Semiconductor packaging: a multidisciplinary approach
Saved in:
Bibliographic Details
Format: Book
Language:English
Published: New York [u.a.] Wiley 1994
Series:Wiley professional paperback series
A Wiley-Interscience publication
Subjects:
Physical Description:X, 887 S. Ill., graph. Darst.
ISBN:0471532991
0471181234

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection!