Micro-system technologies 98:
Saved in:
| Format: | Conference Proceeding Book |
|---|---|
| Language: | German |
| Published: |
Berlin [u.a.]
VDE-Verl.
1998
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| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Item Description: | Literaturangaben |
| Physical Description: | 756 S. Ill., graph. Darst. |
| ISBN: | 3800724219 |
Staff View
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Record in the Search Index
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| adam_text | HERBERT REICHL * ERNST OBERMEIER (EDITORS) ICRO SYSTEM TECHNOLOGIES 98
6TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO, OPTO, MECHANICAL SYSTEMS
AND COMPONENTS POTSDAM, DECEMBER 1 - 3, 1998 ^LIYR-M-;! :-;*, ,VR:J C
THEK INFORMATIONSBIBLIOTHEK VDE-VERLAG GMBH * BERLIN * OFFENBACH TABLE
OF CONTENTS OPENING PLENARY TALKS CHAIRMEN: HERBERT REICHL, FHG-IZM,
BERLIN, GERMANY ERNST OBERMEIER, TU BERLIN, GERMANY STRATEGIES FOR LIGA
IMPLEMENTATION 25 V. SAILE, FORSCHUNGSZENTRUM KARLSRUHE GMBH, GERMANY
MICROMACHINING IN MECHATRONICS 31 Y. MIZUGAKI, KYUSHU INSTITUTE OF
TECHNOLOGY, KITAKYUSHU, JAPAN NEW TRENDS IN MICRO SYSTEM TECHNOLOGIES 37
N. F. DE ROOIJ, UNIVERSITY OF NEUCHATEL, SWITZERLAND MICROSYSTEMS IN
AUTOMOTIVE APPLICATIONS 43 J. MAREK, ROBERT BOSCH GMBH, REUTLINGEN,
GERMANY MEMS ACTIVITIES IN THE US 51 K. W. MARKUS, MCNC MEMS TECHNOLOGY
APPLICATIONS CENTER, USA PLENARY SESSION CHAIRMEN: WEN H. KO, CASE
WESTERN UNIVERSITY, CLEVELAND, USA ANTONIO PAOLETTI, UNIVERSITY OF ROME,
ITALY OPTICAL SENSORS AND DEVICES FOR TELECOMMUNICATIONS BASED ON
FREE-SPACE MICRO-OPTICAL SYSTEMS - AN OVERVIEW 57 J. MOHR,
FORSCHUNGSZENTRUM KARLSRUHE, GERMANY THE MANUFACTURE OF A-SI:H THIN FILM
TRANSISTORS FOR HAT LIQUID CRYSTAL DISPLAYS 59 E. LIIDER, UNIVERSITY OF
STUTTGART, GERMANY MICROOPTICAL DEVICES I CHAIRMEN: WOLFGANG KARTHE,
FHG-IOF, JENA, GERMANY JEAN-MICHEL KARAM, MEMSCAP S.A., GRENOBLE, FRANCE
DESIGN OPTIMIZATION CONSIDERING TOLERANCE EFFECTS OF MICROOPTICAL
BENCHES 65 I. SIEBER, H. EGGERT, H. GUTH, W. JAKOB, K.-P. SCHERER, P.
ZIEGLER, FORSCHUNGSZENTRUM KARLSRUHE, GERMANY LOW-LOSS POLYMER WAVEGUIDE
WITH HIGH THERMAL STABILITY 71 W. WIRGES, N. KEIL, H. YAO, C. ZAWADZKI,
S. YILMAZ, HEINRICH-HERTZ-LNSTITUT FUR NACHRICHTENTECHNIK, BERLIN,
GERMANY; M. BAUER, J. BAUER, C. DREYER, FRAUNHOFER-EINRICHTUNG FUR
ZUVERLASSIGKEIT UND MIKROINTEGRATION, TELTOW, GERMANY POLYMER WAVEGUIDE
COMPONENTS FOR OPTICAL BACKPLANE INTERCONNECTS FABRICATED BY LIGA
TECHNIQUE 77 T. PAATZSCH, H.-D. BAUER, M. POPP, I. SMAGLINSKI, W.
EHRFELD, INSTITUTE OF MICROTECHNOLOGY, MAINZ, GERMANY LOW-COST BRANCHING
DEVICES BASED ON MULTI-MODE INTERFERENCE (MMI) WAVEGUIDE STRUCTURES IN
BCB 83 T. AUGUSTSSON, J. HAMMAR, G. PALMSKOG, ERICSSON COMPONENTS AB,
STOCKHOLM, SWEDEN; J. HAGLUND, INDUSTRIAL MICROELECTRONIC CENTER,
LINKOPING, SWEDEN COMPONENTS FOR PARALLEL OPTICAL NETWORKS BASED ON LIGA
TECHNOLOGY .... 89 J. HOBFELD, W. EHRFELD, M. NEUMEIER, A. PICARD, J.
SCHULZE, L. WEBER, INSTITUTE OF MICROTECHNOLOGY, MAINZ, GERMANY DESIGN
AND SIMULATION OF POLYMER THERMO-OPTIC WAVEGUIDE SWITCHES .... 95 H.
YAO, N. KEIL, HEINRICH-HERTZ-LNSTITUT FUR NACHRICHTENTECHNIK, BERLIN,
GERMANY SENSORS I CHAIRMEN: WALTER KROY, DAIMLER BENZ AG, MIINCHEN,
GERMANY FRANCO A. MORI, MAGNEI MARELLI SPA, PAVIA, ITALY A
DIFFERENTIAL-TYPE CAPACITIVE SENSOR FOR NON-CONTACT MEASUREMENT OF
TORQUE 101 H. ACKER, W. LANGHEINRICH, DARMSTADT UNIVERSITY OF
TECHNOLOGY, GERMANY MAGNETOSTRICTIVE LC-CIRCUITS FOR THIN FILM TORQUE
SENSORS 107 A. LUDWIG, J. BETZ, E. QUANDT, FORSCHUNGSZENTRUM KARLSRUHE,
GERMANY MODEL-BASED SIGNAL PROCESSING IN A CMOS HALL SENSOR ROW
MICROSYSTEM 109 U. MARSCHNER, W.-J. FISCHER, DRESDEN UNIVERSITY OF
TECHNOLOGY, GERMANY; R. GOTTFRIED-GOTTFRIED, W. PUFE,
FRAUNHOFER-LNSTITUTE IMS II, DRESDEN, GERMANY A NEW BULK MICROMACHINED
GYROSCOPE WITH VIBRATION ENHANCEMENT BY COUPLED RESONATORS 115 K.
HILLER, M. WIEMER, D. BILLEP, A. HUHNERFURST, T. GESSNER, TECHNICAL
UNIVERSITY OF CHEMNITZ, GERMANY; B. RYRKO, U. BRENG, ST. ZIMMERMANN, W.
GUTMANN, LITEF GMBH, FREIBURG, GERMANY; M. WETZEL, ELECTRONICBURO M.
