Advanced electronic packaging: with emphasis on multichip modules
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York
IEEE Press
1999
|
| Schriftenreihe: | IEEE Press series on microelectronic systems
|
| Schlagworte: | |
| Beschreibung: | Literaturangaben |
| Beschreibung: | XXXII, 791 S. Ill., graph. Darst. |
| ISBN: | 0780347005 |
Internformat
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| 245 | 1 | 0 | |a Advanced electronic packaging |b with emphasis on multichip modules |c ed. by William D. Brown |
| 264 | 1 | |a New York |b IEEE Press |c 1999 | |
| 300 | |a XXXII, 791 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a IEEE Press series on microelectronic systems | |
| 500 | |a Literaturangaben | ||
| 650 | 4 | |a Microelectronic packaging | |
| 650 | 4 | |a Multichip modules (Microelectronics) |x Design and construction | |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verpackung |0 (DE-588)4063118-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronische Schaltung |0 (DE-588)4113419-9 |2 gnd |9 rswk-swf |
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| 689 | 0 | 1 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
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| 689 | 1 | 1 | |a Verpackung |0 (DE-588)4063118-7 |D s |
| 689 | 1 | |5 DE-604 | |
| 700 | 1 | |a Brown, William Donald |e Sonstige |4 oth | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-008697490 | ||
Datensatz im Suchindex
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| building | Verbundindex |
| bvnumber | BV012787912 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4100 |
| ctrlnum | (OCoLC)246445523 (DE-599)BVBBV012787912 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV012787912 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:33:41Z |
| institution | BVB |
| isbn | 0780347005 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008697490 |
| oclc_num | 246445523 |
| open_access_boolean | |
| owner | DE-29T DE-859 |
| owner_facet | DE-29T DE-859 |
| physical | XXXII, 791 S. Ill., graph. Darst. |
| publishDate | 1999 |
| publishDateSearch | 1999 |
| publishDateSort | 1999 |
| publisher | IEEE Press |
| record_format | marc |
| series2 | IEEE Press series on microelectronic systems |
| spelling | Advanced electronic packaging with emphasis on multichip modules ed. by William D. Brown New York IEEE Press 1999 XXXII, 791 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier IEEE Press series on microelectronic systems Literaturangaben Microelectronic packaging Multichip modules (Microelectronics) Design and construction Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Verpackung (DE-588)4063118-7 gnd rswk-swf Elektronische Schaltung (DE-588)4113419-9 gnd rswk-swf Elektronische Schaltung (DE-588)4113419-9 s Gehäuse (DE-588)4156307-4 s DE-604 Elektronisches Bauelement (DE-588)4014360-0 s Verpackung (DE-588)4063118-7 s Brown, William Donald Sonstige oth |
| spellingShingle | Advanced electronic packaging with emphasis on multichip modules Microelectronic packaging Multichip modules (Microelectronics) Design and construction Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd Verpackung (DE-588)4063118-7 gnd Elektronische Schaltung (DE-588)4113419-9 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4156307-4 (DE-588)4063118-7 (DE-588)4113419-9 |
| title | Advanced electronic packaging with emphasis on multichip modules |
| title_auth | Advanced electronic packaging with emphasis on multichip modules |
| title_exact_search | Advanced electronic packaging with emphasis on multichip modules |
| title_full | Advanced electronic packaging with emphasis on multichip modules ed. by William D. Brown |
| title_fullStr | Advanced electronic packaging with emphasis on multichip modules ed. by William D. Brown |
| title_full_unstemmed | Advanced electronic packaging with emphasis on multichip modules ed. by William D. Brown |
| title_short | Advanced electronic packaging |
| title_sort | advanced electronic packaging with emphasis on multichip modules |
| title_sub | with emphasis on multichip modules |
| topic | Microelectronic packaging Multichip modules (Microelectronics) Design and construction Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd Verpackung (DE-588)4063118-7 gnd Elektronische Schaltung (DE-588)4113419-9 gnd |
| topic_facet | Microelectronic packaging Multichip modules (Microelectronics) Design and construction Elektronisches Bauelement Gehäuse Verpackung Elektronische Schaltung |
| work_keys_str_mv | AT brownwilliamdonald advancedelectronicpackagingwithemphasisonmultichipmodules |