Proceedings: April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Tagungsbericht Buch |
| Sprache: | English |
| Veröffentlicht: |
Reston, Va.
ISHM
1996
|
| Schriftenreihe: | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE
2794 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | 422S. Ill., graph. Darst. |
| ISBN: | 0930815475 |
Internformat
MARC
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| 111 | 2 | |a International Conference and Exhibition on Multichip Modules |n 5 |d 1996 |c Denver, Colo. |j Verfasser |0 (DE-588)5177568-2 |4 aut | |
| 245 | 1 | 0 | |a Proceedings |b April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado |c 1996 International Conference on Multichip Modules |
| 264 | 1 | |a Reston, Va. |b ISHM |c 1996 | |
| 300 | |a 422S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
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| 490 | 1 | |a Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |v 2794 | |
| 650 | 4 | |a Electronic packaging |v Congresses | |
| 650 | 4 | |a Microelectronic packaging |v Congresses | |
| 650 | 4 | |a Multichip modules (Microelectronics) |v Congresses | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
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| 999 | |a oai:aleph.bib-bvb.de:BVB01-008133167 | ||
Datensatz im Suchindex
| _version_ | 1804126614633578496 |
|---|---|
| adam_text | Table of Contents
MCM-L
Session Chain:
Ted Tessier, Motoroh, Inc.
Hassan Hashemi, Advanced Micro Devices
001
A Pentium* Processor Based
L/D MCM
Test
Vehicle: A Subsystem for Portable Applications
Naveen Cherukuri, Jai-Min Liao, Fujitsu Microelectronics, Inc.;
Rene* V. Denuit, Intel Corporation , Kyoichiro Kawano,
Fujitsu,
Ltd., Japan
006
Casting Light on Recent Advancements in Laser
Based MCM-L Processing
Theodore
G.
Tessier, J.G. Aday, Motorola, Inc.
015
Comparing Costs for Various PWB Build-Up
Technologies
Happy
Hőiden,
Hewlett-Packard
022
Development and Characterization of a Few-Chip
Module Housing a DC-DC Power Supply
Hassan Hashemi, Advanced Micro Devices, David Walshak,
Crystal Semiconductor; Ryush Mehroira, Harris Semiconductor
028
A Low Cost
Мишсшр
Module Using Flex Substrate
and Ball Grid Array
D.A.
Anm,
J.E Parkerson, LW.
Schaper,
S.S.
Ang,
HiDEC/
University ofAHamsas
MCM-C
Session Chairs:
Alvin
Weinbeig, Pacesetter, Inc.
Steve Annas,
Шѕрго
Corporation
033
Design Trade-Qffs of MCM-C vs. Ball Grid Array
on Printed Wiring Board
Samuel J. Horowitz, Daniel I.
Ămey,
Jay
E Rsge,
Dupont
Electronics; Steven K. Ladd, James E. Mandiy,
InterChip
Systems, Inc.;
Dave Hohnes,
C
-МАС
Industries, Inc.
039
Stressing the Need for Improved Pricing Metrics
for MCM-D and MCM-D on
С
Products
Daniel G. Bergen Howard M. Clearfield, William J. O Dannell,
William
R.
Millet; IBM Microelectronics
045
Thermal Management Approach for a Scalable,
MCM-Based System
Brad Barfflsoa, Karl E. Hokanson, Cray Research, Inc.
052
Hermetic Thick Film
Мишснір
Modules
Koupen
L.
Кешѕеуаа,
H.
Sawhffl, S.
Horowitz and G.
Horne,
DuPont Electronics
058
Testing Probe for Multichip Modules with High-
Speed VLSIs
Susumu
Кдаик&Ье,
ïasushi
Mizuuehi, and Kiyoshi Numata,
Hitachi, Ltd.
063
Line Impedance Control in MCM-Cs with Meshed
GROUND-/POWER Planes
Jens Mullen O. Badstubner, H. Thust, Technical University of
Ilmenau;
M.Exner,
ElcktrcJxramik GmbH
Progress in MCM-D
Session Chairs:
Chung W. Ho, Micro
Madide
Systems
Howard M. Clearfield, IBM Microelectronics
069
MCM-D/C Applications for a High Performance
Module
E.D.
