Semiconductor wafer bonding: science, technology, and applications V: proceedings of the international symposia
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Pennington, NJ
Electrochemical Soc.
2001
|
| Schriftenreihe: | Proceedings / Electrochemical Society
1999,35 |
| Schlagworte: | |
| Beschreibung: | X, 480 S. Ill., graph. Darst. |
| ISBN: | 1566772583 |
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| id | DE-604.BV013166891 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:40:09Z |
| institution | BVB |
| isbn | 1566772583 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008970136 |
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| physical | X, 480 S. Ill., graph. Darst. |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | Electrochemical Soc. |
| record_format | marc |
| series2 | Proceedings / Electrochemical Society |
| spelling | Semiconductor wafer bonding: science, technology, and applications V proceedings of the international symposia ed. Charles E. Hunt ... Pennington, NJ Electrochemical Soc. 2001 X, 480 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Proceedings / Electrochemical Society 1999,35 Wafer (DE-588)4294605-0 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1999 Honolulu Hawaii gnd-content Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s DE-604 Hunt, Charles E. Sonstige oth Electrochemical Society Proceedings 1999,35 (DE-604)BV001900941 1999,35 |
| spellingShingle | Semiconductor wafer bonding: science, technology, and applications V proceedings of the international symposia Wafer (DE-588)4294605-0 gnd Bonden (DE-588)4232594-8 gnd |
| subject_GND | (DE-588)4294605-0 (DE-588)4232594-8 (DE-588)1071861417 |
| title | Semiconductor wafer bonding: science, technology, and applications V proceedings of the international symposia |
| title_auth | Semiconductor wafer bonding: science, technology, and applications V proceedings of the international symposia |
| title_exact_search | Semiconductor wafer bonding: science, technology, and applications V proceedings of the international symposia |
| title_full | Semiconductor wafer bonding: science, technology, and applications V proceedings of the international symposia ed. Charles E. Hunt ... |
| title_fullStr | Semiconductor wafer bonding: science, technology, and applications V proceedings of the international symposia ed. Charles E. Hunt ... |
| title_full_unstemmed | Semiconductor wafer bonding: science, technology, and applications V proceedings of the international symposia ed. Charles E. Hunt ... |
| title_short | Semiconductor wafer bonding: science, technology, and applications V |
| title_sort | semiconductor wafer bonding science technology and applications v proceedings of the international symposia |
| title_sub | proceedings of the international symposia |
| topic | Wafer (DE-588)4294605-0 gnd Bonden (DE-588)4232594-8 gnd |
| topic_facet | Wafer Bonden Konferenzschrift 1999 Honolulu Hawaii |
| volume_link | (DE-604)BV001900941 |
| work_keys_str_mv | AT huntcharlese semiconductorwaferbondingsciencetechnologyandapplicationsvproceedingsoftheinternationalsymposia |