Proceedings: October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota
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| Sprache: | English |
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1996
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| Schriftenreihe: | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE
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| Beschreibung: | XIII, 610 S. |
| ISBN: | 0930815483 |
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| LEADER | 00000nam a2200000 cb4500 | ||
|---|---|---|---|
| 001 | BV012165486 | ||
| 003 | DE-604 | ||
| 005 | 19981012 | ||
| 007 | t | ||
| 008 | 980922s1996 |||| 10||| eng d | ||
| 020 | |a 0930815483 |9 0-930815-48-3 | ||
| 035 | |a (OCoLC)258554197 | ||
| 035 | |a (DE-599)BVBBV012165486 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-91 | ||
| 084 | |a ELT 340f |2 stub | ||
| 111 | 2 | |a International Symposium on Microelectronics |d 1996 |c Minneapolis, Minn. |j Verfasser |0 (DE-588)5192943-0 |4 aut | |
| 245 | 1 | 0 | |a Proceedings |b October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota |c 1996 International Symposium on Microelectronics |
| 264 | 1 | |a Bellingham, Wash. |b SPIE |c 1996 | |
| 300 | |a XIII, 610 S. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |v 2920 | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 830 | 0 | |a Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |v 2920 |w (DE-604)BV000010887 |9 2920 | |
| 856 | 4 | 2 | |m Digitalisierung TU Muenchen |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008241078&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-008241078 | ||
Datensatz im Suchindex
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| adam_text | Table
of
Contents
Session
TAI
Modeling
&
Design
Session Chairs:
Jyh-Ming
Jong,
LSI Logic Corp.
Madhavan Swaminathan,
Georgia Institute of
Technology
001 SSOCAD:
Design
Automation
Methodology for Simultaneous
Switching Noise in ASICs
Satish
N.
Pratapneni, Jyh-Ming Jong, Ravindranath Kollipara, Alaa
Alani,
Clara
Lim,
Gary F. Oehrle, LSI Logic
007
Joint Time and Frequency Domain Model of Power/Ground
Plane Noise
Guang-Tsai Lei, R.W. Techentin, B.K. Gilbert, Mayo Foundation
012
Electrical Characterization and Modeling of Simultaneous
Switching I/O Buffers for High Performance Digital Systems
Jyh-Ming Jong, C.P. Yuan, T.Y.
Chou, Trong
Nguyen, LSI Logic
Corp.; V.K. Tripathi, Oregon State University
018
Thermal Transient Testing
Vladimir
Székely,
M.
Rencz, Technical University of
Budapest,
В.
Courtois,
TIMA,
France
024
Characterization of Proximity Effects Between Interconnects
Alok Tripathi, V.K. Tripathi, Oregon State University, J. Jong, LSI
Logic; T.
Arabi,
Intel Corp.
029
Spiral Inductor Design Issues in a Multilayered Medium
R.D.
Lutz,
Y. Seo,
E. Godshalk, V.K. Tripathi,
Oregon
State
University
034
Microstructurii
Modelling and Electronic Interconnect
Reliability
Paul R. Winter, E.R.
Wallach,
Cambridge University
Session TA2
Advances in LTCC
Session Chairs:
Alvin
H.
Weinberg,
Pacesetter, Inc.
John R. Menaugh, DuPont Electronics
040
The Effect of Processing Parameters and Surface Roughness of
Conductor Traces on the Microwave Properties of LTCC
Structure
S. Vasudevan,
Ferro
Corporation, EMD
049
Characterization of Printing and Laser Trimming of DuPont
2000
Series Resistors on DuPont
951
Green Tape ™
Howard
Morgenstern,
Sam
Bandier,
Gregg Barner, AlliedSignal,
Inc.