Perfecto,
К.
MeEntee,
К,
Iidestri,
H.
Łongworth,
T. Wassick, J.
Pennacchią,
M. Elkwarth, A. Merryman, IBM
Microelectronics
075
Twinstar
-
Dual Pentium® Processor Module
Michael
E
Skinner,
Philip
E.
Garrou, Daniel
Castillo,
Scott
Cummings, Dow Chemical
at MMS; Ken
Liu, David
Chazan,
Robert xteinschmidt, Scott
Westbrook,
Chung Ho, Micro Module
Systems; W. Boyd Rogers, MCNC
082
Advanced MCM-Ds Break the I/O Bottleneck wrra
Embedded Area-Array Integrated Circuits
Roger Gravrok, David
Scheid,
Joel X
Reke,
Kenneth A.
VanGoor,
Ven Rao,
Cray Research, Inc.
416
A New Low Cost
-
High Performance
MCM
Substrate Technology
S. Neftm, V. Mirsky
088
A Hermetic Thin Film Sealing Technology for
MCM-D
Dale MeHerroii, Hilton Toy, Armando Cammarano, IBM
Microelectronics
094
Thermally Stable Thin Film Tantalum Pentoxide
Capacitor
Michael G. Peters, Michael G. Lee, Yasuhito lakahashi, and
Solomon Beilin, Fujitsu Computer Packaging Technologies
High Performance Applications
Session Chairs:
Robert C. Frye, AT&T Bell Laboratories
Tim Lenihan, University of Arkansas
100
Design and Fabrication of a High Speed
Мишсшр
Module
Jennifer Peltier, Wes
Hansford,
USCIlnformation Sciences
Institute; Mike Emerling, Peter Parrish, Tanner Research, Inc.
108
A4S0-MFLOPMCMBASEDONTHESHARCDSP
Chip, Breaks the
MCM
Cost Barrier
Robert K- Seannell, Analog Devices, Inc..
113
High-Bandwidth Low-Latency
3D
Memory Module
Joel Ficke, Roger J. Gravrok, Karl E. Hokanson, and
Christopher J. Berry, Cray Research, Inc.
119
The Modular Design and Realization of a
35
GHz
Phase Shifter Receiver
Martín
Oppermann, Ernst Feurer, Bruno Holl, Joerg Schroth,
Daimier-Benz Aerospace
ÅG
125
A Set of Multichip Modules for High Speed
Telecom Applications
Luigi
Iicciardi, M. Peretti,
L, Piláti,
CSELT;
JJ. Ichai,
E
Martin,
IBM
Montpellier
Technologies
131
HAM: A Cost Effective, High Speed ATM
Switching Matrix Using MCM-L and Bumpless TAB
Jean
Joly,
D.
Lambert,
Вий
SA,
France;
В
Piaza, I+D Telefonica,
Spain
Automotive
Session Chairs:
R.
Wayne Johnson, Auburn University
John Evans, Chrysler-Acustar
142
Low Cost MCM-L for Vehicle Applications:
Innerlayer Materials and Process
Rolf E.
Funer,
Chuck Sullivan, AMP+jUCZO Company Carolina
Circuits; Ray D. Rust, Conductor Analysis Technologies, Inc.;
Michael Witty,
Delco
Electronics
147
Fault and Yield Modeling of MCMs for
Automotive Applications
Scott T. Williamson, Adit D. Singh, Victor
В
Nelson, Auburn
University
155
Thermo-Mechnical Design of Flip Chips for Harsh
Environments
Stelios
Michaelides, Suresh
Sitaraman, Georgia Institute of
Technology
161
Significance of Design Parameters on the Thermal
Fatique Life of Plastic Ball Grid Arrays
Ahmer R. Syed,
Délco
Electronics Corporation
137
MCM
Application: Automotive Case Studies
Patrick Datt Agnese, Siemens Automotive
Military
&
Aerospace
Session Chairs:
Ronald J.
Jenson,
Honeywell, Inc.
