Proceedings: April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado
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| Sprache: | English |
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| Beschreibung: | XI, 545 S. Ill. |
| ISBN: | 0780348508 0780348516 |
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| 111 | 2 | |a International Conference and Exhibition on Multichip Modules and High Density Packaging |n 7 |d 1998 |c Denver, Colo. |j Verfasser |0 (DE-588)16137236-3 |4 aut | |
| 245 | 1 | 0 | |a Proceedings |b April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado |c 1998 International Conference on Multichip Modules and High Density Packaging |
| 264 | 1 | |a Piscataway, NJ |b IEEE Service Center |c 1998 | |
| 300 | |a XI, 545 S. |b Ill. | ||
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Datensatz im Suchindex
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| adam_text | Table of Contents
Session WAI
MCM-L
Session Chairs:
Bill Pelefish, W.L. Gore Associate*
Jeflrev K. Kenned1., Johnson Matthew
Electronics
001 Building
a Domestic High Density Flip Chip Organic
Substrate Capability
:
ITRI/SEMATECH Chip
Carrikr Project
Marshall Andrews,
/77?/:
Jolm
DeRosa,
Sematech
007
Adhesion Evaluation of Adhesivkless Metal/
Polyimide Substrate for
MCM
and High Density
Packaging
Hunt Jiang, Bill
Chou,
Solomon Beilin, Fujitsu Computer
Packaging Technologies, Inc.
013
A Comparative Analysis of RF-Characteristics of
High Density MCM-L Technologies
Andreas Thiel, Claus Habiger,
Gerhard
Troster,
ΕΤΗ
Zurich/
Electronics Lab
(IFEì
019
MCM/KGD
Development Roadmap in Japan
-
EIAJ
Perspective
Toshio
Sudo,
Toshiba Corporation; Manabu Bonkohara, NEC
Corporation
024
Characterization Notes Joininc Flip Chip MCM-L
with Large Die and Deformed Bump Geometries
John M. Gzarnowski, Diane Hodges, Waseem Adamjee,
Christina Corona, Rick
Eklund,
Motorola SPS
029
Multichip Packaging in QFPs by PBO-Mlltilayer
High Density Lnterconnect
Norbert Ammann, Harry Hedler, Siemens
Components
Session WA2
Flip Chip
Session Chairs:
Deborah S. Patterson, Flip Chip
Technolog}
Glenn A.
Rinne,
Unitive
Electronics
035
Prediction of Yield for Fup-Chip Solder Assemblies
Susan
С
Tower, Bingzhi
Su, Y.C.
Lee, University
of
Colorado
041
Reflow-Curable Polymer
Fluxes for Flip Chip
Encapsulation
M. Albert Capote, Sherry Zhu, Ligui
Zhou,
Águila
Technolo¬
gies, Inc. , R.
Жаупе
Johnson,
Jeff
Suhling, Auburn University
047
The Fup-chip Bump Interconnection for Millimeter-
wave GaAs MMIC
Hideki Kusamitsu, Y. Morishita, K. Maruhashi, M.
Ito,
K. Ohata,
NEC Corporation
053
Study of RF Flip-chip Assembly witi
і
Underfill Epoxy
Wenge Zhang, Bingzhi
Su,
Zhiping Feng,
К. С
Gupta, Y.C.
Lee, University of Colorado
058
Evolution of a Unique Flip Chip MCM-L Package
Miguel A. Jimarez, Son
Tran,
Christian Lecoz, Glenn
Dearing, IBM Microelectronics
064
Fup Chip Assembly on Rigid Organic Laminates: A
Production Ready Process for Automotive Electron¬
ics
Michael Witty, Robin L. Sellers, James R. Rosson, Geoff G.
Walker, Michael P. Meehan, Robert L.
Vadas,
Daniel K.
Ward, Delphi-Delco Electonics Systems
Session WA3
Test
Session Chairs:
Paul Franzon, North Carolina State University
Steven Ladd,
InterChip
Systems, Inc.