055
A Zero X-Y Shrinkage Low Temperature Cofired Ceramic
Substrate Using Ag and AgPd Conductors for Flip-Chip
Bonding
Minshiro Itagki, Yoshihiro Bessho, Kazuo
Eda, Toru
Ishida,
Matsushita Electric Industrial Co., Ltd
060
High-Quality RF-Inductors in LTCC
Jens
Muller,
Technical University of
Ilmenau
066
RF
Behavior of Printed Resistors in the Frequency Range Up
to
6
Ghz
Karl-Heinz
Drue,
Heiko
Thust, Technical University of Budapest
071
Piezoelectric Thick Films for Ultrasonic Transducer Arrays
Wesley Hackenberger, T.R. Shrout, Pennsylvania State University;
DP. Pickrell,
TRS
Ceramics, Inc.
Session
ТАЗ
Matenals
&
Processes for Packaging Manufacturing
Session Chairs:
Theodore G. Tessier, Motorola, Inc.
Howard M. Clearfield, IBM Microelectronics
077
The Effect of Chemical Bonding States on the Electrochemical
Migration of Reduced Isolating Compounds in High Density
Interconnection Systems
Gabor
Harsanyi, Technical University of Budapest; Liana Pemes,
W. Kinzy Jones, Florida International University
082
Acoustic Microscopy for
100%
Non-Destructive Semiconduc¬
tor Package Evaluation
Martin
С
Lasser,
G.H.
Harrison,
M. Agarwal,
Imperium,
Inc.
087
Effectiveness of Thin Film Barrier Metals for Eutectic Solder
Bumps
Soichi Honma, Kazuki Tateyama, Hiroshi Yamada, Kazuhide
Doi,
Naohiko Hirano, Takeshi Okada, Hideo Aoki, Yotchi Hiruta,
Toshio
Sudo,
Toshiba Corp.
093
Low Cost Flip Chip Technologies Based on Chemical Nickel
Bumping and Solder Printing
Joachim Kloeser,
Jörg Gwiasda, Elke Zakel, Fraunhofer
Institute
FhG/lTM-Berlm; Andreas
Ostmann,
Herbert Reichl, Technical
University of Berlin; Franz Bechtold,
Siegert GmbH
103
FES (Printing Encapsulation Systems) for Some BGA
Packagings
A. Okuno,
N.
Fujita, K. Ikeda, K. Nagai, Y. Tsukasaki,
N.
Oyama,
K. Nakahira, T. Hashimoto, Japan
Rec
Co., Ltd.; M. Robertson,
MCC
108
Rapid Cure Process (RCP) for CerDIP Packages Using
Tungsten-Halogen Lamps
Greg Hotchkiss, Paul
Hundt, Kwan
Yew Kee, Texas Instruments
Session TP1
Emerging Technologies
Session Chairs:
Alan P.
Genis,
Northern Illinois University
Rajen
Chanchani,
Sandia
National Laboratories
120
High Current Integrated Microinductors and Micro-
transformers Using Low Temperature Fabrication Processes
Jae Y. Park, Mark G. Allen, Georgia Institute of Technology
IX
Table
of
Contents
126
Integrated Capacitors Using Polymer-Ceramic Composites for
MCM-L
Premjeet Chahal, Rao R. Tummala, Mark G. Allen, Georgia
Institute o/Technology
132
Miniature Filters for Wireless Applications
Kenneth Lakin, K.T. McCarron, R.E. Rose, TFR Technologies, Inc.
138
Polymer Optical Waveguide Interconnect Technology
Julian Bristow, Yue Liu, David Greenlaw, Terry
Marta,
Klein
Johnson, Brian
Hanzal,
Andy Peczalski, Sommy Bounnak,
Honeywell Technology Center
143
MicroJet Printing for Low Cost Optical Interconnects
W.
Royall
Cox, D.J. Hayes, T. Chen, R.F. Hoenigman, MicroFab
Technologies; D.L. MacFarlane, The University of Texas at Dallas
Session TP2
Polymeric Materials
Session Chairs:
David
D Ambra, DuPont
Electronics
Susan
Bagan,
Advanced Process Concepts
149
Selection, Reliability Evaluation, and Specification of a Liquid
Encapsulant
for Plastic-Encapsulated
Microcircuits
(РЕМ)
Leonard
R. Enlow,
Dale Swanson, Rockwell International Corp.
157
A Study of Reworkable Flip Chip
Encapsulants
Wei Koh, Express Packaging Systems, Inc.: D.
Zoba,
Dexter
Electronic Materials
162
Post-Cure Die Attach Delamination
Patrice Pare, Michel Roy, IBM Canada Lid.
168
Physical and Mechanical Properties Determination of Pnoto-
BCB-Based Thin Films
Jang-Hi
Im,
Е.О.
Shaffer,
R.
Peters,
T.
Rey,
С.
Murlick, R.L.
Sammler, The
Dov Chemical
Company
176
Ferrite
Filled
Polymers for Integrated Power Conversion
Devices
Laure
К.
Lagorce, Mark G. Allen, Georgia Institute of Technology
181
Novel Epoxy-Based Compositions for Microelectronic
Packaging Applications
Mahesh Sambasivam, Ram Ghoshal, Pofyset Company;
Prosanto
К.
Mukerji,
Motorola, Inc.
Session
ТРЗ
Sensors
Session Chair:
James T. Cook,
Ferro EMD
186
A Surface Acoustic Wave/Polymer Gas Sensor for Use in a
Hybrid Oscillator Circuit
Patrick R. Story, Claudius Feger, David W. Galipeau, South
Dakota State University
191
Polymeric Films in Microelectronic Sensors
Gabor
Harsanyi, Technical University of Budapest
196
Processing and Piezoelectric Properties of PZT Films and
1-3
Connectivity PZT/Polymer Composite Sensors
John S. Wright, L.F. Francis, University of Minnesota
202
A Packaging-Compatible, Fully Integrated Micromachined
Relay
W.P. Taylor, M.G. Allen, Georgia Institute of Technology; C.R.
Dauwalter, Milli Sensor Systems
&
Actuators Inc.
208
Microelectronic Assembling and Testing in Low-Cost Tactile
Sensing
A. Brandolini,
Alessandro
Gandelli, R. Ottoboni, DIP
Elettrotecnica-Politecnico di Milano
213
New Polymer Thick-Film Temperature Sensor with a Switch-
OverTCR
J.J. Gondek, Private Research
&
Development Centre for
Electronics;
Т.Н.
Wojeweodzki, Academy of Mining
&
Metal¬
lurgy; Z. Parzelka, Technical School of Communications (Poland)
Session TP4
Advanced Packaging
Session Chairs:
Akshay V. Shah, Bell Laboratories, Lucent Technology
John A. Olenick, Eastman Kodak Company
218
Low-Cost Parallel
MCM
Interconnect Test on Large Area
Substrates
K. Sasidhar, B. Kim, A. Chatterjee, M. Swaminathan, Georgia
Institute of Technology
224
MCM-D with Embedded Active and Passive Components
M. Topper, J. Wolf, V. Gtaw, K. Buschick, A. Dabek, O. Ehrmann,
H.
Reichl, Technische Universität
Berlin
230 3-D
Flip Chip Packaging in LTCC for High Density Microwave
Applications
W. Marsh, M. Kline, F.
Kuss,
D.
Strack,
Northrup Grumman;
M.
Berry, Microelectronics Center of North Carolina (MCNC)
236
New Chip Scale Package for Medical Applications: Plip-
Chip
Christian M.
Val,
3D
Plus; Alain
Rippart,
Yves Van Campenhout,
LoreaUELA Recherche
243
Advanced Build-Up Wiring Technology for MCM-D/L
Kazuhito Higuchi, Takeshi Miyagi, Hiroshi Yamada, Masayuki
Saito,
Toshiba Corporation
249
High Performance, Organic Single Chip Package
William G. Petefish, W.L. Gore; Edward
С
Priest, Silicon
Graphics/MIPS
254
Environmentally Reliable Plastic Package Design for the
Charge-Coupled Device
(CCD)
Kwang-Seong Choi, Dae-Soon Kang, Jae-Won Cho, Young-Gon
Kim, LG Semicon/Package R&D Center
Table
of
Contents
Session
WAI
Japanese (Translated
Session)
Session Chairs:
Fumio Miyashiro, Toshiba Chemical Corp.
Charles E.
Bauer, TechLead
Corp.