WETZEL, STOLLBERG, GERMANY SILICON VIBRATING GYROSCOPES WITH A LARGE
REFERENCE MOTION USING A PARALLELOGRAM AMPLIFIER 121 A. SAYAH, Y. ANSEL,
P. RENAUD, M.A.M. GIJS, SWISS FEDERAL INSTITUTE OF TECHNOLOGY, LAUSANNE,
SWITZERLAND MICRO SENSORS FOR THE APPLICATION IN GESTURE RECOGNITION 127
P. KRAUSE, TH. VELTEN, D. STEFAN, E. OBERMEIER, F. G. HOFMANN, G.
HOMMEL, TECHNICAL UNIVERSITY OF BERLIN, GERMANY ADVANCED PACKAGING AND
INTERCONNECTIONS CHAIRMEN: KAREL KURZWEIL, BULL SA, LES CLAIS-SOUS-BOIS,
FRANCE JEAN ROGGEN, IVEC VZW, LEUFEN, BELGIUM MULTILAYER POLYIMIDE FILM
SUBSTRATES FOR INTERCONNECTIONS IN MICRO SYSTEMS 133 A. FACH, B.
KETTERER, U. BRUNNER, D. HABLUTZEL, J. LINK, HIGHTEC MC AG, LENZBURG,
SWITZERLAND WAFERLEVEL CSP-PACKAGING AND RELIABILITY 139 J. SIMON,
FRAUNHOFER-LNSTITUT FUR ZUVERLASSIGKEIT UND MIKROINTEGRATION, BERLIN,
GERMANY MODULARIZATION OF MICROSYSTEMS AND STANDARDIZATION OF INTERFACES
141 M. SCHUNEMANN, G. BAUER, W. SCHAEFER, FRAUNHOFER INSTITUTE FOR
MANUFACTURING ENGINEERING AND AUTOMATION IPA, STUTTGART, GERMANY; R.
LEUTENBAUER, V. GROSSER, H. REICHL, FRAUNHOFER INSTITUTE FOR MECHANICAL
RELIABILITY AND MICROINTEGRATION IZM, BERLIN, GERMANY FLIP-CHIP MOUNTING
OF HYBRID FET GAS SENSORS WITH AIRGAP 147 A. FUCHS, T. DOLL, I. EISELE,
UNIVERSITAT DER BUNDESWEHR MUNCHEN, NEUBIBERG, GERMANY THERMAL
MANAGEMENT OF VCSEL DIODE ARRAYS IN INTEGRATED PLANAR FREE-SPACE OPTICAL
SYSTEM 153 C. GIMKIEWICZ, J. JAHNS, FERNUNIVERSITAT HAGEN, GERMANY LASER
JOINING OF DISSIMILAR MATERIALS 159 M. J. WILD, F. LEGEWIE, A. GILLNER,
R. POPRAWE, FRAUNHOFER INSTITUTE FOR LASERTECHNOLOGY, AACHEN, GERMANY
MICROOPTICAL DEVICES II CHAIRMEN: WOLFGANG MENZ, UNIVERSITAT FREIBURG,
GERMANY HELMUT F. SCHLAAK, SIEMENS AG, BERLIN, GERMANY IMAGE SENSORS IN
TFA (THIN FILM ON ASIC) TECHNOLOGY WITH ANALOG IMAGE PRE-PROCESSING 165
A. ECKHARDT, F. BLECHER, B. SCHNEIDER, J. STERZEL, UNIVERSITAT-GH
SIEGEN, GERMANY; S. BENTHIEN, H. KELLER, I LULE, P. RIEVE, M. SOMMER, K.
SEIBEL, F. MIITZE, M. BOHM, SILICON VISION GMBH, SIEGEN, GERMANY
TECHNOLOGICAL APPROACHES TO MICROMIRROR FABRICATION FOR HIGH FREQUENCY
SCANNING APPLICATIONS 171 K. KEHR, R. HAHN, S. KURTH, CH. KAUFMANN, K.
SCHMIDT, I. SCHUBERT, U. WOLLMANN, W. DOTZEL, T. GESSNER, CHEMNITZ
UNIVERSITY OF TECHNOLOGY, GERMANY A NEW PRINCIPLE FOR
MICRO-OPTO-MECHANICAL SCANNERS 177 T. FRANK, H. WURMUS, TECHNICAL
UNIVERSITY OF LLMENAU, GERMANY PRODUCTION POSSIBILITIES OF MICROOPTICS
WITH EXCIMER-LASER RADIATION ... 183 M. RINKE, H. K. TONSHOFF, C.
GRAUMANN, H. HESENER, J. WAIS, LASER ZENTRUM HANNOVER E.V., GERMANY
MICRO-OPTICAL FLUIDIC ANALYSIS SYSTEM FOR ENVIRONMENTAL AND QUALITY
CONTROL 189 A. EHLERT, S. DAUER, S. BIITTGENBACH, TECHNICAL UNIVERSITY
OF BRAUNSCHWEIG, GERMANY DESIGN, FABRICATION AND CLINICAL TEST OF A
FOLDABLE MICROSTRUCTURED INTRAOCULAR LENS 195 W. STORK, K. D.
MULLER-GLASER, A. WAGNER, UNIVERSITY OF KARLSRUHE, GERMANY; C. F.
KREINER, ACRITEC GMBH, GLIENICKE, GERMANY 10 SENSORS II CHAIRMEN: JIRI
MAREK, ROBERT BOSCH GMBH, REUTLINGEN, GERMANY NICO F. DE ROOIJ,
UNIVERSITE DE NEUCHATEL, SWITZERLAND A MILLIMETER WAVE DOPPLER SENSOR IN
MICROSYSTEM TECHNOLOGY 201 H. THIM, C. DISKUS, G. HAIDER, K. LIIBKE, A.
SPRINGER, A. STELZER, H. WEINFURTER, JOHANNES KEPLER UNIVERSITY LINZ,
AUSTRIA CMOS-BASED CELLULAR BIOSENSOR IN PROCESS AND APPLICATION 207 M.
LEHMANN, W. BAUMANN, R. EHRET, M. BRISCHWEIN, B. WOLF, INSTITUTE FOR
IMMUNOBIOLOGY, FREIBURG, GERMANY; H.-J. GAHLE, G. IGEL, U. SIEBEN,
MICRONAS INTERMETALL GMBH, FREIBURG, GERMANY MICROMACHINED GAS SENSORS
OPERATED BY FAST PULSED TEMPERATURE MODE FOR ENVIRONMENTAL POLLUTANTS
213 G. FAGLIA, E. COMINI, A. CRISTALLI, G. SBERVEGLIERI, A. TARONI,
UNIVERSITY OF BRESCIA, ITALY; G. CARDINALI, L. DORI, CNR-LAMEL
INSTITUTE, BOLOGNA, ITALY ENVIRONMENTAL MONITORING USING MICROOPTICAL
SENSORS 219 G. MAROWSKY, U. BUNTING, P. KARLITSCHEK, F. LEWITZKA, M.
NIEDERKRIIGER, LASER-LABORATORIUM GOTTINGEN E. V., GERMANY REALIZATION
OF LOW COST MICRO COILS AND USAGE IN DIFFERENT MEDIA 225 U. MARSCHNER,
DRESDEN UNIVERSITY OF TECHNOLOGY, GERMANY W.-J. FISCHER, IHM & FHG-IMS
II, DRESDEN, GERMANY; R. JURISCH, P. PEITSCH, MICRO-SENSYS GMBH, ERFURT,
GERMANY; J. OSWALD, ETD ELEKTRONIK-TECHNOLOGIE GMBH, DRESDEN, GERMANY
ASSEMBLY AND MICROINTEGRATION CHAIRMEN: YOTARO HATAMURA, UNIVERSITY OF
TOKYO, JAPAN CEES VAN KESSEL, PHILIPS BEDRIJVEN B. V. EINDHOVEN,
NETHERLANDS SENSITIVE AND ADAPTIVE MANIPULATORS FOR AUTOMATION OF MICRO
ASSEMBLY 231 J. STAUD, W. GROB, A. MENSCHIG, DEUTSCHES ZENTRUM FUR LUFT-
UND RAUMFAHRT E.V., STUTTGART, GERMANY DOWNSCALING OF ADHESIV AND
CAPILLARY GRIPPERS FOR MICRO ASSEMBLY 237 H. GRUTZECK, L. KIESEWETTER,
BTU COTTBUS, GERMANY 11 HOLISTIC CONCEPT OF SENSITIVE GRIPPING AND
MAGAZINING OF MICROCOMPONENTS 243 K.-D. MIILLER, K. POLLAK, W. BACHER,
M. HECKELE, U. GENGENBACH, FORSCHUNGSZENTRUM KARLSRUHE, GERMANY
AUTOMATED ASSEMBLY OF MICROCOMPONENTS SUPPORTED BY A 3D-INSPECTION
SYSTEM 249 R. EBERHARDT, T. SCHELLER, FRAUNHOFER INSTITUT FUR ANGEWANDTE
OPTIK UND FEINMECHANIK, JENA, GERMANY; E.-M. MENZEL, CARL ZEISS JENA
GMBH, GERMANY; M. DORING, MICRODROP GMBH, NORDERSTEDT, GERMANY; K.
LENHARDT, JOS. SCHNEIDER GMBH, BAD KREUZNACH, GERMANY; H. KOPP, COMPUTER
GESELLSCHAFT FUR WISSENSCHAFTLICHE ANWENDUNGEN, AACHEN, GERMANY
SUBSYSTEMS AND INTERFACES FOR MODULAR MICRO ASSEMBLY SYSTEMS 257 U.
GENGENBACH, F. ENGELHARDT, R. SCHARNOWELL, FORSCHUNGSZENTRUM KALRSRUHE,
GERMANY FLEXIBLE MICROGRIPPERS FOR MANIPULATION OF MICROSTRUCTURES 263
R. SALIM, H. WURMUS, TECHNICAL UNIVERSITY OF LLMENAU, GERMANY INDUSTRIAL
PRODUCT VISIONS CHAIRMEN HELMUT STURM, VDI/VDE TECHNOLOGIEZENTRUM,
TELTOW, GERMANY TAKAHARU IDOGAKI, NIPPONDENSO CO. LTD. AICHI-KEN, JAPAN
MEDICAL APPLICATIONS OF MICROSYSTEMS: BARRIERS AND INCENTIVES FOR GROWTH
269 J. M. WILKINSON, TECHNOLOGY FOR INDUSTRY LTD., CAMBRIDGESHIRE,
ENGLAND MARKET ANALYSIS FOR MICROSYSTEMS - AN INTERIM REPORT FROM THE
NEXUS TASK FORCE . 275 R. WECHSUNG, N. UNAL, MICROPARTS GMBH, DORTMUND,
GERMANY; J.-C. ELOY, YOLE DEVELOPPEMENT, LYON, FRANCE; H. WICHT,
CEA-LETI, GRENOBLE, FRANCE SMART DOMESTIC APPLIANCES THROUGH INNOVATIONS
283 A. LAHRMANN, BOSCH-SIEMENS HAUSGERATE GMBH, BERLIN, GERMANY FUTURE
SCENARIOS OF MICROSYSTEM APPLICATIONS 289 W. GEBNER, M. WERNER,
VDI/VDE-IT, TELTOW, GERMANY 12 ACTUATORS CHAIRMEN HIROYUKI FUJITA,
UNIVERSITY OF TOKYO, TOKYO, JAPAN KAREN W. MARKUS, MEM TECHNOLOGIES
APPLICATIONS CENTRE, NORTH CAROLINA, USA ELECTRIC FIELD BREAKDOWN AT
MICROMETRE SEPARATIONS IN AIR AND VACUUM 295 R. S. DHARIWAL, J.-M.
TORRES, HERIOT-WATT UNIVERSITY, EDINBURGH, UNITED KINGDOM ELECTROSTATIC
COMB-DRIVE ACTUATORS MADE OF POLYIMIDE FOR ACTUATING MICROMOTION CONVERT
MECHANISMS 301 D. KAMIYA, T. HAYAMA, M. HORIE, TOKYO INSTITUTE OF
TECHNOLOGY, YOKOHAMA, JAPAN MINIATURIZATION OF ELECTROMAGNETIC ACTUATORS
307 E. KALLENBACH, K. FEINDT, M. KALLENBACH, T. STROHLA, V. ZOPPIG,
TECHNICAL UNIVERSITY OF LLMENAU, GERMANY ACHIEVING LOW DRIVING VOLTAGES
FOR MICRO-MOTORS AND FLUID PUMPS BY ELECTRONIC RESONANCE 313 J. GIMSA,
T. MULLER, G. FUHR, HUMBOLDT UNIVERSITAT ZU BERLIN, GERMANY AN
ELECTRO-THERMALLY DRIVEN MICRO MEMBRANE ACTUATOR WITH TWO-WAY DEFLECTION
319 W. HSU, Z.-P. XU, NATIONAL CHIAO TUNG UNIVERSITY, HSINCHU, TAIWAN
DESIGN AND FABRICATION OF A MICROVALVE WITH AN ANTI-LEAKAGE MEMBRANE 325
H.-Y. LIN, W. FANG, NATIONAL TSING HUA UNIVERSITY, HSINCHU, TAIWAN
PROCESS TECHNOLOGIES I CHAIRMEN: MASAYOSHI ESASHI, TOHOKU UNIVERSITY,
SENDAI, JAPAN THOMAS GEBNER, TU CHEMNITZ, GERMANY PROCESS ANALYSIS OF
THE INJECTION MOULDING OF MICROSTRUCTURES 331 A. SPENNEMANN, W.
MICHAELI, A. ROGALLA, INSTITUT FU R KUNSTSTOFFVERARBEITUNG, RWTH AACHEN,
GERMANY MANUFACTURING OF MICRO PARTS BY MICRO INJECTION MOULDING 337 C.
G. KUKLA, H. LOIBL, FH WIENER NEUSTADT, AUSTRIA; W. HANNENHEIM, TU WIEN,
AUSTRIA 13 MANUFACTURING OF MICROSTRUCTURES BY MICRO INJECTION MOLDING
343 V. PIOTTER, T. BENZLER, I HANEMANN, R. RUPRECHT, J. HAUSSELT,
FORSCHUNGSZENTRUM KARLSRUHE, GERMANY U-EDM POTENTIALS IN FABRICATION OF
MICROCOMPONENTS AND MOLD INSERTS .. 349 G. POPOVIC, D. PETROVIC, W.