070
Membrane Design for
MCM
and BGA Substrate Test
John Cofield, Mentor Graphics Corporation
074
Passive Component Inspection Using Machine Vision
Winncy
Y. Du,
Stephen L. Dickerson, Georgia Institute of
Technology
080
Improving Yields Through Effective Diagnostics: A
MCM-D/C Example
Erie
Perfecto,
Kamalesh K. Desai, Graham McAfee, IBM
Microelectronics
087
A Probe Routing Algorithm for
MCM
Substrate
Test
Bruce
C. Kim,
Rongchang Yan, Tufts University
Vi
Table of Contents
Session WP1
MCM-C and MCM-D
Session Chairs:
Rick Sigliano,
Kyocera
America, Inc.
Chung W. Ho, Micro Module Systems
092
cliaracteization and optimization of ltcc for hlgh
Density Large Area MCM s
Jack B. Thornton, Michael Richtarsic, Lockheed Martin
E&M
098
AMI: A New Thin Film Substrate Technology
Eva Igner, D. Hurwitz, B. Yofis, D. Katz,
PCB
Ltd.
106
Adapting Multichip Module Foundries for MEMS
Packaging
Jeffrey T. Butler, Air Force Institute of Technology , Victor M.
Brigiit,
University of Colorado; Patrick
B. Chu,
Tanner
Research Inc., Richard J.
Saia,
G.E.
Corporate Research and
Development
112
A New Concept for
Usíng
of
Al
-Sheet as Integrated
Substrate for One or Multichip Module Package
Philipp Philippov,
Teenical University of Sofia
118
Solutions to Catastrophic Yield Problems in MCM-D
Interconnect Production
Van Vo, Julia Hawley, Raytheon
TI
Systems
124
Low Cost
MCM
Package for Mobile Telecommunica¬
tions
Makota Shimada,
Kyocera
Corporation
Session WP2
Thermal Management
Session Chairs:
Ajay P. Maishe, University of Arkansas (HiDECi
Chris
Schaffer,
Hughes Space
ť£
Communications
129
Thermal Management for Multifunctional Struc¬
tures
Suraj Rawal, David M. Barnett, David E. Martin, Martin
Marietta Corporation
135
Thermal Management Issues and Evaluation of a
Novel, Flexible Substrates, 3-Dimensio.nal
(3-D)
Packaging Concept
W.D. Brown,
A.
P. Maishe, T. A. Railkar, J. W. Stone, W. T.
Sommers,
L. W.
Schaper,
The University of
ArkansastHiDEC);
T. G.
Lenihan, Sheldahl, Inc.
141
149
155
160
Enhancement of Multichip Modules (MCMs) Cooling
by Incorporating MicroHeatPipes and Other High
Thermal Conductivity Materials Into MicroChannel
Heat Sinks
Maurice Marongiu, MJM Engineering; B. Kusha, G.S.
Fallon,
Fluent, Inc.
Utilizing Low Forward Voltage Drop Power
Semiconductors to Minimize Heat Sinking Require¬
ments in Multichip Module DC Solid State Relays
&
Static Switching Applications
Lonne Mays, K.
Kime,
Motorola SPS
All Silicon
Multi
Chip Module with a Fully
Integrated Cooling System
Jorg Pilchowski, A. Holke, H. T. Henderson,
T. M.
Harms,
M. Kazmierczak,
E M.
Gerner,
University of Cincinnati
Graphite Fiber Composites for
СТЕ
Control in
Thermal Management
James C.
Calder,
Daniel R. Harrigan, William C. Riley,
Materials Innovations, Inc.