Session
W
A3
Thick/Thin Film
Materials
Session Chairs:
Richard E. Sigliano, Kyocera America, Inc.
James R. Keski, Keski International
259
CSP
Technology and Bare Chip Mount
Hiroshi Iwasaki, Toshiba Corporation
265
Advanced CSP and Substrate Technologies
Tetsuya Koyama,
Masayuki Sasaki, Shinichi
Wakabayashi, Shinko
Electric Industries
271
Plastic LGA889
Using Flip-Chip Bonding
on
Build-Up
Substrate
M. Minamizawa, M. Lijima, S. Ueno, T.
Akai,
M. Nukiwa, T.
Шага,
T.
Hamáno,
К.
Soekawa, Y. Miyazawa, T. Shirotsuki,
Fujitsu Ltd.
279
Application for 3-Dimensional Memory Module
Naqji Senba, Nobuaki Takahashi, Y
uzo
Shimada, Dcushi Morizaki,
Kenichi
Tokuno, Makoto Ohtsuuka,
Katsumasa
Hashimoto, NEC
Corporation
285
Ultra
Slim TCP with New
TCP Structure
Naoyuki
Taj
ima,
Yasunori Chikawa, Mitsuaki Ohsono,
Kenj
і
Toyosawa, Sharp Corporation
Session WA2
SMT
Session Chairs:
Roupen L. Keusseyan, DuPont Electronic
Materials
Gregory Caswell, Galaxy
Microsystems
291
Flip Chip
Production
Experience: Some Design, Process,
Reliability, and Cost Considerations
J.D. Mis, G. A.
Rinne, P.A.
Deane, G.M.
Adema,
Microelectron¬
ics Center of North Carolina (MCNC)
296
Solder Jet Printing for Low Cost Wafer Bumping
Donald J. Hayes, David B. Wallace, Microfab Technologies, Inc.
302
Effect of Mini-Cycles on the Solder Joint Fatique Behavior as a
Result of Their Superimposition on Main Cycles
Giulio DiGiacomo, IBM
Microelectronics
308
Evaluation of Lead-Free Solder and No-Clean Flux for
Attachment of High Power Components to Direct Bond Copper
S. LeAnn Hodges, Janet K. Lumpp, University of Kentucky
314
Application and Reliability Evaluation of Solder Replacements
in SMT Assembly for Satellite Electronics
Dale Swanson,
Len
Enlow,
Dan Steigler,
Edward
Timms,
Rockwell
International
322
The At-Temperature Mechanical Properties of Lead-Tin-Based
Alloys
W. Kinzy Jones, Y.Q. Liu, Mark
A. Zampino,
Gerardo L.
Gonzalez, Florida International
University
328
Low Warpage, Lead-Free Multilayer Dielectric
Tetsuya Tanaka, E. Martin Kris, Shoei Chemical Inc.
333
Thick Film Material System for Surge Protection
S. Vasudevan,
Ferro
Corporation, EMD
340
A Thick Film Technology Combining Microwave and
MCM
Applications
Peter G. Bam well, Heraeus, Inc., Cermalloy Division
344
Thick Film Solder Wells for Fine Pitch Flip Chip Attach
Mike Erickson,
HEI,
Inc.
349
Thin Film High
К
Dielectrics for Integrated Passive Devices
Gregory T. Stauf, Ralph Carl, Steve Bilodeau, Peter Van Buskirk,
ATM; Kent Watts, Lucent/AT&T
355
New Gold Thick Film Compositions for Fine Line Printing on
Various Substrate Surfaces
R. L. Keusseyan, R. Parr, B.S. Speck, J.C. Crumpton, J.T.
Chaplinsky, C.J. Roach, K.
Valenta, G.S.
Home, DuPont
Electronic Materials
Session WP1
Power Packaging
&
Thermal Management
Session Chairs:
Bill O. Moody, B. Moody
&
Associates, Inc.
Al Kram,
Hughes Aircraft Company
359
Electronic Packaging Solutions for Power Electronic Building
Blocks (PEBB)
Fred
D
Barlow, Aicha Elshabini-Riad, Douglas Nelson, Virginia
Polytechnic Institute
&
State University
365
Power Fidelity Performance
&
Thermal Management of
Wirebond Pin Grid Array Packages
Thomas Dolbear, Hassan Hashemi, Dennis Herrell, Advanced
Micro Devices, Inc.