BRENNER, A. VUJANIC, P. HERBST, INSTITUTE FOR RECISION ENGINEERING,
VIENNA UNIVERSITY OF TECHNOLOGY, VIENNA, AUSTRIA; A. WOLF, INSTITUT FUR
MIKROTECHNIK GMBH, MAINZ, GERMANY LASER BEAM WELDING OF PLASTIC
MICROPARTS 355 H. KLEIN, E. HABERSTROH, W. MICHAELI, RWTH, INST. FUR
KUNSTSTOFFVERARBEITUNG, AACHEN, GERMANY THREE DIMENSIONAL MICRO FORMING
USING METAL JET 361 K. YAMAGUCHI, K. SAKAI, T. YAMANAKA, T. HIRAYAMA,
NAGOYA UNIVERSITY, JAPAN PLENARY SESSION CHAIRMEN: VOLKER SAILE, FZK,
KARLSRUHE, GERMANY ERNST OBERMEIER, TU BERLIN, GERMANY CMOS-BASED
TRANSDUCERS 367 K. BAERT, D. MAES, L. HASPESLAGH, W. LAUREYN, S. SEDKY,
S. VAN DER GROEN, P. VAN GERWEN, F. VAN STEENKISTE, IMEC, BELGIUM
CHARACTERIZATION AND TESTING CHAIRMEN: ROBERT MERTENS, IMEC VZW, LEUVEN,
BELGIUM BERND MICHEL, FHG-IZM, BERLIN, GERMANY A STUDY OF EFFECT OF
FABRICATION PROCESS ON DIFFUSION IN LAYERED THIN FILM 373 T. HIRASAWA,
H. KOTERA, I YAMAMOTO, S. SHIMA, KYOTO UNIVERSITY, JAPAN MECHANICAL
RELIABILITY OF SILICON WAFER-BONDED COMPONENTS 379 J. BAGDAHN, D.
KATZER, M. PETZOLD, FRAUNHOFER INSTITUT FUR WERKSTOFFMECHANIK, HALLE,
GERMANY SILICON MICROMACHINED TORSION SPRING FOR MEASUREMENTS OF SMALL
MOMENTS 385 A. VUJANIC, N. DELIC, M. JAKOVLJEVIC, W. BRENNER, G.
POPOVIC, TECHNICAL UNIVERSITY OF VIENNA, AUSTRIA 14 MICRO TORQUE
MEASUREMENTS FOR PROTOTYPE MOTORS IN MEMS 391 Y. WU, H. JIA, T. WANG, L.
WANG, CHANGCHUN INSTITUTE OF OPTICS & FINE MECHANICS, CHINA MATERIAL
PROPERTIES AND CRACK PROPAGATION BEHAVIOR OF 63SN37PB FLIP CHIP SOLDER
JOINTS 397 S. WIESE, F. FEUSTEL, S. RZEPKA, E. MEUSEL, TECHNICAL
UNIVERSITY OF DRESDEN, GERMANY CRACK AVOIDANCE AND CRACK EVALUATION IN
MICROSYSTEMS 403 B. MICHEL, FRAUNHOFER INSTITUTE FOR RELIABILITY AND
MICROINTEGRATION, BERLIN, GERMANY PROCESS TECHNOLOGIES II CHAIRMEN:
ELISABETH REESE, W. C. HERAEUS GMBH, HANAU, GERMANY FELIX RUDOLF, CSEM
NEUCHATEL, SWITZERLAND THE EFFECTS OF IMPURITIES IN SILICON ON
ANISOTROPIC ETCHING IN KOH-SOLUTIONS 409 A. HEIN, G. FINDLER, S.
FINKBEINER, H. MUENZEL, ROBERT BOSCH GMBH REUTLINGEN, GERMANY; E.
OBERMEIER, TECHNICAL UNIVERSITY OF BERLIN, GERMANY UNCONVENTIONAL
BULK-MICROMACHINING USING UNDERETCHING OF *100* SILICON PLANES, ITS
FABRICATION TOLERANCES AND APPLICATION TO SOME MEMS AND MOEMS 415 G.
SCHROPFER, M. DE LABACHELERIE, LPMO-CNRS, BESANCON, FRANCE; C. R.
TELLIER, LCEP, BESANCON, FRANCE THE LASER CONTROLLED ANISOTROPIC ETCHING
TO FORM VERTICAL SIDEWALLS ON *100* SILICON WAFERS 421 Y.-H. CHANG,
Y.-C. HUANG, W.-S. CHANG, NATIONAL CHIAO TUNG UNIVERSITY, HSINCHU,
TAIWAN NOVEL MICROSTRUCTURING TECHNOLOGIES IN SILICON 427 B. HILLERICH,
H. PRADEL, U. SCHABER, FRAUNHOFER-LNSTITUTE FOR SOLID STATE TECHNOLOGY
(IFT), MIINCHEN, GERMANY; S. VOGEL, IFT (POSINOM), MIINCHEN (POTSDAM),
GERMANY INVESTIGATIONS INTO THE MICROGRINDING TECHNIQUE FOR THE
PRODUCTION OF MICROSTRUCTURES IN SILICON AND GLASS 433 H.-W.
HOFFMEISTER, A. WENDA, TECHNICAL UNIVERSITY OF BRAUNSCHWEIG, GERMANY 15
RAPID PROTOTYPING OF MICROFLUIDIC STRUCTURES WITH ND: YAG-LASER-ABLATION
439 J. M. GRASEGGER, TECHNICAL UNIVERSITY OF MUNICH, GERMANY BIOLOGICAL
BASED APPROACHES CHAIRMEN: GUNTER FUHR, HUMBOLDT UNIVERSITAT BERLIN,
GERMANY FRIEDER SCHELLER, UNIVERSITAT POTSDAM, GERMANY MEASUREMENT OF
OPTICAL INDUCED FORCES ON TRAPPED PARTICLES BY USE OF MICRO FIELD CAGES
445 G. FUHR, TH. SCHNELLE, T. MIILLER, H. HITZLER-ALIMORADIAN,
HUMBOLDT-UNIVERSITAT ZU BERLIN, GERMANY; S. MONAJEMBASHI, K.-O.
GREULICH, INSTITUT FUR MOLEKULARE BIOTECHNOLOGIE, JENA, GERMANY CHEMICAL
AND BIOCHEMICAL SYNTHESIS AND SCREENING IN SILICON 451 A. SCHOBER, G.
SCHLINGLOFF, D. TOMANDL, J. M. KOHLER, G. MAYER, A. GROB, S. WUCHTY,
INSTITUTE OF PHYSICAL HIGH TECHNOLOGY, JENA, GERMANY; H. DEPPE, B.
DIEFENBACH, H. WURZIGER, MEDICINAL CHEMISTRY RESEARCH, MERCK KGAA,
DARMSTADT, GERMANY APPLICATIONS OF BIOACTIVE FILMS IN MICROSYSTEMS 457
A. HENGERER, J. DECKER, E. PROHASKA, H. WOLF, UNIVERSITY OF REGENSBURG,
GERMANY; S. HAUCK, C. KOBLINGER, FRAUNHOFER-LNSTITUTE FOR SOLID-STATE
TECHNOLOGY, MUNICH, GERMANY SCREENING OF HERBICIDES IN WATER USING AN
AUTOMATED, COMPUTER-CONTROLLED IMMUNOCHEMICAL DETECTION SYSTEM 463 A.
FRANKE, P. M. KRAMER, NATIONAL RESEARCH CENTER FOR ENVIRONMENT AND
HEALTH, NEUHERBERG, GERMANY; S. BANNIERINK, JUKE MEBTECHNISCHE SYSTEME,
ALTENBERGE, GERMANY MICRO SCANNER BASED FLUORESCENCE MEASUREMENTS ON
NANO TITER PLATES FOR ENVIRONMENTAL ANALYSIS 469 M. HESSLING, J.
