESISTORS: A PROGRESS REPORT S08-2 EDWARD REARDON,
SHIPLEY COMPANY RICHARD CARPENTER, SHIPLEY COMPANY VERY LOW TEMPERATURE
THICK FILM COMPOSITIONS FOR PRINTING RESISTORS, CAPACITORS AND INDUCTORS
S08-3 PAUL KYDD, PARELEC INC. DAVID RICHARD, PARELEC INC. GREGORY
JABLONSKI, PARELEC INC. DEVELOPMENTS OF POLYIMIDE-BASED CAPACITORS AND
RESISTORS FOR INTEGRAL PASSIVES S08-4 GARY MIN, DUPONT I TECHNOLOGIES
SHANE FANG, DUPONT I TECHNOLOGIES YUEH-LING LEE, DUPONT I TECHNOLOGIES
CARL WANG, DUPONT I TECHNOLOGIES CALVIN DALRYMPLE, DUPONT I TECHNOLOGIES
EMBEDDED CERAMIC RESISTORS AND CAPACITORS FOR PWB S08-5 JOHN FELT EN,
DUPONT I-TECHNOLOGIES SAUL FERGUSON, DUPONT I-TECHNOLOGIES PERMITTIVITY
MEASUREMENTS OF HIGH DIELECTRIC CONSTANT FILMS AT MICROWAVE FREQUENCIES
S08-6 JAN OBRZUT, NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY R.
NOZAKI, NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY EMBEDDED PASSIVES
ELECTRICAL CHARACTERIZATION RESULTS S08-7 ISTVAN NOVAK, SUN
MICROSYSTEMS, INC. PAGE IV TABLE OF CONTENTS SESSION 09 - HDI SUBSTRATE
SESSION LEADER: CEFERINO GONZALEZ, E.I. DUPONT DE NEMOURS & CO.
SPECIALLY DEVELOPED GLASS FABRICS FOR ULTIMATE SMALL DIAMETER HOLE OF
HIGH DENSITY PACKAGE BOARD BY BUILD-UP METHOD S09-1 YASUYUKI KIMURA,
ASAHI-SCHWEBEL CO, LTD AN APPROACH TO FABRICATE HIGH DENSITY,
LARGE-LAYER-COUNT PWB S09-2 DEEPAK PAI, GENERAL DYNAMICS INFORMATION
SYSTEMS SOLID VIA INTERCONNECT TECHNOLOGY S09-3 ALLAN CHUA, GUL
TECHNOLOGIES SINGAPORE LTD. CHALLENGES AND EXPERIENCES WHEN MOVING TO
HIGH DENSITY INTERCONNECT PWB FABRICATION WITH MICROVIA HOLE TECHNOLOGY
S09-4 TARJA RAPALA, ASPOCOMP OY THE EVOLUTION AND CONTINUING DEVELOPMENT
OF ALIVH HIGH-DENSITY PRINTED WIRING BOARD S09-5 KAZUNORI SAKAMOTO,
MATSUSHITA ELECTRIC COMPONENTS CO., LTD SHINGO YOSHIDA, MATSUSHITA
ELECTRIC COMPONENTS CO., LTD KAZUYOSHI FUKUOKA, MATSUSHITA ELECTRIC
COMPONENTS CO., LTD DAIZO ANDO, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD
THERMAL RELIABILITY OF LASER ABLATED MICROVIAS AND STANDARD THROUGH-HOLE
TECHNOLOGIES AS A FUNCTION OF MATERIALS AND PROCESSING (ONE PAPER, TWO
PART PRESENTATION. SEE S15-1) S09-6 TODD YOUNG, ISOLA LAMINATE SYSTEMS
CORP. FRANK POLAKOVIC, ELECTROCHEMICALS INC. MICHAEL CARANO,
ELECTROCHEMICALS INC. PAGE V TABLE OF CONTENTS SESSION 10 - PROCESS
CONTROL SESSION LEADER: LINDA SELF LITTON SYSTEMS RECOMMENDED METHOD FOR
TESTING PHOTORESIST LEACHING INTO PLATING BATHS S10-1 SIDNEY COX, DUPONT
PRINTED CIRCUIT MATERIALS DAVID MCGREGOR, DUPONT PRINTED CIRCUIT
MATERIALS NEURAL NETWORK ANALYSIS IN THE DEVELOPMENT OF HORIZONTAL
PROCESSING OF BLIND VIAS S10-2 JOHN BLADON, SHIPLEY RONAL THE
COMPENSATION PROBLEM AND SOLUTION USING DESIGN OF EXPERIMENTS FOR DENSE
MULTILAYER PRINTED CIRCUIT BOARDS S10-3 WILLIAM GRAY MCQUARRIE, ISOLA
LAMINATE SYSTEMS CORP. CIRCUIT-BOARD MOISTURE SENSITIVITY AND STAINING
AT THE OXIDE INTERFACE: A COMPARISON OF MATERIALS AND DISCUSSION OF
POSSIBLE MECHANISMS SI0-4 DAVID LUTTRULL, PARK ELECTROCHEMICAL
CORPORATION GARY BURR, PARK ELECTROCHEMICAL CORPORATION JOSEPH BAULER,
PARK ELECTROCHEMICAL CORPORATION VOC CONSIDERATIONS IN PRINTED BOARD
FABRICATION PROCESS CHEMISTRY SI0-5 MARC CARTER, RBP CHEMICALS SESSION
11 - HDI DESIGN & FABRICATION SESSIONLEADER.LARRY BURGESS,
MICROPAKLABORITORIES CALCULATION OF THE DIFFERENTIAL IMPEDANCE OF TRACKS
ON FR4 SUBSTRATES SI 1-1 ALAN STANIFORTH, POLAR INSTRUMENTS INC. GARY
RICH, POLAR INSTRUMENTS INC. CHRIS GREGG, POLAR INSTRUMENTS INC.
