Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | German |
| Veröffentlicht: |
1996
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| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Bremen, Univ., Diss., 1996 |
| Beschreibung: | VIII, 147 S. Ill., graph. Darst. |
Internformat
MARC
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| 300 | |a VIII, 147 S. |b Ill., graph. Darst. | ||
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Datensatz im Suchindex
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| any_adam_object | 1 |
| author | Schulze, Steffen |
| author_facet | Schulze, Steffen |
| author_role | aut |
| author_sort | Schulze, Steffen |
| author_variant | s s ss |
| building | Verbundindex |
| bvnumber | BV011409537 |
| ctrlnum | (OCoLC)258262608 (DE-599)BVBBV011409537 |
| format | Book |
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| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV011409537 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:09:16Z |
| institution | BVB |
| language | German |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007670733 |
| oclc_num | 258262608 |
| open_access_boolean | |
| owner | DE-355 DE-BY-UBR DE-11 |
| owner_facet | DE-355 DE-BY-UBR DE-11 |
| physical | VIII, 147 S. Ill., graph. Darst. |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| record_format | marc |
| spelling | Schulze, Steffen Verfasser aut Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden vorgelegt von Steffen Schulze 1996 VIII, 147 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Bremen, Univ., Diss., 1996 Siliciumsensor - Mikromechanik - Wafer - Verkappen - Bonden - Niedrigtemperatur Mikromechanik (DE-588)4205811-9 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Siliciumsensor (DE-588)4193160-9 gnd rswk-swf Niedrigtemperatur (DE-588)4417434-2 gnd rswk-swf Verkappen (DE-588)4389354-5 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Siliciumsensor (DE-588)4193160-9 s Mikromechanik (DE-588)4205811-9 s Wafer (DE-588)4294605-0 s Verkappen (DE-588)4389354-5 s Bonden (DE-588)4232594-8 s Niedrigtemperatur (DE-588)4417434-2 s DE-604 DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007670733&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Schulze, Steffen Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden Siliciumsensor - Mikromechanik - Wafer - Verkappen - Bonden - Niedrigtemperatur Mikromechanik (DE-588)4205811-9 gnd Wafer (DE-588)4294605-0 gnd Siliciumsensor (DE-588)4193160-9 gnd Niedrigtemperatur (DE-588)4417434-2 gnd Verkappen (DE-588)4389354-5 gnd Bonden (DE-588)4232594-8 gnd |
| subject_GND | (DE-588)4205811-9 (DE-588)4294605-0 (DE-588)4193160-9 (DE-588)4417434-2 (DE-588)4389354-5 (DE-588)4232594-8 (DE-588)4113937-9 |
| title | Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden |
| title_auth | Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden |
| title_exact_search | Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden |
| title_full | Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden vorgelegt von Steffen Schulze |
| title_fullStr | Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden vorgelegt von Steffen Schulze |
| title_full_unstemmed | Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden vorgelegt von Steffen Schulze |
| title_short | Verkappung von Sensorbauelementen mittels Niedertemperatur-Siliziumbonden |
| title_sort | verkappung von sensorbauelementen mittels niedertemperatur siliziumbonden |
| topic | Siliciumsensor - Mikromechanik - Wafer - Verkappen - Bonden - Niedrigtemperatur Mikromechanik (DE-588)4205811-9 gnd Wafer (DE-588)4294605-0 gnd Siliciumsensor (DE-588)4193160-9 gnd Niedrigtemperatur (DE-588)4417434-2 gnd Verkappen (DE-588)4389354-5 gnd Bonden (DE-588)4232594-8 gnd |
| topic_facet | Siliciumsensor - Mikromechanik - Wafer - Verkappen - Bonden - Niedrigtemperatur Mikromechanik Wafer Siliciumsensor Niedrigtemperatur Verkappen Bonden Hochschulschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007670733&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT schulzesteffen verkappungvonsensorbauelementenmittelsniedertemperatursiliziumbonden |