IHLEMANN, D. EBBECKE, G. MAROWSKY, LASER-LABORATORIUM GOTTINGEN E.V.,
GERMANY APPLICATION OF MICROSTRUCTURES IN BIOSENSORS 475 U. BILITEWSKI,
GESELLSCHAFT FUR BIOTECHNOLOGISCHE FORSCHUNG MBH, BRAUNSCHWEIG, GERMANY
16 DESIGN CHAIRMEN: KLAUS D. MULLER-GLASER, UNIVERSITAT KARLSRUHE,
GERMANY KAY KRUPKA, SIEMENS AG, BERLIN, GERMANY MEMS PROCESS/DESIGN AND
OPTIMIZATION USING ECONOMICAL CONSTRAINTS 479 K. HAHN, R. BRUCK,
UNIVERSITY OF SIEGEN, GERMANY DEVELOPMENT OF METHODS FOR APPLICATION OF
THE FINITE-ELEMENT METHOD IN SYSTEM OPTIMIZATION OF MICROSYSTEM
COMPONENTS 485 A. QUINTE, S. HALSTENBERG, W. SIIR, H. EGGERT,
FORSCHUNGSZENTRUM KARLSRUHE, GERMANY DYNAMIC SIMULATION METHOD OF MEMS
COUPLING ELECTROSTATIC FIELD, FLUID DYNAMICS AND MEMBRANE DEFLECTION 491
H. KOTERA, Y. SAKAMOTO, T. HIRASAWA, S. SHIMA, KYOTO UNIVERSITY, JAPAN;
R. W. DUTTON, STANFORD UNIVERSITY, CALIFORNIA, USA DEVELOPMENT OF
METHODS FOR BUILDING ADAPTED MACROMODELS FOR THE APPLICATION IN THE
DESIGN OPTIMIZATION OF MICROSYSTEMS 497 S. HALSTENBERG, H. EGGERT, M.
GORGES-SCHLEUTER, W. JAKOB, A. QUINTE, W. SUB, FORSCHUNGSZENTRUM
KARLSRUHE, GERMANY SIMULATION OF FLUID-STRUCTURE INTERACTION USING
DOMAIN-SPECIFIC FINITE-ELEMENT SOLVERS 503 A. KLEIN, G. GERLACH,
TECHNICAL UNIVERSITY OF DRESDEN, GERMANY ANALYSIS OF INTEGRATED OPTICAL
DEVICES UNDER THERMAL AND MECHANICAL LOADS 509 M. BLUDSZUWEIT, M.
KASPER, TECHNICAL UNIVERSITY OF HAMBURG-HARBURG, GERMANY PROCESS
TECHNOLOGIES III CHAIRMEN: ECKHARD WOLFGANG, SNI SIEMENS NIXDORF
INFORMATIONSSYSTEME AG, MIINCHEN, GERMANY HEINZ LEHR, TECHNICAL
UNIVERSITY BERLIN, GERMANY LOCAL LASER SUPPORTED CLEANING OF
MICROELECTROMECHANICAL SYSTEMS AND COMPONENTS 515 G. SCHWAAB, R. GRIMME,
M. ROCKOWICZ, W. SCHAFER, FRAUNHOFER INSTITUTE FOR MANUFACTURING
ENGINEERING AND AUTOMATION, STUTTGART, GERMANY 17 LONISING-RADIATION
SENSORS BASED ON CVD DIAMOND: CORRELATION AMONG GROWTH CONDITIONS, FILM
TEXTURING AND DETECTOR PERFORMANCE 521 G. MESSINA, G. FAGGIO, S.
SANTANGELO, UNIVERSITY OF REGGIO CALABRIA, ITALY; G. VERONA-RINATI,
UNIVERSITY OF ROME ,,TOR VERGATA , ITALY PULSED LASER DEPOSITION AND
PATTERNING OF DIAMOND-LIKE CARBON FILMS . . 527 A. TEBANO, A. PAOLETTI,
A. TUCCIARONE, M. A. SCARSELLI, UNIVERSITY OF ROME ,,TOR VERGATA ,
ITALY; G. MESSINA, S. SANTANGELO, UNIVERSITY OF REGGIO CALABRIA, ITALY
LEAD ZIRCONATE TITANATE (PZT) THIN FILM FOR MICROSYSTEMS SYNTHESISED BY
HYDROTHERMAL METHOD 533 P. A. NDIAYE, P. PERNOD, ECOLE CENTRALE DE
LILLE, FRANCE; B. LOISEAU, S. MINAUD, ECOLE NATIONALE SUPERIEURE DE
CHIMIE DE LILLE, FRANCE MICRO POWDER METALLURGY FOR MICROPART PRODUCTION
539 T. HARTWIG, A. ROTA, V. DUONG, FRAUNHOFER INSTITUTE FOR APPLIED
MATERIALS RESEARCH (IFAM), BREMEN, GERMANY PRECISION EMBOSSING OF
GROOVES IN METALLIC SUBSTRATES FOR SELF-ALIGNED POSITIONING OF
MICROOPTICAL COMPONENTS 545 B. HILLERICH, FRAUNHOFER INSTITUTE FOR SOLID
STATE TECHNOLOGY, MUNICH, GERMANY; M. RODE, DAIMLER-BENZ RESEARCH
CENTRE, ULM, GERMANY MICROFLUIDIC DEVICES CHAIRMEN: PETER BLEY,
FORSCHUNGSZENTRUM KARLSRUHE, GERMANY RICHARD S. MULLER, UNIVERSITY OF
CALIFORNIA, BERKELEY, USA OPTIMAL DESIGN OF A MICROFLUIDIC SYSTEM WITH
PIEZOACTUATOR FOR DROPLETS GENERATION 551 R. KEOSHKERYAN, L. DRESSIER,
N. SCHWESINGER, TECHNICAL UNIVERSITY OF LLMENAU, GERMANY FINITE-ELEMENT
INVESTIGATION INTO PROPOSED BEARING MECHANISM FOR A FLUID DRIVEN MICRO
ACTUATOR 557 R. S. DHARIWAL, S. M. FLOCKHART, HERIOT-WATT UNIVERSITY,
EDINBURGH, UNITED KINGDOM MULTIPHASE DISPERSION PROCESSES IN INTEGRATED
MICROMIXING AND MULTICHANNEL SYSTEMS 563 V. HAVERKAMP, INSTITUTE OF
MICROTECHNOLOGY, MAINZ, GERMANY 18 MODULAR SILICON MICRO REACTORS FOR
ORGANIC CHEMISTRY 565 N. SCHWESINGER, 0. MARUFKE, M. STUBENRAUCH,
TECHNICAL UNIVERSITY OF LLMENAU, GERMANY; M. HOHMANN, H. WURZIGER, MERCK
KGAA DARMSTADT, GERMANY MICROANALYTICAL SYSTEM FOR WATER CONTROL 571 S.
DROST, W. WBRMANN, M. RICHTER, FRAUNHOFER-LNSTITUT FUR
FESTKORPERTECHNOLOGIE (IFT), MUNCHEN, GERMANY; B. ROSS, G. CHEMNITIUS,
INSTITUT FUR CHEMO- UND BIOSENSORIK E.V. (ICB), MUNSTER, GERMANY; 0.
