(1995). Cooling and thermal design of electronic systems: Transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California. American Soc. of Mechanical Engineers.
Chicago Style (17th ed.) CitationCooling and Thermal Design of Electronic Systems: Transitional and Low Reynolds Number Turbulent Forced Convection in Electronics Cooling, High Heat Flux Heat Exchangers/cold Plates for Cooling of Electronics, Thermal Management, Application of CAE/CAD to Electronic Systems ; Presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California. New York, N.Y: American Soc. of Mechanical Engineers, 1995.
MLA (9th ed.) CitationCooling and Thermal Design of Electronic Systems: Transitional and Low Reynolds Number Turbulent Forced Convection in Electronics Cooling, High Heat Flux Heat Exchangers/cold Plates for Cooling of Electronics, Thermal Management, Application of CAE/CAD to Electronic Systems ; Presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California. American Soc. of Mechanical Engineers, 1995.