Molded interconnect devices: 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings]
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Bamberg
Meisenbach
1998
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | 334 S. Ill., graph. Darst. |
| ISBN: | 3875251113 |
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Datensatz im Suchindex
| _version_ | 1804127818758488064 |
|---|---|
| adam_text | TABLE
OF
CONTENTS
Tasks and Objectives of the Research Association
Three-Dimensional Electronic Assemblies
(3-D
MID)
e.V. .....................1
Introduction: MID
-
Entering Markets by Products and Technologies
........5
Prof. Dr.-lng. K.
Feldmann -
FAPS, Univ. of
Erlangen-Nürnberg (D)
Integration of Electronics and Mechanics
-...............................19
Increasing Potentials of MID for Vehicle Construction
Dr.
R
Thoma
-
BMW
AG, München
(D)
Part
1.
MARKET AND PROJECT REALISATION
MID Wide Band Helix Antenna for PDC Diversity
...........................27
B. Davidson
-
Nokia Ltd., Camberley Surrey (UK)
S. Cashmore
-
Nokia Ltd., Camberley Surrey (UK)
T.
Ichige -
Hitachi Cable, Tokyo (J)
Taking a Systems Approach to MID Design
..................................35
E. R
Geoca
-
MID LLC, Rochester (USA)
Project-Management of Two-Shot MIDs
.................................43
V.
Zippmann -
Buss
Werkstofftechnik GmbH &
Co. KG,
Münzenberg (D)
Part
2.
APPLICATIONS I
Connector-PCB for
Anti
-Blocking-Systems
.............................51
Dr. E.
Maaßen -
AHC
Oberflächentechnik
GmbH
&
Co. OHG, Kerpen (D)
J. Gleixner
-
Inotech
Kunststofftechnik GmbH, Nabburg (D)
Headlight-Distance Regulation in MID-Technology
.......................63
W. Wolf
-
MOS
GmbH
&
Co., Ansbach (D)
Integrated Automotive Module in MID-Technology
........................71
J. Fricke
-
Motorola AIEG, Stotfold
(GB)
F.
Stolí
-
FAPS, Univ.
Erlangen-Nürnberg
(D)
F. Pöhlau - FAPS, Univ. Erlangen-Nürnberg (D)
Part
3.
APPLICATIONS II
Comparison of alternative MID-Technologies for the Production
...........81
of SMT
Multi
-Coaxial-Connectors
R. Sander
-
Siemens
AG,
Speyer (D)
B. Houtteman
-
Siemens N.V.,
Oostkamp
(В)
A Green TV performed in MID
............................................93
Dr. R. Winghofer
-
Grundig
GFV GmbH,
Fürth (D)
MID Technology for Power Modules, demonstrated on
....................105
Examples of the Project: Green TV
Dr. H. O. Haller
-
Dt. Thomson-Brandt GmbH, Villingen-Schwenningen (D)
Part
4.
DESIGN
&
IMPLEMENTATION STRATEGY
Integrating the Design Process for
3-D
Molded Interconnects
................119
K. Heitmann
-
Pitney Bowes Corp., Shelton (USA)
B. Inpyn
-
Pitney Bowes Corp., Shelton (USA)
An MID Design System for Electronic Products
...........................131
A. Cutler
-
Zuken-Redac, Bristol
(GB)
Dr.-lng. T.
Krebs -
Zuken-Redac,
Nürnberg
(D)
Decision-Fundamentals for the Introduction of MID-Technology
.........141
F. Pöhlau - 3-D
MID
e.V., Erlangen
(D)
MID
-
JOINT RESEARCH VENTURE
Survey for the BMBF Joint Research Project
(19
companies,
5
institutes)
New Material and Production Technologies for Integration
...............153
of Mechanical and Electrical Functions in three-dimensional
Injection Molded Parts
R. Kleinert
-
Siemens
AG,
Berlin (D)
Dr. H.-J.
Albrecht
-
Siemens
AG,
Berlin (D)
С
Wegener
-
Siemens
AG,
Berlin (D)
J.
Kickelhain -
LPKF Laser and Electronics GmbH, Garbsen(D)
Prof. Dr.-lng. Dr. h.c. G. W.
Ehrenstein -
LKT, Univ.
Erlangen-Nürnberg
(D)
S.
Stampfer -
LKT, Univ.
Erlangen-Nürnberg
(D)
Part
5.
PRODUCTION AND METALLISATION
NEWS in Two Shot molding technology for
3D
MIDs
......................163
Dr. M.
Römer - Ticona
GmbH, Frankfurt (D)
Metallisation of Plastics for MID Applications
............................177
S.
Stampfer -
LKT, Univ.
Erlangen-Nürnberg
(D)
N. Hallschmid -
LKT, Univ.
Erlangen-Nürnberg
(D)
Prof. Dr.-Ing. Dr. h.c.
G.W. Ehrenstein -
LKT, Univ.
Erlangen-Nürnberg
(D)
Developing WIID-Prototypes Successfully
................................189
M.
Spiegel
-
Spitfire, Elgin (USA)
New Two-Shot Process
................................................191
T. Yumoto
-
Sankyo Kasei Co. Ltd., Tokyo (J)
Part
6.
STRUCTURING
Selective Metallisation by UV Treatment of Plastics
.......................199
S.
Beil -
FhG-ILT, Aachen (D)
H. Horn
-
FhG-ILT, Aachen (D)
K. Pochner
-
FhG-ILT, Aachen (D)
Primer Technology
-
A New Approach for Selective Metallisation
.........211
Dr. W. John
-
Techno Finish GmbH,
Seebach (D)
Laser Exposure of Photoresists and their Application in the
................. 217
Manufacturing of MIDs
G.