KOSTER, FRAUNHOFER-LNSTITUT FIIR MIKROELEKTRONISCHE SCHALTUNGEN UND
SYSTEME (IMS), DUISBURG, GERMANY; W. KONZ, FRAUNHOFER-LNSTITUT FUR
PHYSIKALISCHE MEBTECHNIK (IPM), FREIBURG, GERMANY; F. H. FRIMMEL,
UNIVERSITY OF KARLSRUHE, GERMANY; W. SCHUHMANN, L. MEIXNER, TECHNICAL
UNIVERSITY OF MUNICH, GERMANY; R. FERRETTI, UNIVERSITY OF HANNOVER,
GERMANY MICROFLUIDIC SYSTEM FOR THE INTEGRATION OF GASSENSORS 577 A.
MECKES, W. BENECKE, UNIVERSITAT BREMEN, GERMANY MODULAR 3D MST CHAIRMEN:
WOLFGANG BENECKE, UNIVERSITAT BREMEN, GERMANY THE DEVELOPMENT OF A
TOP-BOTTOM-BGA (TB-BGA) 583 R. LEUTENBAUER, V. GROSSER, H. REICHL,
FHG-IZM BERLIN, GERMANY; M. SCHUNEMANN, FHG-LPA, STUTTGART, GERMANY
DESIGN AND APPLICATION OF MODULAR MICROSYSTEMS 589 M. SCHUENEMANN, G.
BAUER, W. SCHAEFER, FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING
AND AUTOMATION IPA, STUTTGART, GERMANY; R. LEUTENBAUER, V. GROSSER,
FRAUNHOFER INSTITUTE FOR MECHANICAL RELIABILITY AND MICROINTEGRATION
IZM, BERLIN, GERMANY; V. ZOEPPIG, INSTITUTE FOR MICROSYSTEMS TECHNOLOGY,
MECHATRONICS AND MECHANICS, TECHNICAL UNIVERSITY OF LLMENAU, GERMANY THE
DESIGN METHODOLOGY OF 3D-HDI 595 K. AMIRI JAM, R. LEUTENBAUER, V.
GROSSER, A. SIMSEK, H. REICHL, FRAUNHOFER INSTITUTE FHG-IZM, BERLIN,
GERMANY RELIABILITY AND TESTABILITY OF STACKED 3D MODULES 601 V. GROBER,
J.-P. SOMMER, R. LEUTENBAUER, B. MICHEL, H. REICHL, FRAUNHOFER INSTITUTE
RELIABILITY AND MICROINTEGRATION, BERLIN, GERMANY 19 THE LTCC-TECHNIQUE
FOR 3D PACKAGING 607 F. BECHTOLD, VIA ELECTRONIC GMBH, HERMSDORF,
GERMANY A MODULAR HOUSING CONCEPT FOR PNEUMATIC MICROSYSTEMS 615 J.
SCHAIBLE, S. MESSNER, M. MIILLER, R. ZENGERLE,
HAHN-SCHICKARD-GESELLSCHAFT, VILLINGEN-SCHWENNINGEN, GERMANY POSTER
SESSION OBSERVATION OF THE MICROASSEMBLY PROCESS WITH A CONFOCAL
LASER-SCANNING-MICROSOPE 621 G. DUSSLER, B. BROCHER, T. PFEIFER, RWTH
AACHEN, GERMANY ANALYSIS OF MICROMECHANICAL MOTION 624 V. LANGE, FH
FURTWANGEN, GERMANY; G. HIGELIN, SCHOOL OF APPLIED SCIENCE, NANYANG
TECHNOLOGICAL UNIVERSITY, SINGAPORE GEOMETRICAL MEASUREMENTS ON FILM
STRUCTURES USING A SCANNING ELELCTRON MICROSCOPE 627 T. AHBE, N. HAFT,
K. HASCHE, K.-P. HOFFMANN, PHYSIKALISCH-TECHNISCHE BUNDESANSTALT,
BRAUNSCHWEIG/BERLIN, GERMANY THE ROLE OF WATER ON THE MICRO-TRIBOLOGY OF
MEMS 630 M. SCHERGE, J. A. SCHAEFER, TECHNICAL UNIVERSITY OF LLMENAU,
GERMANY; 0. MOLLENHAUER, TETRA GMBH LLMENAU, GERMANY LONG-SOLENOID-TYPE
SMT COIL BATCHPROCESSING IN SIMPLE MEMS TECHNOLOGY 633 T. DOLL,
CALIFORNIA INST. OF TECHNOLOGY, PASADENA, USA; F. KAESEN, H. GEIGER,
UNIVERSITAT DER BUNDESWEHR, NEUBIBERG, GERMANY; F. BARTELS, BARTELS
MIKROTECHNIK GMBH, DORTMUND, GERMANY A MICROMACHINED PYROELECTRIC
INFRARED DETECTOR FOR APPLICATION IN A CO 2 CONTROLLED VENTILATION
SYSTEM 636 A.-C. DE VRIES, K. BAERT, IMEC LEUVEN, BELGIUM APPROACHES TO
SYSTEM-LEVEL MODELING AND SIMULATION OF LASER PROJECTION SYSTEMS USING
MICROMIRROR ARRAYS AND ROTATION-SYMMETRIC REFLECTORS 639 J. ALBRECHT, L.
MELZER, D. MULLER, R. SEIDEL, CHEMNITZ UNIVERSITY OF TECHNOLOGY, GERMANY
20 NEW CONDUCTIVE ADHESIVES FOR MICROELECTRONIC APPLICATIONS 642 A.
BATTERMANN, PANACOL-ELOSOL GMBH, OBERURSEL, GERMANY; B. GIINTHER, H.
SCHAFER, FHG IFAM, BREMEN, GERMANY DOPING ANALYSIS OF POLYSILICON LAYERS
FOR THE ACHIEVEMENT OF THE CAPACITIVE SENSORS BY SURFACE MICROMACHINING
TECHNOLOGY 646 F. GAISEANU, NATIONAL INSTITUTE OF RESEARCH-DEVELOPMENT
FOR MICROTECHNOLOGY, BUCHAREST, ROMANIA; J. ESTEVE TINTO, CENTRE
NATIONAL DE MICROELECTRONICA BARCELONA, BELLATERRA, SPAIN; A.
PEREZ-RODRIGUEZ, J. R. MORANTE, UNIVERSITY OF BARCELONA, SPAIN
SELF-LUBRICATING THIN FILMS FOR MEMS 649 Z. RYMUZA, M. MISIAK, Z.
KUSZNIEREWICZ, W. FABIANOWSKI, M. GUTKOWSKI, Z. RZANEK-BOROCH, J.
SENTEK, K. SCHMIDT-SZALOWSKI, WARSAW UNIVERSITY OF TECHNOLOGY, POLAND
STRESS OPTIMIZATION OF REFLECTIVE COATINGS FOR MICRO MIRRORS 652 J.
KRUJATZ, CH. KAUFMANN, T. GESSNER, TECHNICAL UNIVERSITY OF CHEMNITZ,
GERMANY THIN FILM POLY-SI70%GE30% FOR THERMOPILES 655 P. VAN GERWEN, K.
BAERT, R. P. MERTENS, IMEC, LEUVEN, BELGIUM A NEW METHOD TO FIND 1OO
CRYSTRAL ORIENTATION ON A (100) SILICON WAFER BY PRE-ETCHING PROCESS 658
W.-S. CHANG, Y.-H. CHANG, Y.-C. HUANG, J.-M. LAI, W.-H. CHIENG, NATIONAL
CHIAO TUNG UNIVERSITY, HSINCHU, TAIWAN ADVANCED MASK TECHNOLOGY FOR HIGH
PRECISION LIGA PATTERNING 661 R. LUTTGE, G. REUTER, M. SCHMIDT, A.