371
Electroless Copper Plating on Laser Patterned Aluminum
Nitride
Sarmad Albanna, Janet K. Lumpp, University of Kentucky
377
Design and Fabrication of Thermal Management Materials for
High Performance Electronic Packages
Birol Sonuparlak, M.D. Lehigh, PCC Composites
383
Properly Implementing Thermal Spreading Will Cut Cost
While Improving Device Reliability
Ngon B. Nguyen, Northrup Grumman
389
Reliability of Copper Baseplate High Current Power Modules
James M. Fusaro, Motorola, Inc.
;
Robert Darveaux, Amkor
Electronics
XI
Table
of
Contents
Session WP2
Modeling of
MCMs
Session Chair:
R.
Wayne
Johnson,
Auburn University
397
Consortium for Intelligent Large
Area
Processing (CILAP)
G.T. Wells, C.C. Chau, The Dow Chemical Company;
P.E.
Garrou,
R.
Heistand,
S. Cummings, T. Rehg, Dow
at
MicroModule
Systems; C. Ho, E. Chieh, MicroModule Systems; G.
Gibson,
С.
Newquist,
FAS Technologies, Inc.; R.
Клиек, С
Ellec, L.
Vogt,
Radiant
Technology Corp.
403
Sheldahl s MCM-L
Progress
Adam T. Singer,
Larry Lemke, IBIS Associates,
Inc.
408 System Performance
of ASIC Packages
Tai-YuChou, Express Packaging System, Inc.
414
Computational Modeling of On-Dtmand Solder Delivery for
Fluxless
MCM
Packaging Applications
Marcelino
Essien,
P.A.
Sackinger, H.C. Peebles,
Sandia
National
Laboratories
Session WP3
Wirebond
Session Chairs:
Bruce M. Romenesko, The Johns Hopkins University
Lee R.
Levine,
Kulicke
&
Soffa
Industries, Inc.
420
Wirebonding for Mnltichip Modules
Harry K. Charles, Jr.,
K.J.
Mach, R.L.
Edwards, S.J. Lehtonen,
The Johns Hopkins University APL
426
Increasing Bond Quality by Ultrasonic Vibration Monitoring
Frank Osterwald, Herbert Reichl, Technical University of Berlin;
Klaus-Dietes Lang, Fraunhofer
Institute 1ZM Berlin
432
Evaluation of Wirebond Quality by
SEM
Analysis of Ball-
Shape and Visual Inspection of Intermetallic Formation
Daniel T. Rooney, Jeffrey B. Dixon, Kenneth G.
Schurr,
Mark R.
Northrup, Motorola Automotive
ά
Industrial Group
444
The Evaluation of Thermosonic Wedge Bond Width and
Optimal Pull Strength
Nicole DeBlieck,
Patt
Feller, Rockwell International
450
New Wire Design Requirements for Wire Bonding Applica¬
tions
Michael McKeown, Larry Monterulo, Frank
Grasso,
Charles
Italiano,
Semiconductor Packaging Materials
Session WP4
Thick Film Applications
Session Chairs:
Paul
Galletta,
Teledyne Microelectronics
Harry Kellzi, Teledyne Electronic Technologies
456
The Design and Development of a 40kV Thick Film Voltage
Divider
Joseph E. Meadows, Fluke Corp.
462
RF Characterization of Thick Film Materials for Portable
Transceivers
David J. Nabatian, Orville Brown, Samson Shahbazi, EMCA-
REMEX Products; James Harrer, Ray Petit, Valor Electronics
470
High Performance Multkhip Modules for an Airborne Radar
Application
Jean-Paul Y. Droguet, G. Teissier, F. Mayenc, J.J. Julie, Thomson
CSF
476
Next Generation Engine Control Modules Using Advanced
Multilayer Technology Materials
Marc LaBranche, C. J. McCormick, Jerome D. Smith, Christopher
R.S. Needes, Kenneth W. Hang, DuPont; J.
