Cooling and thermal design of electronic systems: transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York, N.Y.
American Soc. of Mechanical Engineers
1995
|
| Schriftenreihe: | American Society of Mechanical Engineers / Heat Transfer Division: HTD
319 American Society of Mechanical Engineers / Electrical and Electronic Packaging Division: EEP 15 |
| Schlagworte: | |
| Beschreibung: | VI, 233 S. Ill., graph. Darst. |
| ISBN: | 0791817539 |
Internformat
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| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
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| id | DE-604.BV012789563 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:33:43Z |
| institution | BVB |
| institution_GND | (DE-588)5233049-7 |
| isbn | 0791817539 |
| language | English |
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| physical | VI, 233 S. Ill., graph. Darst. |
| publishDate | 1995 |
| publishDateSearch | 1995 |
| publishDateSort | 1995 |
| publisher | American Soc. of Mechanical Engineers |
| record_format | marc |
| series2 | American Society of Mechanical Engineers / Heat Transfer Division: HTD American Society of Mechanical Engineers / Electrical and Electronic Packaging Division: EEP |
| spelling | Cooling and thermal design of electronic systems transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California ed. by Cristina H. Amon ... New York, N.Y. American Soc. of Mechanical Engineers 1995 VI, 233 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier American Society of Mechanical Engineers / Heat Transfer Division: HTD 319 American Society of Mechanical Engineers / Electrical and Electronic Packaging Division: EEP 15 Electronic apparatus and appliances Cooling Congresses Electronic apparatus and appliances Thermal properties Congresses Electronic systems Cooling Congresses (DE-588)1071861417 Konferenzschrift gnd-content Amon, Cristina H. Sonstige oth International Mechanical Engineering Congress and Exposition 1995 San Francisco, Calif. Sonstige (DE-588)5233049-7 oth Heat Transfer Division: HTD American Society of Mechanical Engineers 319 (DE-604)BV001895916 319 Electrical and Electronic Packaging Division: EEP American Society of Mechanical Engineers 15 (DE-604)BV012594760 15 |
| spellingShingle | Cooling and thermal design of electronic systems transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California Electronic apparatus and appliances Cooling Congresses Electronic apparatus and appliances Thermal properties Congresses Electronic systems Cooling Congresses |
| subject_GND | (DE-588)1071861417 |
| title | Cooling and thermal design of electronic systems transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California |
| title_auth | Cooling and thermal design of electronic systems transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California |
| title_exact_search | Cooling and thermal design of electronic systems transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California |
| title_full | Cooling and thermal design of electronic systems transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California ed. by Cristina H. Amon ... |
| title_fullStr | Cooling and thermal design of electronic systems transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California ed. by Cristina H. Amon ... |
| title_full_unstemmed | Cooling and thermal design of electronic systems transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California ed. by Cristina H. Amon ... |
| title_short | Cooling and thermal design of electronic systems |
| title_sort | cooling and thermal design of electronic systems transitional and low reynolds number turbulent forced convection in electronics cooling high heat flux heat exchangers cold plates for cooling of electronics thermal management application of cae cad to electronic systems presented at the 1995 asme international mechanical engineering congress and exposition november 12 17 1995 san francisco california |
| title_sub | transitional and low Reynolds number turbulent forced convection in electronics cooling, high heat flux heat exchangers/cold plates for cooling of electronics, thermal management, application of CAE/CAD to electronic systems ; presented at The 1995 ASME International Mechanical Engineering Congress and Exposition, November 12 - 17, 1995, San Francisco, California |
| topic | Electronic apparatus and appliances Cooling Congresses Electronic apparatus and appliances Thermal properties Congresses Electronic systems Cooling Congresses |
| topic_facet | Electronic apparatus and appliances Cooling Congresses Electronic apparatus and appliances Thermal properties Congresses Electronic systems Cooling Congresses Konferenzschrift |
| volume_link | (DE-604)BV001895916 (DE-604)BV012594760 |
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