SCHMIDT, INSTITUT FUR MIKROTECHNIK MAINZ GMBH, GERMANY; D. ADAM, F.
HOKE, H. SCHACKE, LEICA MICROSYSTEMS LITHOGRAPHY GMBH, JENA, GERMANY; F.
BURKHARDT, H. WOLF, PHOTRONICS MZD GMBH, DRESDEN, GERMANY; I. BUBEL, H.
HARTMANN, AISS GMBH, MIINCHEN, GERMANY MECHANICALLY CUT MICROSTRUCTURE
GROOVES LESS THAN 50 URN WIDE WITH REDUCED BURR 664 T. SCHALLER, L.
BOHN, J. MAYER, D. SCHERHAUFER, K. SCHUBERT, KARLSRUHE RESEARCH CENTER
(FZK), GERMANY CHARACTERIZATION OF SURFACE METALLIZATION FOR PRINTED
CIRCUIT BOARDS .... 667 E. AUERSWALD, M. HANNEMANN, B. KAMPFE, R.
SCHMIDT, FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION,
BERLIN, GERMANY 21 A DIGITAL IMAGE PROCESSING SYSTEM TO AUTOMATE THE
PRODUCTION OF MICROSTRUCTURES WITH HOT STAMPING TECHNOLOGY 670 B.
KOHLER, F. EBERLE, FORSCHUNGSZENTRUM KARLSRUHE, GERMANY MASK-DEFINED
ABRASIVE-JET MICROMACHINING 673 A. KRUUSING, S. LEPPAVUORI, A. UUSIMAKI,
UNIVERSITY OF OULU, FINLAND; M. UUSIMAKI, KEMI-TORNIO POLYTECHNIC, KEMI,
FINLAND PREADJUSTED ASSEMBLY MAGAZINES 676 M. BEGEMANN, W. EHRFELD, F.
MICHEL, L. WEBER, U. BERG, INSTITUTE OF MICROTECHNOLOGY, MAINZ, GERMANY
INJECTION MOULDING OF MICROSTRUCTURES WITH INDUCTIVE HEATING 679 C.
SCHAUMBURG, W. EHRFELD, L. WEBER, INSTITUTE OF MICROTECHNOLOGY, MAINZ,
GERMANY; W. SCHINKOTHE, T. WALTHER, UNIVERSITY OF STUTTGART, GERMANY
POSSIBILITIES TO REALIZE LOW COST FLIP CHIP SOLDERING 682 P. GRATZ, F.
FEUSTEL, B. LAUTERWALD, E. MEUSEL, TECHNICAL UNIVERSITY OF DRESDEN,
GERMANY A NEW TYPE OF OPTICAL PHOTOREFRACTIVE INTERCONNECTS 685 I. G.
VOITENKO, INSTITUTE OF APPLIED OPTICS, MOGILEV, BELARUS OPTICAL
INTERCONNECTS FORMATION ON THE BASE OF 2-D GRADIENT WAVEGUIDES AND
SUBSTRATE WAVE PROPAGATION 688 I. G. VOITENKO, INSTITUTE OF APPLIED
OPTICS, MOGILEV, BELARUS; V. E. SAMSONOV, INSTITUTE OF ENGINEERING
CYBERNETHICS, MINSK, BELARUS SIMULATION OF THE PROPAGATION OF OPTICAL
WAVES IN SPACE AND IN MICROOPTICAL ELEMENTS 691 W. STORK, K. D.
MIILLER-GLASER, A. WAGNER, UNIVERSITY OF KARLSRUHE, GERMANY
THREE-DIMENSIONAL MICRO-ELECTRODE CONFIGURATIONS FOR CELL MANIPULATION
IN OPTICAL DETECTION SYSTEMS 694 T. MULLER, TH. SCHNELLE, G. FURH,
HUMBOLDT UNIVERSITY OF BERLIN, GERMANY; G. GRADL, EVOTEC BIOSYSTEMS
GMBH, HAMBURG, GERMANY; S. HOWITZ, GESIM MBM, GROBERKMANNSDORF, GERMANY
A LOW TEMPERATURE COFIRING CERAMIC CHAMBER FOR CHARACTERIZATION OF
INTERNAL ELECTRIC PARTICLE PROPERTIES BY A LASEROPTICAL METHOD 697 J.
GIMSA, HUMBOLDT-UNIVERSITAT ZU BERLIN, GERMANY; S. HOWITZ, GESIM -
GESELLSCHAFT FUR SILIZIUM-MIKROSYSTEME MBH, GROBERKMANNSDORF, GERMANY;
L. REBENKLAU, TECHNICAL UNIVERSITY OF DRESDAN, GERMANY 22 MICROMACHINED
ULTRASONIC TRANSDUCER ARRAY FOR APPLICATIONS IN LIQUIDS . .. 700 L.
THIEME, E. AHL, H. DABLER, W. MANTHEY, TECHNICAL UNIVERSITY OF CHEMNITZ,
GERMANY C0/N0 2 GAS MIXTURE ANALYSIS USING GEOMETRIC MODULATED SNO 2 GAS
SENSORS FOR IMPROVED SELECTIVITY 703 J. WB LLENSTEIN, H. BOTTNER, M.
JAEGLE, F. VOLZ, FHG - IPM, FREIBURG, GERMANY; W. J. BECKER, UNIVERSITY
OF KASSEL, GERMANY A SENSOR ARRAY FOR THE RECOGNITION OF GRAPE JUICE AND
FERMENTED WHITE WINE 706 M. C. HORRILLO, I. SAYAGO, J. GETINO, L. ARES,
J.I. ROBLA, M.J. FERNANDEZ, J. RODRIGO, J. GUTIERREZ, INSTITUTE DE
FISICA APLICADA (IFA), MADRID, SPAIN POLY SILICON GERMANIUM ALLOYS, A
SUITABLE MATERIAL FOR SURFACE MICROMACHINED DEVICES 709 S. SEDKY, C.
BAERT, M. CAYMAX, IMEC, LEUVEN, BELGIUM; P. FIORINI, III UNIVERSITY OF
ROME, ITALY ULTRAMINIATURIZED THERMAL ANALYSIS SENSOR AND ITS NEW
HEATING-RATE MEASURING METHOD 712 M. KIMURA, J. HAYASAKA, C. SAWAI,
TOHOKU-GAKUIN UNIVERSITY, JAPAN OPTICAL TORQUE GENERATED ON STAR-TYPE
ROTATORS BASED ON THE SINGLE BEAM GRADIENT FORCE OPTICAL TRAP 715 Y.
OHMACHI, M. HASHIMOTO, T. YASHIRO, A. KANAI, ASHIKAGA INSTITUTE OF
TECHNOLOGY, TOCHIGI, JAPAN A FORCE SENSING SYSTEM DETECTING THE ADHESIVE
THICKNESS DURING MICROASSEMBLY PROCESSES 718 T. SCHELLER, J. JUHASZ, R.