K. Isenberg, A. W.
Schubring,
C. R.
Caopman,
С.
Α.
Paszkiet, F. Lautzenhiser,
E.
Ellis, D.H.R.
Sarma, Delco
Electronics
482
ESD
Susceptibility of High Gauge Factor Thick Film
Piezoresistors
Sanjay M.
Chítale, C.Y.D.
Huang, S.J. Stein, Electro-Science
Laboratories, Inc.; D. Raesner, CTSCorp.
488
Implantable Medical Device with Multi-Layered Ceramic
Enclosure
Beth
Anne Hassler,
Jos Dondess, Hans
Kolnaar, Medtronics,
Inc.
Session THAI
RF/Microwave Materials, Devices and
Characterizations
Session Chairs:
Ron Bamett, Hewlett Packard
Aicha Elshabini-Riad, Virginia Polytechnic Institute and State
University
494
Microwave Material Characterization
Daniel L. Amey, Samuel Horowitz, DuPont Electronic Materials
500
RF/Microwave Surface Mount Plastic Package Modeling and
Characterization
Sedki
Riad,
Wansheng
Su,
Iman
Salama,
Aicha
Elshabini-Riad,
Virginia Polytechnic Institute
&
State University; Michael
Rachlin, Walter (Greg) Baker, James Perdue, TTT GTC
508
A
16
Watt,
8.0-103
GHz Power Amplifier Using HFET
MMICS and a Compact LTCC Splitter/Combiner Network
J. Gipprich, J. Faulkner, M. Pingor, J.
Masti,
M. Hershfeld,
Northrup Grumman Corporation
511
Cross-Talk Analysis Using the Floating Conductor Model
Benjamin
Beker,
George Cokkinides, University of South
Carolina; Allen
Templeton,
A VX
Corporation
Xli
Table
of
Contents
517
Finite Width Coplanar Waveguide for Microwave and
Millimeter-Wave Integrated Circuits
George E. Ponchak, NASA Lewis Research Center, Steve
Robertson,
Fred Brauchler,
Jac
East, Linda P.B. Katehi, University
of Michigan
522
High Frequency Interconnections and Crosstalk on
MCM
Structures
C. E.
Free,
K.P.
Tang, D. Li, K..E.G. Pitt, Middlesex University; P.
Bamwell, KonserQ Ltd.
Session THA2
Reliability
Session Chairs:
Arnold Soslow, The Quality Management Company
John R. Devaney, Hi-Rel Laboratories
526
Particle Generation of Silver-Glass Die Attaches During a
Rapid Cure Process (RCP)
Greg Hotchkiss, Texas Instruments
538
Area Array Interconnect Reliability Prediction Using
Stochastically Defined Conditions
Horatio
Quiñones,
Eugene Atwood, Elizabeth Collins, IBM-FSC
579
Yield and Process Management Through the Fractional
Factory Concept
John J. Reagan, WL Gore
&
Associates, Inc.
585
Using Process Control Techniques to Reduce Cost and Improve
Quality of Thick Film Printing Screens
Robert
N.
Bouchard,
RIV
Inc.
594
CSP with
LOC
Technology
Noriaki Taketani, Kazuhisa Hatano, Hiroshi Sugimoto,
Osamu
Yoshioka, Gen Murakami, Hitachi Cable, Ltd.
600
Assembly Equipment for Low-Cost Flip Chip Technologies
Helmut KergeL Randolf Schliesser, VDWDE-
Technologiezentrum
Informationstechnik GmbH; Bernd Monno,
Finetech Electronic GmbH
Appendix
606
ISHM Organizational Members
609
Index of Authors
544
A Failure Mechanism of Copper Alloy Leadframe in Automo¬
tive Electronic Packaging
Jay G. Liu, Pardeep K. Bhatti, Mark E. Webster, Robert W. Bibby,
Delco
Electronics Corporation
551
Factors Influencing Fatigue Life of Area-Array Solder Joints
Roman Katchmar, Eileen
Goulet,
Jeremy Laliberte, Nortel
Technologies
557
Warpage Calculation for Laminated Structures Composed of
CTE-Mismatched Layers
Dietrich E.