PREDICTING HDI DESIGN DENSITY SLL-2 HAPPY HOLDEN, TECHLEAD CORPORATION
RICHARD CHARBONNEAU, STORAGETEK INTEGRATED SIGNAL INTEGRITY SIMULATION
THROUGH THE PRODUCT DEVELOPMENT CYCLE SI 1-3 PAUL FLEMING, VERIBEST PAGE
VI TABLE OF CONTENTS SESSION 12 - HDI IMAGING II SESSION LEADER: MATS
EHLIN, DUPONT PHOTOPOLYMERS & ELECTRONIC MATERIALS LASER DIRECT IMAGING
- TRENDS FOR THE NEXT GENERATION OF HIGH PERFORMANCE RESISTS FOR
ELECTRONIC PACKAGING S12-1 MARK MCKEEVER, DUPONT TECHNOLOGIES MEETING
HDI RESOLUTION AND REGISTRATION REQUIREMENTS S12-2 BERT OHLIG, OLEC
CORPORATION THERMAL DIRECT IMAGING AND HDI - ADVANCED REGISTRATION
ACCURACY AND HIGH YIELDS WITH CONVENTIONAL DES PROCESS S12-3 GADI
TERLIUC, CREO LTD. HAI BENRON, CREO LTD. SI 2-4 DIRECT IMAGING
IMPLEMENTATION: REAL WORLD CASE STUDIES SCOTT WAXIER, ORBOTECH, INC.
SHAVI SPINZI, ORBOTECH LTD. SESSION 13 - ELECTRICAL TEST SESSION
LEADER.BRYAN FRANKLIN, FCC VERTICAL PROBING - AN ADVANCED TECHNOLOGY FOR
TESTING VERY HIGH-DENSITY BAREPCB S S13-1 KARL ZIMMERMANN, CK
TECHNOLOGIES, INC. EXTREMELY FINE PITCH ELECTRICAL TEST TECHNIQUE .
S13-2 DENNIS MCCABE, W. M. HAGUE COMPANY NEW TECHNOLOGIES FOR ELECTRICAL
TESTING: PWB COST IMPACT S13-3 CHRISTOPHE VOUCHER, BBT WORK GROUP TEST
FLOOR INTEGRATION S13-4 LINO SOUSA, MICROCRAFT SESSION 14- FLEX SESSION
LEADER: TOM GARDESKI, E. I. DUPONT DE NEMOURS & CO. AUTOMATED OPTICAL
INSPECTION OF ROLL TO ROLL FLEXIBLE CIRCUITS & HIGH DENSITY
INTERCONNECT: TECHNOLOGY ADVANCEMENTS AND APPLICATION S14-1 DAVID
HOOVER, FOCUS AOI BRIAN TITHECOTT, FOCUS AOI FLYING LEADS TECHNOLOGIES
FOR HIGH DENSITY FLEX CIRCUITS S14-2 STEVE KENNEY, PARLEX CORPORATION
DARRYL MCKENNY, PARLEX CORPORATION DOMINIQUE NUMAKURA, PARLEX
CORPORATION PAGE VII TABLE OF CONTENTS SESSION 15 - HDI TECH SOLUTIONS
SESSION LEADER: GENE WEINER, WEINER & ASSOCIATES INC. THERMAL
RELIABILITY OF LASER ABLATED MICROVIAS AND STANDARD THROUGH-HOLE
TECHNOLOGIES AS A FUNCTION OF MATERIALS AND PROCESSING- PART II ONE
PAPER, TWO PART PRESENTAION (SAME PAPER AS IN S09-6) S15-1 TODD YOUNG,
ISOLA LAMINATE SYSTEMS CORP. FRANK POLAKOVIC, ELECTROCHEMICALS INC.