Session WP3
Design
Session Chairs:
Greg Peterschmidt,
Mentor Graphics
Madhavan Swaminathan, Georgia Institute of Technology
165
Managing High-Frequency Signals with MCMs
Brian
Durwood, Jeff
Powell, Paul
Rutteneutter, Maxtek
Components Corporation
172
High Frequency
1С
то
1С
Signaling on Rapidly
Prototyped Flip-Chip MCM-D Substrate
Jason D. Reed, Guy Caldwell, Minchuan Wang,
Tom Hirsch,
Ian Yee, Brent Lunceford, Anjan Somadder, Deborah Cobb,
Robert F. Miracky,
MCC
VH
Table of Contents
178
Simulation and Optimization of
MCM
Interconnec¬
tions
Prof. Wu-Shiung Feng, Sliing Tenqchen, Ming-chi Chen,
National
ТаЫап
University
184
A System Level Approach to a Structured
MCM
Design Methodology
Claudio
Trazzi. Eric Beyne, IMEC
VZW;
Edwin Ringoot,
Alcatel Bell-Belgium
190
DfT techniques for first-time right MCMs
-
exempli¬
fied by a Pentium
MCM
system
Jean-Pierre Wyss,
Claus Habiger,
Etienne
Hirt, Gerhard
Troster,
ΕΤΗ
Zurich
Electronics
Laboratory
Session THAI
Advanced Materials
Session Chairs:
Daniel I. Amey, E. I. DuPont
Dave Kellerman, Materials Solutions
196
A New Low Loss Lead Free LTCC System for
Wireless and RF Applications
Paul
С
Donohue, B.E. Taylor,
D.I.
Amey, R.R. Draudt, M.A.
Smith, S.J. Horowitz and J. R. Larry, DuPont
200
Characterization and Processing of Low Dielectric
Constant Thick Film Substrates for MCM-C Modules
Dave Kellerman, Material Solutions, David J. Nabatian,
Peter Bokalo, Feng He, EMCA-Remex Products; Larry
Retherford, MIT Lincoln Laboratories; Fred Barlow, Aicha
Elshabini, Virginia Tech
206
New Low Cost Interconnection Materials For High
Frequency
MCM
Applications
Roupen L. Keusseyan, Daniel Amey, Samuel Horowitz,
DuPont Electronic Materials
212
High Performance Photo-Sensitive Insulating
Materials for MCM-L
Haruo Akahoshi,
Mineo
Kawamoto, Tokihito
Suwa,
Masashi
Miyazaki,
Hiroyuki Fukai, Hitachi Research Laboratory
218
A New Interlayer Interconnect Technology
fok
Multilayer Fabrication
Dean Neuburger, Dan Jacobus, Tim Lenihan,
Courtland
Robinson,
Sheldahl, Inc.-, Goran Matijasevic, Linh Ha,
Catherine Gallagher, Christopher
Castello, Pradeep
Gandhi,
Orme!
Corporation
224
CVD Diamond Wafers for Thermal Management
Application in Electronic Packaging
Henry Windischmann,
Norton Diamond Film
Session THA2
CSP
Charles E. Bauer, TechLead Corporation
Jon G. Aday, Motorola, Inc.
229
Flip Chip Chip Scale Packaging: Transfering the Flip
Chip Density Requirements from the Motherboard to
the Chip Carrier
Jon G. Aday, Corey Koehler, Ted Tessier,
Burt
Carpenter,
Yushi Matsuda, Motorola, Inc.; Claire
Estes,
Auburn
University
236
Packaging Properties of ALIVH-CSP using SBB Flip-
Chip Bonding Technology
Minehiro Itagaki, Kazuyoshi
Amami, Yoshihiro
Tomura,
Šatoru
Yuhaku,
Osamu
Noda, Yoshihiro Bessho, Kazuo
Eda,
Toru Ishida,
Matsushita Electric Industrial Co., Ltd.
242
Reliability Evaluation of Chip-on-Flex CSP Devices
Raymond A. Fillion, Bill Burdick, Pat
Piacente,
Len
Douglas, Dave Shaddock, Rich
Saia,
Cii
Corporate R&D
247
The Development of a Top-Bottom-BGA (TB-BGA)
Rudolf Leutenbauen
Volker
Grosser,
Bernd
Michel, Herbert
Reiehl, Fraunhofer
Institute FhG/IZM-Berlin
543
CSP Limitations Imposed by
Mainboard
Technology
Limits
Jim Rates, Chip Supply, Inc.