Robert Clarke, Teledyne Electronic Technologies
167
Lid Deflection for MCMs in Airborne Application
Kangsen Huey, Charles R. Hodges, Donald Benson, Steve
Nguyen, Bruce Jarvis,
пСНЩ
INC.
173
Environmentally Protected Chip On Board for
mlliatry and aerospace applications
Gerard J.
Plite
,
Lockheed Martin
179
Pushing the State-of-the-Art in MCM-L Design:
Ultra Dense, Low-Cost Smart Gasket Applications
Steven Ladd, Interchip Systems, Inc.
183
CLAy Field Configurable Multi-Chip Module
(FCMCM)
Luu Nguyen, T. Garrerick,
С
Field, National Semiconductor
Corp.
187
Summary of Results from the Known Good Devices
Program
Steven Mango, Norm Palmer, Raytheon Company
193
Reliability Modeling of MCMs
-
RELTECH Lessons
Learned
James M. Newell, Timothy W. Larson, Jet Propulsion Laboratory;
Glenn R. Gersch, NSWC Crane Division; Mark Stoklosa, Air
Force Rome Laboratory
Design
&
Test
Session Chairs:
Larry
Güg,
MCC
Carol Mamow, Micro Module Systems
199
System Level Functional Test Generation
Methodology for
Мишсшр
Modules
Jim Wenzel,
S.
Fostei;
C.S.
Hui,
M.
Green, Motorola, Inc.
205
MCM
Test Vectors from Logic Simulation
Andrew Flint, Motorola, Inc.
210
Lessons Learned from Two Complex
MCM
Designs
Brian Campinell, Steven Mango, Jean Seire, Raytheon Electronic
Systems
216
A Signal Noise Comparison of the Interconnected
Mesh Power System (IMPS) wrra a Standard Four-
Layer
MCM
Topology
Michael D.
Giova;
James
Б
Parkerson, and
Leonard W.
Schaper,
HiDECIUnwersity of Arkansas
220
Integrated Systems
Dirk J.
Bartelink,
Hewlett-Packard
Laboratories
Portable
Session Chairs:
E. Jan Vardaman, lechSearch International, Inc.
Seppo Pienimma, Nokia
226
MCM
Market: New Applications in a Mature
Industry?
E. Jan Vardaman, Robert T. Crowley, TechSearch Int l, Inc.
230
MCM
Design Methodology tor Portable Wireless
Communication Systems Design
Ravender Goyal, Mentor Graphics Corporation, Vijai Tripathi,
Oregon State Vnvaersity
234
Sumcase
-
An Ultra Thin Chip Size Integrated
Circuit Package
Avner Badihi,
N.
Schlomovich, M. De-La-Vega,
N.
Karligano,
2.
Baron, Shellcase, Ltd
239
A Comparative Analysis of High Density PWB
Technologies
Jon G. Aday, T.G. Tessier, H. Crews, J.
Rasul,
Motorola, Inc.
245
A SiiicoN-ON-SiLicoN
MCM
Base-Band Controller
for a Spread-Sprectrum Radio
William D. Simmons, Michael G. Johnson, Byung J. Han, Robert
С
five, AT&T
Вей
Laboratories
Processes
Session Chairs:
Charles E. Bauec TechLead Corporation
Raymond A. Fillion, GE Corporate Research
250
Novel Low-Cost Process Technologies for
Application and Curing of Polyimide Films
Susan
Bagen,
Advanced Process Concepts; Carl Newquist, Greg
Gibson,
FAS-lèchnologies,
Inc.; Hans Melgaard, Corey Minnich,
Despatch Industries
257
Chip Scale Packaging with High Reliability for
MCM
Applications
Mark
Loboda
,
R.C. Camilletti, Dow Corning Corporation·, LjL
Goodman, L. White, H.L. Pinch, J. Shaw, V.K.
Pàtel,
C.E Wu,
David Samoff Research Center; G.M.
Adema, MCNC
263
High Density Thin Film Flexible Interconnector
Michael G. Peters, William
Chou,
Michael Lee, Vivek Mansingh,
and Solomon Beilin, Fujitsu Computer Packaging Technologies
269
Low Cost Copper Plating MCM-D Technology
Celio
A. Finardi, A.M. Almeida, M. Bamett, A. Flacker;
A.C.