MICHAEL CARANO, ELECTROCHEMICALS INC MICRO-PERFORATION: A NOVEL METHOD
FOR THE FORMATION OF MICROVIAS S15-2 WALTER SCHMIDT, DYCONEX LTD.
APPLICATION OF CM-ECD PROCESS FOR HDI PWBS S15-3 JENNINGS TAYLOR,
FARADAY TECHNOLOGY, INC. JENNY J. SUN, FARADAY TECHNOLOGY, INC. MARIA
INMAN, FARADAY TECHNOLOGY, INC. LARRY ZHANG, FUJITSU COMPUTER PACKAGING
TECHNOLOGY AUTOMATICALLY INSPECTING MICROVIAS S15-4 MARK OWEN, MV
TECHNOLOGY HIGH QUALITY MICROVIA FORMATION WITH IMAGE UV YAG LASERS
S15-5 COREY DUNSKY, ELECTRO SCENTIFIC INDUSTRIES HISASHI MATSUMOTO,
ELECTRO SCENTIFIC INDUSTRIES BONNIE LARSON, ELECTRO SCENTIFIC INDUSTRIES
HORIZONTAL ELECTROLESS COPPER METALLIZATION OF MATERIALS FOR HIGH
DENSITY INTERCONNECT TECHNOLOGY S15-6 JOHN GRAVES, SHIPLEY RONAL MARK
POOLE, SHIPLEY RONAL DAVID OGLESBY, SHIPLEY RONAL SESSION 16 - NON
HALOGENATED SUBSTRATES SESSION LEADER: DOUG SOBER, POLYCLAD LAMINATES
INC REGULATORY STATUS OF THE FLAME RETARDANT TETRABROMOBISPHENOL A S16-1
MARCIA HARDY, ALBEMARLE CORPORATION HALOGEN FREE BASE MATERIALS FOR PWB
APPLICATIONS S16-2 MANFRED CYGON, ISOLA AG MARC HEIN, ISOLA LAMINATE
SYSTEMS CORP. MARTY CHAOTE, ISOLA LAMINATE SYSTEMS CORP. ENVIRONMENTAL
FRIENDLY MATERIALS AND LEAD-FREE S16-3 NOBUYUKI HONDA, TOSHIBA CHEMICAL
CORP NEW HALOGEN-FREE MATERIALS FOR PWB, HDI AND ADVANCED PACKAGE
SUBSTRATE S16-4 HIKARI MURAL, HITACHI CHEMICAL CO.. LTD YOSHIYUKI
TAKEDA, HITACHI CHEMICAL CO , LTD NOZOMU TAKANO, HITACHI CHEMICAL CO., L
TD KEN IKEDA. HITACHI CHEMICAL CO AMERICA, LTD PAGE VIII
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| spelling | APEX 1 2000 Long Beach, Calif. Verfasser (DE-588)1901978-6 aut Proceedings of the technical program March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California APEX, Electronics Assembly Process Exhibition Conference Proceedings of the technical conference Northbrook, Ill. IPC 2000 Getr. Zählung Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 2000 Long Beach Calif. gnd-content Integrierte Schaltung (DE-588)4027242-4 s DE-604 GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008998451&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
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| title | Proceedings of the technical program March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California |
| title_alt | Proceedings of the technical conference |
| title_auth | Proceedings of the technical program March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California |
| title_exact_search | Proceedings of the technical program March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California |
| title_full | Proceedings of the technical program March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California APEX, Electronics Assembly Process Exhibition Conference |
| title_fullStr | Proceedings of the technical program March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California APEX, Electronics Assembly Process Exhibition Conference |
| title_full_unstemmed | Proceedings of the technical program March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California APEX, Electronics Assembly Process Exhibition Conference |
| title_short | Proceedings of the technical program |
| title_sort | proceedings of the technical program march 14 16 2000 long beach convention center long beach california |
| title_sub | March 14 - 16, 2000, Long Beach Convention Center, Long Beach, California |
| topic | Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | Integrierte Schaltung Konferenzschrift 2000 Long Beach Calif. |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008998451&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT apexlongbeachcalif proceedingsofthetechnicalprogrammarch14162000longbeachconventioncenterlongbeachcalifornia AT apexlongbeachcalif proceedingsofthetechnicalconference |