253
Trends in BGA Design Methodologies
Kevin Rinebold, Xynetix Design Systems
Session THA3
RF
&
Telecom
Session Chairs:
David J. Pedder, Mitel Semiconductor
Eric Beyne, IMEC
256
Integrated Passive Components in MCM-Si Technol¬
ogy and their Applications in RF-Systems
Jürgen Härtung, SICAN
ñesearch
and Development
VIH
Table of Contents
Microwave
Мічлгісшр
Modulks
Using Low Cost
Microwave Chip on Flkx Packaging Tk.ciinoi.ogy
Michael K. McNulty, Joseph
Schnell, Doreeii
Nixon,
Lockheed
Martin
262
268
273
279
285
MCM-D
&
Direct
Modlu:
Attach for RF Applica¬
tions
Colin Faulkner, K.G. Arnold,
DJ. Pedder,
Mitel
Semiconductor
Flip-Chip GaAs MMICs for Microwavk MCM-D
Applications
Stephen Wadsworth, BJ. Buck,
DJ.
Warner,
I.D.
Juland,
GEC-Marconi
Materiala
Technology Ltd.; A. W. Dearn,
Plextek. Ltd.
MULTICHIP-MODULES (MCMs) FOR MlCRO- AND MlI.LlME-
ter-Wave Applications- a Challenge?
Martin Oppermann, Daimler-Benz Aerospace
Low -CoMPUcxm MCM-D Technology with Inte¬
grated Passives for High Frequency Appucations
Marc de Sambei;
Philips Research; Nick
Pulsford, Marc
van
Delden, Robert
Milšom,
Philips Research-England
Session THP1
Interconnect
Session Chairs:
George G.
Hárman, N1ST
Happy
Holden, TechLead
Corporation
291
Thermosonic Gold
Wíre
Bonding to Palladium
Finishes on Laminate Substrates
R. Wayne Johnson, Michael J. Rainier, Mike
Вогаск,
Tamara
Isaacs-Smith, Auburn university
300
Wirebonding: Reinventing the Process for MCMs
Harry K. Charles,
K. J. Mach, R. L.
Edwards,
S. J.
Lehtonen, D. M. Lee,
The Johns Hopkins University
303
Bare Chip Stacking Structure for
MCM
Production
Tadashi Kimura,
Osamu Okuda,
Haruo Ishikawa, Yoshinori
Suzuki, Sumitomo Metal Mining, Charles R. Hodges, Peter
Kim, Kazü
Nakajima, Flextronics Internationa^ Inc.
308
Vibration-induced Fatigue Failures in Bonding Wires
Used in Stacked Chip Modules
Henning Leidecker, Scott
Huli,
Goddard Space Flight
Center/NASA
314
Transcription Solder Bump Technology Using The
Evaporation Method
Kiyotaka Seyama, Haruhiko Yamamoto, Kazuaki Sato,
Ilideaki Yoshimura, Hideki Ota, Yasuhiro
Usui,
Fujitsu
Limited
319
Flip Chip Interconnects with Electroplated,
Extended Eutectic Solder
John II. Glezen,
H.A.
Naseem, I. Fritsch, R.K.
Ulrich, W.D.
Brown, L.W.
Schaper,
University of Arkansas
Session THP2
High Density Interconnect on Flex
Session Chair:
John W.
Balde,
ЮС
324
330
337
342
349
354
FLExPAC
-
Development and Qualification of a Low
CostCSP
E. Herbert Reichl,
Ramin
Azadeh, Christine Kallmayer,
Sabine Anhock,
Hermann Oppermann, Technical University of
Berlin; Ghassem Azdasht,
Erik Busse, Rolf
Asehenbrenner,
Fraunhofer
Institute IZM
F2-cPAC ™
-
A Manufacturing Process for a Low
Cost CSP
E Kasulke, T.