Gozzi, J.E Molina, M.E
Santos,
A.C.
Zuccollo,
Braalian
Telecom
-Telehras
Known Good Die
Seuion Chair«:
Barbara Vasquez, Motorola, Inc.
Jody
Van Horn, IBM General Technology Division
275
Wafer Level Membrane Probe Testing of Area
Array Die for Manufacturing High Performance
MCMs
Katherine
Blotsfield,
Л.
Brotmtn, Motorola,
tne.; R. Grsvrok, K.
VanGooii Cray Research;
D.
Simon,
J.
Semil,
Packard Hughes
Interconnect
281
SRAM Known Good Die Test Experience
Bete Moberg,
National Semiconductor
287
A Pragmatic Look at Wafer Level Burn-In: The
Wafer-Level Known Good Die Consortium
W. Gieg Flynn, Larry Gflg, Microelectronics
&
Computer
Technology Corp.
293
Known Good Die Program Implementation Case
Study: Intel SmartDie™ Products
Jose Avalos, Intel
Corporation;
Fariborx Agehdel, MicroModids
Systems, Inc.
299
Extension of the Chip-on-Flex Technology to
Known Good Die
William E. Burdick, Ray KHion, G£ Corporate R&D
305
Using Tape and Reel tor High Volume Packaging of
Bare Die
Gerald Bad, 3M Company
310
Using Topological Die Mapping with Electrical
Fault Detection to Improve Process Yield in Known
Good Die MCMs
Richard
Arnold, Dan
Prevede!,
Texas
Instruments
Modeling
&
Analysis
Session Chairs:
Leonard
Schapen
University
of Arkansas
Judy Gorman, Silicon Graphics, Inc.
317
Thermo-Mechamcal Analysis and
Fatíque
Life
Prediction of MCM-D Interconnects
Timothy W. Larson, James M. Newell, Steven
L
Coroiată,
Jet
Propulsimi
Laboratory
323
Refining
MCM
Thermal Simulation Models with
Test Vehicles
Daren Bennett, B.T. DeMuth, B.E. Pines, Department of Defense
329
Modeling Interconnect Coupling Between Analog,
Digital and RF Layout Components for
MCM
Designs
Vijai TKpathi
Y. Seo,
A. Kpatbi, R.D. Lute, Oregon State
Unaersüy;
Rivender Goya!,
Mentor Graphics Corporation
333
Performance Comparison of Discrete and Buried
Capacitors
Bidyut K. Sen, Jiunn-Yau Iiou, Hiroyuki Adaohi, Richard
Wheeler, Fujitsu Computer Packaging Technology; James C.
Parker Js·, Sun Microsystems Computer Corporation
339
MCM-D Manufacturing for the 21st Century: The
Facility, The Product, The Cost
Jeff R. Dieffenbaoh, Betsy B. Adams, IBIS Associates, Inc.
Interconnect
Session
Chaire:
Michael Brans, Tektronix
Marty Neese, Jabil Circuit, Inc.
345
Low-Cost Flip Chip CoHsortium
Luu Nguyeft, National Semiconductor Corp.
351
Demonstration of a Chip Scale, Chip-on-Flex
Technology
Raymond A. RHion, Robert Wojnarowsld, Rich
Saia,
Don
Kuk,
GE
Corporate Research
357
Wire Button Contact Retainer Board for
3-D
Interconected MCM s
Randy E. Ackennan
,
Dean A. Schaefei;
Е
-Systems Garland
División
362
Reverse Beam-Lead Interconnections for Ultra
j
High-Speed Multkhip Applications
ι
I Wolf-Dieter Nob; Gerhard
Hanke,
Deutsche
Telekom
369
A Fine-Pitch Leadless Chip Assembly Technology
j
WITH THE BUILT-UP
PCB
і
Kei
lanaka,
M.
Bonkohara, A. Dohya, T. Shimada, M. Tanioka,
and T. Kimura, NEC Corporation
375
Jedi (J-90)
System Upgrade: A Case Study of the
Memory Bar Module
Carolyn Qass, Daniel F. Nelson, Texas Instruments;
Ven
В.