EBERHARDT, FRAUNHOFER INSTITUT FUR ANGEWANDTE OPTIK UND FEINMECHANIK,
JENA, GERMANY NEW OPTOELECTRONIC CHIPS FOR POSITION CONTROL AND COLOUR
SENSING 721 R. ROEDER ET AL., MAZET GMBH, JENA, GERMANY HANDLING AND
ASSEMBLY OF FUNCTIONALLY ADAPTED MICROCOMPONENTS - HAFAM, A EUROPEAN
APPROACH IN THE FIELD OF TRAINING AND RESEARCH .... 725 W. BRENNER, G.
POPOVIC, H. DETTER, INSTITUTE FOR PRECISION ENGINEERING VIENNA, AUSTRIA
R. DUFFAIT, CENTRE TECHNIQUE DE I LNDUSTRIE HORLOGERE CETEHOR, BESANCON,
FRANCE; G. KIRIAKIDIS, FOUNDATION FOR RESEARCH AND TECHNOLOGY - HELLAS,
HERAKLION, CRETE; M. NIENHAUS, INSTITUT FUR MIKROTECHNIK MAINZ GMBH,
GERMANY; N. F. DE ROOIJ, UNIVERSITY OF NEUCHATEL, SWITZERLAND; F. DE
BONA, SINCROTRONE TRIESTE, BASOVIZZA-TRIESTE AND UNIVERSITY OF UDINE,
ITALY; R. MARTINS, E. FORTUNATO, UNINOVA, QUINTA DA TORRE, PORTUGAL 23 A
NEW MICROMANIPULATION SYSTEM FOR USE UNDER SEM OBSERVATION 728 W.
BRENNER, D. PETROVIC, E. CHATZITHEODORIDIS, G. POPOVIC, G. HADDAD, C. G.
KUKLA, A. VUJANIC, TECHNICAL UNIVERSITY OF VIENNA, AUSTRIA DETECTION OF
LOW REDUCTOR GAS CONCENTRATIONS WITH TIN OXIDE MICROSENSORS 731 I.
SAYAGO, M.C. HORRILLO, J. GETINO, M.J. FERNANDEZ, J. GUTIERREZ,
INSTITUTE DE FISICA APLICADA (IFA), MADRID, SPAIN; A. GOTZ, I. GRACIA,
L. FONSECA, C. CANE, E. LORA-TAMAYO, IMB-CSIC, BELLATERRA, SPAIN
INVESTIGATION OF A RIGID CARRIER CSP WITH THE MICRODAC METHOD 734 J.
SIMON, D. VOGEL, W. FAUST, A. GOLLHARDT, B. MICHEL, FRAUNHOFER-LNSTITUT
FUR ZUVERLASSIGKEIT UND MIKROINTEGRATION, BERLIN, GERMANY ELECTROPLATING
OF COPPER IN SILICON WAFERS 737 V. KUTCHOUKOV, PH. PHILIPPOV, TECHNICAL
UNIVERSITY OF SOFIA, BULGARIA; C. SCHMIDT, TECHNICAL UNIVERSITY OF
LLMENAU, GERMANY TRIMMING OF THICK FILM RESISTORS FOR HIC BY HIGH
VOLTAGE PULSES 740 PH. PHILIPPOV, T. IVANTCHEV, TECHNICAL UNIVERSITY OF
SOFIA, BULGARIA; H. THUST, TECHNICAL UNIVERSITY OF LLMENAU, GERMANY
UNTERSUCHUNGEN ZUR KOMBINATION NAFI- UND TROCKENCHEMISCHER ATZVERFAHREN
FUR DIE HERSTELLUNG VON 3D SI-MIKROSTRUKTUREN 743 N. SCHWESINGER, V.
LANEV, TECHNICAL UNIVERSITY OF LLMENAU, GERMANY; PH. PHILIPPOV,
TECHNICAL UNIVERSITY OF SOFIA, BULGARIA MESAGO EXHIBITION PREVIEW /
MESSEPROGRAMM 747 AUTHOR S INDEX 751 24
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| author_GND | (DE-588)108658074 |
| building | Verbundindex |
| bvnumber | BV012292413 |
| ctrlnum | (OCoLC)614186673 (DE-599)BVBBV012292413 |
| format | Conference Proceeding Book |
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| genre | (DE-588)1071861417 Konferenzschrift 1998 Potsdam gnd-content |
| genre_facet | Konferenzschrift 1998 Potsdam |
| id | DE-604.BV012292413 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:25:05Z |
| institution | BVB |
| institution_GND | (DE-588)2106992-X (DE-588)2173762-9 |
| isbn | 3800724219 |
| language | German |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008335035 |
| oclc_num | 614186673 |
| open_access_boolean | |
| owner | DE-29T DE-898 DE-BY-UBR DE-634 |
| owner_facet | DE-29T DE-898 DE-BY-UBR DE-634 |
| physical | 756 S. Ill., graph. Darst. |
| publishDate | 1998 |
| publishDateSearch | 1998 |
| publishDateSort | 1998 |
| publisher | VDE-Verl. |
| record_format | marc |
| spelling | Micro-system technologies 98 6th International Conference on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Potsdam, December 1 - 3, 1998. Herbert Reichl ... (ed.). [Organized by MESAGO, Messe & Kongress GmbH Stuttgart ; FhG IZM, Fraunhofer-Einrichtung für Zuverlässigkeit und Mikrointegration, Berlin] Micro system technologies 98 Berlin [u.a.] VDE-Verl. 1998 756 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Literaturangaben Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1998 Potsdam gnd-content Mikrosystemtechnik (DE-588)4221617-5 s DE-604 Reichl, Herbert 1945- Sonstige (DE-588)108658074 oth MESAGO, Messe und Kongress Sonstige (DE-588)2106992-X oth International Conference on Micro-Electro-, -Opto-, -Mechanic Systems and Components 6 1998 Potsdam Sonstige (DE-588)2173762-9 oth GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008335035&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Micro-system technologies 98 Mikrosystemtechnik (DE-588)4221617-5 gnd |
| subject_GND | (DE-588)4221617-5 (DE-588)1071861417 |
| title | Micro-system technologies 98 |
| title_alt | Micro system technologies 98 |
| title_auth | Micro-system technologies 98 |
| title_exact_search | Micro-system technologies 98 |
| title_full | Micro-system technologies 98 6th International Conference on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Potsdam, December 1 - 3, 1998. Herbert Reichl ... (ed.). [Organized by MESAGO, Messe & Kongress GmbH Stuttgart ; FhG IZM, Fraunhofer-Einrichtung für Zuverlässigkeit und Mikrointegration, Berlin] |
| title_fullStr | Micro-system technologies 98 6th International Conference on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Potsdam, December 1 - 3, 1998. Herbert Reichl ... (ed.). [Organized by MESAGO, Messe & Kongress GmbH Stuttgart ; FhG IZM, Fraunhofer-Einrichtung für Zuverlässigkeit und Mikrointegration, Berlin] |
| title_full_unstemmed | Micro-system technologies 98 6th International Conference on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Potsdam, December 1 - 3, 1998. Herbert Reichl ... (ed.). [Organized by MESAGO, Messe & Kongress GmbH Stuttgart ; FhG IZM, Fraunhofer-Einrichtung für Zuverlässigkeit und Mikrointegration, Berlin] |
| title_short | Micro-system technologies 98 |
| title_sort | micro system technologies 98 |
| topic | Mikrosystemtechnik (DE-588)4221617-5 gnd |
| topic_facet | Mikrosystemtechnik Konferenzschrift 1998 Potsdam |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008335035&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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