Oppert, E.
Zakel,
L.
Titerle,
Рас
Tech -
Packaging Technologies GmbH
Multilayer Film Substrates with
30
Micron
Vias
for
MCM Appucations
Alexander
Fach,
В.
Ketterer,
U.
Brunner,
J.
link, High tec
MCAG
Microvias and Flex
-
M
Enabling MCM-L Technol¬
ogy
James Keating, Robert Larmouth, Teledyne Electronic
Technologies
Thin Film Passive Elements on Polyimide Film
Richard Saia,
H. S.
Cole,
К.
M. Durocher,
G.E.
Corporate
D
M.C.
Nielsen, Rensselaer
Polytechnic
Institute
Feasibility Study of Thermally Integrated Mechani¬
cal Configuration for a Novel
3-D
Flex
MCM
Tarak A. Railkar, William B. Morrison, W.D. Brown, Ajay
E
Malshe, University of
ArkansasţHiDECî;
Tim G. Lenihan,
Sheldahl, Inc.
IX
Table of Contents
Session THP3
KGD
Session Chairs:
jim
Rates, Chip Supply Inc.
Jodv Van Horn, IBM
358
Fur
Cniľ
MCM-L
Usra;
Known Goo»
Dik
Diane Hodges,
Wa^eeni
Adanijee, Christina Corona,
Jolin
M.
Caarnowski, Rick
Eklund,
James Guajardo,
Alvin
Y oungUooil, Motorola
362
KGD Production
kor
Controlled Chip Collapse
Connkction (C4) Applications
Eugene Atwooc),
Camille
Bowne, Kim Kelly, IBM
Microelec¬
tronica,
368
Invkstigations on some KGD approaches for Space
Applications
Michel R.
Massénat, Matra
Marconi Space France (MMSF);
Alberto Boetti, ESA ESTEC-European Space Agency, Marc
Billot, CNES
-
frendi
Space Agency
3 74
Test Methods Used to Produce Highly Reliable
Known Good Die (KGD)
Richard Arnold, Sankaran M. Menon, Brett Brackett, Ron
Richmond, Texas Instruments
383
Membrane Probe with Pyramidal Tips for a Bare
Chip Testing
Susumu Kasukabe, Terutaka Mori, Takayoshi Watanabe,
Hidetaka Shigi, Yuji
Wada,
Akihiko
Ariga,
Hitachi,
Ltd.
388
Using Silicon Contacts to Test and Burn-In FLASH
Memory, Microprocessors, and FPGA s
Lance Criscuolo, Bear Technology
393
Replaceable Chip Module RCM™
James Ralhburn, Gryphics, Inc.
Session THP4
Reliability
Session Chairs:
Richard K.
Ulrich,
University of Arkansas (HiDEC)
Tom Evans,
Symbios
Logic, Inc.
399
Stress Comparison of TBGA, MBGA, and
ViPERBGAfTM) Using the PAQCchip
Thomas
С
Evans, William T. Bright II, E. Allen Kenyon,
Symbios
Logic Inc.
405
Complete Stress State Measurements in
Ci
up on
Board Packages
Jeffrey Suhling, Y.
Zou,
R.
Wayne Johnson, R. C.
Jaeger,
Auburn university
416
Hermetic-Equivalent Packaging of Data Accumula¬
tor MCM-L Modules for
Gemerai.
Aviation Avionics
Applications
John K. Hagge, Christina M. Conway, Rockwell International
422
Solder Joint Reliability Modeling for a
540-1/0
Pi-asticc Ball-Grid-Array Assembly
Bingzhi
Su,
Saeed Hareb, Y.C Lee, University
oí
Colorado ,
Mirng-Ji
Lii,
Mark E. Thurston, Intel Corporation
429
A Study on Solder Joint Reliability Including
FEM
Simulations on Silicon Substrate MCM-D
Eva Hellgren,
Gunnar
Gustafsson,
Ericsson Components
AB
435
Void Free Die Attachment for Multichip Modules
Using Solder Alloys
Paul Barnes, Scientilic Sealing Technology
Session
FAI
Substrate Processing
Session Chairs:
Albert Lin,
Лраск
Technologies, Inc.