Eßer -
LFT, Univ.
Erlangen-Nürnberg
(D)
S.
Roth -
LFT, Univ.
Erlangen-Nürnberg
(D)
Part
7.
JOINING
TECHNIQUES
I
Alternative SMD Placement Systems for
.................................229
Three Dimensional Circuit Boards
S.
Krimi
-
FAPS, Univ.
Erlangen-Nürnberg
(D)
UV-curable Conductive Adhesives for 3-MID Application
................241
A. Battermann
- Panacol-Elosol GmbH, Oberursel
(D)
Soldering on Plastics
...................................................251
S. Pongratz
-
LKT, Univ.
Erlangen-Nürnberg
(D)
Prof. Dr.-Ing. Dr. h.c. G.W. Ehrenstein - LKT, Univ. Erlangen-Nürnberg (D)
Simultaneous
Laser
Soldering of SMDs: A New Approach for MIDs
........265
S. Hier!
-
LFT, Univ.
Erlangen-Nürnberg
(D)
W.
Hirt -
Seno GmbH,
Wertheim
(D)
пі
Part
8.
JOINING TECHNIQUES II
Potential of Low Melting Point Solders for
................................277
Low-Cost MID Applications
M. Reichenberger
-
FAPS, Univ.
Erlangen-Nürnberg
(D)
Optimising the Soldering of SMD-Components onto
M
IDs by
.............289
Using Simulation
Dr. J. Niemeier
-
ATN GmbH, Berlin (D)
Prof. Dr.-Ing. G.
Seliger - TU
Berlin
(D)
Fully Automated Quality Assurance Tools for
.............................301
Laser Beam Joining of SMT Devices
J. Brassel
-
LFT, Univ.
Erlangen-Nürnberg
(D)
F. Breitenbach - LFT, Univ. Erlangen-Nürnberg (D)
M. Schmidt - LFT, Univ. Erlangen-Nürnberg (D)
Process Diagnostics for
Laser ..........................................313
Soldering of Fine-Pitch Components on MIDs
T.
Fröhlich -
LFT, Univ.
Erlangen-Nürnberg
(D)
M.
Fleckenstein - LFT, Univ. Erlangen—Nürnberg (D)
Solders for
MID-Application -
Loads,
Limits,
Reliability
..................325
M. Dittes
- LMW, Univ. Bayreuth (D)
C.E. Reitlinger - LMW, Univ. Bayreuth (D)
Prof. Dr.
-Ing.
H.W. Bergmann - LMW, Univ. Bayreuth (D)
iv
|
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| id | DE-604.BV013119737 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:39:24Z |
| institution | BVB |
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| isbn | 3875251113 |
| language | English |
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| spelling | Molded interconnect devices 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] MID '98. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Klaus Feldmann ... MID '98 Bamberg Meisenbach 1998 334 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd rswk-swf Spritzgussteil (DE-588)4182581-0 gnd rswk-swf Technische Innovation (DE-588)4431027-4 gnd rswk-swf Integriertes Bauelement (DE-588)4161936-5 gnd rswk-swf Verdrahtung (DE-588)4187633-7 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1998 Erlangen gnd-content Integriertes Bauelement (DE-588)4161936-5 s Spritzgussteil (DE-588)4182581-0 s DE-604 Verdrahtung (DE-588)4187633-7 s Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 s Technische Innovation (DE-588)4431027-4 s Feldmann, Klaus Sonstige oth MID 3 1998 Erlangen Sonstige (DE-588)5348537-3 oth Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008938409&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Molded interconnect devices 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd Spritzgussteil (DE-588)4182581-0 gnd Technische Innovation (DE-588)4431027-4 gnd Integriertes Bauelement (DE-588)4161936-5 gnd Verdrahtung (DE-588)4187633-7 gnd |
| subject_GND | (DE-588)4550503-2 (DE-588)4182581-0 (DE-588)4431027-4 (DE-588)4161936-5 (DE-588)4187633-7 (DE-588)1071861417 |
| title | Molded interconnect devices 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] |
| title_alt | MID '98 |
| title_auth | Molded interconnect devices 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] |
| title_exact_search | Molded interconnect devices 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] |
| title_full | Molded interconnect devices 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] MID '98. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Klaus Feldmann ... |
| title_fullStr | Molded interconnect devices 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] MID '98. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Klaus Feldmann ... |
| title_full_unstemmed | Molded interconnect devices 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] MID '98. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Klaus Feldmann ... |
| title_short | Molded interconnect devices |
| title_sort | molded interconnect devices 3 international congress in erlangen germany 23 24 september 1998 proceedings |
| title_sub | 3. international congress in Erlangen, Germany, 23. - 24. September 1998 ; [proceedings] |
| topic | Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd Spritzgussteil (DE-588)4182581-0 gnd Technische Innovation (DE-588)4431027-4 gnd Integriertes Bauelement (DE-588)4161936-5 gnd Verdrahtung (DE-588)4187633-7 gnd |
| topic_facet | Dreidimensionaler spritzgegossener Schaltungsträger Spritzgussteil Technische Innovation Integriertes Bauelement Verdrahtung Konferenzschrift 1998 Erlangen |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008938409&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT feldmannklaus moldedinterconnectdevices3internationalcongressinerlangengermany2324september1998proceedings AT miderlangen moldedinterconnectdevices3internationalcongressinerlangengermany2324september1998proceedings AT feldmannklaus mid98 AT miderlangen mid98 |