Riemer,
Boeing Research and Technology
563
Practical Stress Analysis and Design Optimization of Seam
Welded Packages
Brian
Drude,
Kristen
M.
Hiñes, Northrop Grumman
Session THA3
Manufacturing & Process Improvement
Session Chairs:
Thomas Green, NCC National Training Center for Microelectronics
Michael SaJloum, Cerprobe
569
Design Specifications for Manufacturability of MCM-C
Multichip Modules
Roy J.
Blažek,
Jay Desch, David Kautz, Howard
Morgenstern,
Allied Signal Federal Manufacturing
&
Technologies
575
Countering the Flight of Jobs to Offshore Locations through
Productivity Improvements
David Braunstein,
California Manufacturing Technology Center
XIII
|
| any_adam_object | 1 |
| author_corporate | International Symposium on Microelectronics Minneapolis, Minn |
| author_corporate_role | aut |
| author_facet | International Symposium on Microelectronics Minneapolis, Minn |
| author_sort | International Symposium on Microelectronics Minneapolis, Minn |
| building | Verbundindex |
| bvnumber | BV012165486 |
| classification_tum | ELT 340f |
| ctrlnum | (OCoLC)258554197 (DE-599)BVBBV012165486 |
| discipline | Elektrotechnik |
| format | Conference Proceeding Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01418nam a2200313 cb4500</leader><controlfield tag="001">BV012165486</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">19981012 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">980922s1996 |||| 10||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0930815483</subfield><subfield code="9">0-930815-48-3</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)258554197</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV012165486</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 340f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">International Symposium on Microelectronics</subfield><subfield code="d">1996</subfield><subfield code="c">Minneapolis, Minn.</subfield><subfield code="j">Verfasser</subfield><subfield code="0">(DE-588)5192943-0</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Proceedings</subfield><subfield code="b">October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota</subfield><subfield code="c">1996 International Symposium on Microelectronics</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Bellingham, Wash.</subfield><subfield code="b">SPIE</subfield><subfield code="c">1996</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XIII, 610 S.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE</subfield><subfield code="v">2920</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE</subfield><subfield code="v">2920</subfield><subfield code="w">(DE-604)BV000010887</subfield><subfield code="9">2920</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Digitalisierung TU Muenchen</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008241078&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-008241078</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV012165486 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-09T18:22:50Z |
| institution | BVB |
| institution_GND | (DE-588)5192943-0 |
| isbn | 0930815483 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008241078 |
| oclc_num | 258554197 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | XIII, 610 S. |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| publisher | SPIE |
| record_format | marc |
| series | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| series2 | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| spelling | International Symposium on Microelectronics 1996 Minneapolis, Minn. Verfasser (DE-588)5192943-0 aut Proceedings October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota 1996 International Symposium on Microelectronics Bellingham, Wash. SPIE 1996 XIII, 610 S. txt rdacontent n rdamedia nc rdacarrier Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE 2920 (DE-588)1071861417 Konferenzschrift gnd-content Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE 2920 (DE-604)BV000010887 2920 Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008241078&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Proceedings October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| subject_GND | (DE-588)1071861417 |
| title | Proceedings October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota |
| title_auth | Proceedings October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota |
| title_exact_search | Proceedings October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota |
| title_full | Proceedings October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota 1996 International Symposium on Microelectronics |
| title_fullStr | Proceedings October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota 1996 International Symposium on Microelectronics |
| title_full_unstemmed | Proceedings October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota 1996 International Symposium on Microelectronics |
| title_short | Proceedings |
| title_sort | proceedings october 8 10 1996 minneapolis convention center minneapolis minnesota |
| title_sub | October 8 - 10, 1996, Minneapolis Convention Center, Minneapolis, Minnesota |
| topic_facet | Konferenzschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008241078&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV000010887 |
| work_keys_str_mv | AT internationalsymposiumonmicroelectronicsminneapolisminn proceedingsoctober8101996minneapolisconventioncenterminneapolisminnesota |