Raymond A. Fillion, GE Corporate R&D
441
Precision Copper Pattern Plating on Ceramic for
High Performance MCMs
Leon M. Balents,
Gunnar Gustafsson, Ken
Christopher,
Jim
Morrison, Dan
Skoczyłaś, Zecal™, Inc.
449
Thermo-Mechanical Stresses in Laminated Polymer
Films on Shjcon Substrates
Jin S. Kim, Kyung W. Paik, Seung H. Oh, Hyun S.
Seo,
Korea
Advanced Institute of Science and Technology (KAIST)
454
Evaluation of Diffusion Patterning as an Alterna¬
tive Substrate Technology for Automotive Applica¬
tions
Jie Xue, Theresa Baker, Tom Klosowiak, Maria
Moinar,
Mike
Pomerov,
Jim Weimer, Gerry Bianco, Motorola, Inc.; Robert
Mason, DuPont Electronics
Table of Contents
Optimizing Mask
Materiais
and Laser Pattern
Transfer Processing for Cheap MCM-L Fast
Prototyping and Special Sensor Appucatons
460
466
474
Gabor
Harsain
і,
Zsolt Illyefalvi-Vitéz,
Janos Pinkola,
Miklós
Rusziiikó, Endre Tóth,
Technical
University
of Budapest
High Density MCM-C Utilizing Tape Dielectric and
Photopattkrning Phoc esses
Michael P. (TNeill, Peter Bamwell, Herueus Inc., Cernmllov
Dh ision; Steven S. Scrantom, Gregory J.
Gravier,
Scrantom
Engineering, Inc.
Mechanical
Integrit»
Issues of MCM-Cs for High
Reliability Applications
Howard A.
Morgenstern, Tom Tarbutton, Gary
Веска,
Allied
Signal A erospace
Session FA2
Integrated Passives
Session Chairs:
Timothy Lenihan, Sheldahl
Howard M. Clearfield, Dow Chemical Company
478
Spiral Inductors Integrated In MCM-D using the
Design Space Concept
Philip Pieters, Eric Beyne, IMEC
484
Construction, Characterization, and Reliability of
BaTiO2(3)
-
Based Buried Thick Film Capacitor
Materials Sets,
1200
<K
< 1600.
Robert C. Mason, Patrick
Bolton,
Ricardo
Velasquez, DuPont
Electronics
490
Development of Thin Film Resistors for Use in
Multichip Modules
Karen L.
Coates,
C
-Е
Chien, M. H. Tanielian, Y-Y. R.
Hsiao,
D. J. Kovach, C-H.
Tang,
Boeing Information, Späce
&
Defense
Systems
496
Inductive Crosstalk Between Integrated Passive
Components in RF-Wireless Modules
Robert C. Frye, Peter R. Smith, Yee L. Low, Lucent
Technologies Bell
Labs
501
Integrated Passive Devices using Al/BCB Thin Films
Howard M. Clearfield, S. Wijeyesekera, E.A. Logan, A. Luu,
D. Gieser, C.-M. Lin, J. Jing,
Intarsia;
W.B.
Rogers,
D.
Scheck,
Dow Chemical Company,
D.
Benson, J. He,
Flextronics international
506
Modeling and Mixed Signal Simulation of Embedded
Passive
Components in High Performance Packages
Anisa
Sood, Kwang
Lim
Choi, Anand Haridass, Nanju Na,
Madhavan Swaminathan, Georgia Institute of Technology
Session FA3
Applications
Session Chairs:
Theodore G. Tessier, Motorola, Inc.
Bill Baker, Baker Associates
512
The Future of MCMs: What is it? And What Will
They Look Like?
E. Jan Vardaman, TechSearch International, Inc.
516
A Multichip Page Size Image Sensor
Alain Perregaux, Xerox Corporation
520
Flip Chip MPU Module on High Performance Printed
Circuit Board ALIVH
Tsukasa Shiraishi, Kazuyoshi
Amami, Yoshihiro
Bessho,
Kazunori Sakamaoto, Kazuo
Eda, Toru Ishida,
Matsushita
Electric Industrial Co., Ltd.; Kazuyoshi Fukuoka, Matsushita
Electronic Components Co., Ltd.
526
Flip Chip MicroPallet Technology
-
A Chip-Scale
Chip
Martin Goetz, Alpine Microsystems
531
mcm-l requirements for an automotive electronic
Control Unit application
Daniel Lambert, J.
Joly,
Bull
ΤΡΑΜ;
J. Hunt, Rover Group
Ltd.
537
A Low-Cost
MCM
Implementation for 100-Hz TV
Up-conversion
M. Menke, M. Schu, R. Heimgaertner, U. Langenkamp, M.
Plan,
E Runkei,
B.
Stumpf,
В.
Schaetzler, Siemens HL
CE
PE
VA; R. Gottinger,
IC-Design
Co., Bissau
546
Appendix
Index of Authors
xi
|
| any_adam_object | 1 |
| author_corporate | International Conference and Exhibition on Multichip Modules and High Density Packaging Denver, Colo |
| author_corporate_role | aut |
| author_facet | International Conference and Exhibition on Multichip Modules and High Density Packaging Denver, Colo |
| author_sort | International Conference and Exhibition on Multichip Modules and High Density Packaging Denver, Colo |
| building | Verbundindex |
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| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
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| genre_facet | Konferenzschrift 1998 Denver Colo. |
| id | DE-604.BV012017347 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:20:16Z |
| institution | BVB |
| institution_GND | (DE-588)16137236-3 |
| isbn | 0780348508 0780348516 |
| language | English |
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| physical | XI, 545 S. Ill. |
| publishDate | 1998 |
| publishDateSearch | 1998 |
| publishDateSort | 1998 |
| publisher | IEEE Service Center |
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| spelling | International Conference and Exhibition on Multichip Modules and High Density Packaging 7 1998 Denver, Colo. Verfasser (DE-588)16137236-3 aut Proceedings April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado 1998 International Conference on Multichip Modules and High Density Packaging Piscataway, NJ IEEE Service Center 1998 XI, 545 S. Ill. txt rdacontent n rdamedia nc rdacarrier Multichiptechnik (DE-588)4267925-4 gnd rswk-swf Platzierung Mikroelektronik (DE-588)4197293-4 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1998 Denver Colo. gnd-content Multichiptechnik (DE-588)4267925-4 s Platzierung Mikroelektronik (DE-588)4197293-4 s DE-604 Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008133458&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Proceedings April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado Multichiptechnik (DE-588)4267925-4 gnd Platzierung Mikroelektronik (DE-588)4197293-4 gnd |
| subject_GND | (DE-588)4267925-4 (DE-588)4197293-4 (DE-588)1071861417 |
| title | Proceedings April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado |
| title_auth | Proceedings April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado |
| title_exact_search | Proceedings April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado |
| title_full | Proceedings April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado 1998 International Conference on Multichip Modules and High Density Packaging |
| title_fullStr | Proceedings April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado 1998 International Conference on Multichip Modules and High Density Packaging |
| title_full_unstemmed | Proceedings April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado 1998 International Conference on Multichip Modules and High Density Packaging |
| title_short | Proceedings |
| title_sort | proceedings april 15 17 1998 the adam s mark hotel denver colorado |
| title_sub | April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado |
| topic | Multichiptechnik (DE-588)4267925-4 gnd Platzierung Mikroelektronik (DE-588)4197293-4 gnd |
| topic_facet | Multichiptechnik Platzierung Mikroelektronik Konferenzschrift 1998 Denver Colo. |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008133458&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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