Rao,
Cray Research, Inc.
MCM
Materials
Session Chairs:
William R. Bratschun, Motorola, Inc.
Rajen
Chanehani,
Sandia
National Laboratories
380
New Olefinic Interuevel Dielectric Materials for
Multi-Chip Modules
Paul Kohl,
S.A.
Bidstrup-Allen,
N.
R. Grove, Georgia Tech; R.
A.
Schick,
B.L. Goodall, L. H. Mcbtosh, S. Jayaraman, B.F.
Goodrich
385
A Low Cost Near-Hermetic Multichip Module
Based on Liquid Crystal Polymer Dielectrics
Thomas E. Noll, K. (Jay) Jayaraj, and Brian Farrell,
Foster-Miller, Inc.; Robert S. Larmouth, Teledyne Electronic
Technologies
391
On the Effective Intergration of Resistors and
Capacitors into a MCM-Si Design
Jo Lemout, A. Van Calster, University of Gent; G. Schols,
Alcatel-Mietec
397
Ultrasonic Bonding Tools for Fine Pitch, High
Reliability Interconnect
Jerbey C. Demmin, Microminiature Technology
403
A Novel Aluminum on Quartz Mask for Excimer
Laser Projection Ablation
Rajesh S.
Batel,
IBM Microelectronics; J. Speidell, S.
Cordes,
IBM/ TJ. Watson Research Center
409
Stress-Free Thermoplastic Adhesives tor High
Reliability Microelectronics Applications
Qaire T. Monti, Kevin Chung, A.I. Technology, Inc.
Appendix
422
Index of Authors
|
| any_adam_object | 1 |
| author_corporate | International Conference and Exhibition on Multichip Modules Denver, Colo |
| author_corporate_role | aut |
| author_facet | International Conference and Exhibition on Multichip Modules Denver, Colo |
| author_sort | International Conference and Exhibition on Multichip Modules Denver, Colo |
| building | Verbundindex |
| bvnumber | BV012017012 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
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| classification_tum | ELT 299f |
| ctrlnum | (OCoLC)34985936 (DE-599)BVBBV012017012 |
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| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
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| indexdate | 2024-07-09T18:20:15Z |
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| publisher | ISHM |
| record_format | marc |
| series | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| series2 | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| spelling | International Conference and Exhibition on Multichip Modules 5 1996 Denver, Colo. Verfasser (DE-588)5177568-2 aut Proceedings April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado 1996 International Conference on Multichip Modules Reston, Va. ISHM 1996 422S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE 2794 Electronic packaging Congresses Microelectronic packaging Congresses Multichip modules (Microelectronics) Congresses (DE-588)1071861417 Konferenzschrift gnd-content Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE 2794 (DE-604)BV000010887 2794 Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008133167&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Proceedings April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE Electronic packaging Congresses Microelectronic packaging Congresses Multichip modules (Microelectronics) Congresses |
| subject_GND | (DE-588)1071861417 |
| title | Proceedings April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado |
| title_auth | Proceedings April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado |
| title_exact_search | Proceedings April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado |
| title_full | Proceedings April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado 1996 International Conference on Multichip Modules |
| title_fullStr | Proceedings April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado 1996 International Conference on Multichip Modules |
| title_full_unstemmed | Proceedings April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado 1996 International Conference on Multichip Modules |
| title_short | Proceedings |
| title_sort | proceedings april 17 19 1996 the marriott tech center denver colorado |
| title_sub | April 17 - 19, 1996, the Marriott Tech Center, Denver, Colorado |
| topic | Electronic packaging Congresses Microelectronic packaging Congresses Multichip modules (Microelectronics) Congresses |
| topic_facet | Electronic packaging Congresses Microelectronic packaging Congresses Multichip modules (Microelectronics) Congresses Konferenzschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008133167&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV000010887 |
| work_keys_str_mv | AT internationalconferenceandexhibitiononmultichipmodulesdenvercolo proceedingsapril17191996themarriotttechcenterdenvercolorado |