Semiconductor packaging: a multidisciplinary approach
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
Wiley
1994
|
| Schriftenreihe: | Wiley professional paperback series
A Wiley-Interscience publication |
| Schlagworte: | |
| Beschreibung: | X, 887 S. Ill., graph. Darst. |
| ISBN: | 0471532991 0471181234 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV011672269 | ||
| 003 | DE-604 | ||
| 005 | 19971215 | ||
| 007 | t | ||
| 008 | 971208s1994 ad|| |||| 00||| eng d | ||
| 020 | |a 0471532991 |9 0-471-53299-1 | ||
| 020 | |a 0471181234 |9 0-471-18123-4 | ||
| 035 | |a (OCoLC)39081315 | ||
| 035 | |a (DE-599)BVBBV011672269 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 | ||
| 050 | 0 | |a TK7870.15 | |
| 084 | |a ZN 4950 |0 (DE-625)157424: |2 rvk | ||
| 245 | 1 | 0 | |a Semiconductor packaging |b a multidisciplinary approach |c ed. by Robert J. Hannemann ... |
| 264 | 1 | |a New York [u.a.] |b Wiley |c 1994 | |
| 300 | |a X, 887 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Wiley professional paperback series | |
| 490 | 0 | |a A Wiley-Interscience publication | |
| 650 | 7 | |a CONSTRUCTION |2 nasat | |
| 650 | 7 | |a DESIGN |2 nasat | |
| 650 | 7 | |a MICROELECTRONICS |2 nasat | |
| 650 | 7 | |a PACKAGING |2 nasat | |
| 650 | 7 | |a SEMICONDUCTOR DEVICES |2 nasat | |
| 650 | 4 | |a Microelectronic packaging | |
| 650 | 4 | |a Semiconductors |x Design and construction | |
| 650 | 0 | 7 | |a VLSI |0 (DE-588)4117388-0 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a VLSI |0 (DE-588)4117388-0 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Hannemann, Robert J. |e Sonstige |4 oth | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-007868705 | ||
Datensatz im Suchindex
| _version_ | 1804126207440060416 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV011672269 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
| callnumber-raw | TK7870.15 |
| callnumber-search | TK7870.15 |
| callnumber-sort | TK 47870.15 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4950 |
| ctrlnum | (OCoLC)39081315 (DE-599)BVBBV011672269 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01369nam a2200433 c 4500</leader><controlfield tag="001">BV011672269</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">19971215 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">971208s1994 ad|| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0471532991</subfield><subfield code="9">0-471-53299-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0471181234</subfield><subfield code="9">0-471-18123-4</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)39081315</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV011672269</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7870.15</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4950</subfield><subfield code="0">(DE-625)157424:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Semiconductor packaging</subfield><subfield code="b">a multidisciplinary approach</subfield><subfield code="c">ed. by Robert J. Hannemann ...</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New York [u.a.]</subfield><subfield code="b">Wiley</subfield><subfield code="c">1994</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">X, 887 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Wiley professional paperback series</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">A Wiley-Interscience publication</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">CONSTRUCTION</subfield><subfield code="2">nasat</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">DESIGN</subfield><subfield code="2">nasat</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">MICROELECTRONICS</subfield><subfield code="2">nasat</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">PACKAGING</subfield><subfield code="2">nasat</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">SEMICONDUCTOR DEVICES</subfield><subfield code="2">nasat</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronic packaging</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors</subfield><subfield code="x">Design and construction</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Hannemann, Robert J.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-007868705</subfield></datafield></record></collection> |
| id | DE-604.BV011672269 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:13:47Z |
| institution | BVB |
| isbn | 0471532991 0471181234 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007868705 |
| oclc_num | 39081315 |
| open_access_boolean | |
| owner | DE-703 |
| owner_facet | DE-703 |
| physical | X, 887 S. Ill., graph. Darst. |
| publishDate | 1994 |
| publishDateSearch | 1994 |
| publishDateSort | 1994 |
| publisher | Wiley |
| record_format | marc |
| series2 | Wiley professional paperback series A Wiley-Interscience publication |
| spelling | Semiconductor packaging a multidisciplinary approach ed. by Robert J. Hannemann ... New York [u.a.] Wiley 1994 X, 887 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Wiley professional paperback series A Wiley-Interscience publication CONSTRUCTION nasat DESIGN nasat MICROELECTRONICS nasat PACKAGING nasat SEMICONDUCTOR DEVICES nasat Microelectronic packaging Semiconductors Design and construction VLSI (DE-588)4117388-0 gnd rswk-swf VLSI (DE-588)4117388-0 s DE-604 Hannemann, Robert J. Sonstige oth |
| spellingShingle | Semiconductor packaging a multidisciplinary approach CONSTRUCTION nasat DESIGN nasat MICROELECTRONICS nasat PACKAGING nasat SEMICONDUCTOR DEVICES nasat Microelectronic packaging Semiconductors Design and construction VLSI (DE-588)4117388-0 gnd |
| subject_GND | (DE-588)4117388-0 |
| title | Semiconductor packaging a multidisciplinary approach |
| title_auth | Semiconductor packaging a multidisciplinary approach |
| title_exact_search | Semiconductor packaging a multidisciplinary approach |
| title_full | Semiconductor packaging a multidisciplinary approach ed. by Robert J. Hannemann ... |
| title_fullStr | Semiconductor packaging a multidisciplinary approach ed. by Robert J. Hannemann ... |
| title_full_unstemmed | Semiconductor packaging a multidisciplinary approach ed. by Robert J. Hannemann ... |
| title_short | Semiconductor packaging |
| title_sort | semiconductor packaging a multidisciplinary approach |
| title_sub | a multidisciplinary approach |
| topic | CONSTRUCTION nasat DESIGN nasat MICROELECTRONICS nasat PACKAGING nasat SEMICONDUCTOR DEVICES nasat Microelectronic packaging Semiconductors Design and construction VLSI (DE-588)4117388-0 gnd |
| topic_facet | CONSTRUCTION DESIGN MICROELECTRONICS PACKAGING SEMICONDUCTOR DEVICES Microelectronic packaging Semiconductors Design and construction VLSI |
| work_keys_str_mv | AT hannemannrobertj semiconductorpackagingamultidisciplinaryapproach |