Molded interconnect devices: 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings]
Saved in:
| Format: | Conference Proceeding Book |
|---|---|
| Language: | English |
| Published: |
Bamberg
Meisenbach
1996
|
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Physical Description: | 399 S. Ill., graph. Darst. |
| ISBN: | 3875250788 |
Staff View
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| 245 | 1 | 0 | |a Molded interconnect devices |b 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |c MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... |
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| 264 | 1 | |a Bamberg |b Meisenbach |c 1996 | |
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Record in the Search Index
| _version_ | 1804125769878732800 |
|---|---|
| adam_text | TABLE
OF
CONTENTS
Tasks and Objectives of the Research Association
Three-Dimensional Electronic Assemblies
(3-D
MID)
e.V. .....................1
PART
1:
INTRODUCTION STRATEGIES
Chairman: Prof. Dn-lng. K. Feldmann
-
FAPS, Univ. of Ertangen-Nuimiberg (D)
Molded Interconnect Devices
-
Recent Developments and Future Trends
.....5
Prof. Dr.-lng. K. Feldmann
-
FAPS, Univ. of Erlangen-Nuremberg (D)
MIDIA
and the MID Industry
...............................................19
M. L.
Suhr, Mitsui-Pathtek Corporation, Rochester (USA)
MID Versus Metal Insert Technology
......................................33
F. Meeuwsen
-
Philips B.V., Eindhoven (NL)
3-D
Products Aiming at the Customers Requests:
Wire-less, Easy Fabrication and Low Cost
.................................43
T. Ichige/ R, Komagine
-
Hitachi Cable, Ltd., Hitachi-shi (J)
PART
2:
APPLICATIONS I
Chairman:
Є.
Leipe
-
Schafflbau
AG,
Munich (D)
3-D
MID in Automotive Technology
...................................___51
F. Hajny
-
BMW
AG,
Munich (D)
I. Kriebitzsch
-
BMW
AG,
Munich (D)
Development of Automotive MID Applications
.....................,......65
M. Mettler
-
Circuit Wise, Inc., North Haven (USA)
MID Application to High Speed Transmission Connector
...................73
K. Hagiwara
/
Japan Aviation Electronics Industry, Ltd., Tokyo (J)
I Yumoto, Sankyo
fesei
Co. Ltd., Tokyo (J)
Molded Interconnect Technology in a Multi-position Control Switch
.........81
D. J.-R
Leveque
-
Eaton Corp., Milwaukee (USA)
PART
3:
APPLICATIONS
il
Chairman: M. Suhr
-
MňsuhPathtek
Охр.,
Rochester (USA)
ROS-ILCP: An Approach to Consumer-Oriented Chip Packaging
...........87
Dr.-lng. G. Kletneidam
-
Siemens
AG,
Munich (D)
MID Antenna and New Plastic Shield She» for Handheld Cellular Phones
.......99
F. Baba
et al.
-
Mitsubishi Electric
Co.,
Hyogo (J)
Use
of Two-Shot-MIDs for Controlling
Devices (Abstract)
..................107
V.
Zippmann -
Buss GmbH
&
Co. KG,
Münzenberg (D)
Application Profiles of Two-Shot Molded MIDs
...........................109
M. Spiegel
-
Mitsui Pathtek Corp., Rochester (USA)
PART
4:
DEVELOPMENT AND DESIGN
Chairman: Dr. M.
Römer- Hoechst
AG,
Frankfurt
(D)
MID Company Cooperations
-
Experience with
.............................119
Joint Case Study Seminars (Abstract)
G.
Förster -
FUBA Printed Circuits GmbH, Gittetde (D)
D.
Glimmerveen
-
МІР
GmbH, Aachen (D)
U.
Hartmann -
Bolta
GmbH,
Leinburg
(D)
Design Catalogue for
3-D
MID
...........................................121
M.
Giersbeck /
Prof. Dr.-Ing. W.
Michaeli -
IKV Aachen (D)
Dr.-lng. T.
Brinkmann -
M
-Тес
GmbH, Herzogenrath (D)
3-D
MECAD and Computer Aided Planning Tools
.........................131
Dr.-lng. T.
Krebs -
Integral Solutions GmbH, Nuremberg (D)
The Application of Insert Moulding in the Preparation of
Working Prototypes
.................................................... 143
Prof. P.
J. C
Gough, Univ. of Liverpool
(GB)
PART
5:
MATERIALS
Chairman: Prof. Dc-lng. Dr. h.c. G.
Ehrenstein -
LKT, Univ. of Eriangen-Nuremberg (D)
innovative Solutions for MIDs with
Polyamide
Specialities
................157
U.
Hochuli /
E. R Aepli
-
EMS-Chemie, Domat
/
Ems (CH)
Highly Conductive Polymer Composites for
3D
Wiring Circuit
.............165
by injection Molding
H. Noguchi
/
T. Nakagawa
-
Univ. of Tokyo (J)
Properties of Blends with Poly(arylene ether ketones) and their
...........175
Applicability as Materials for Molded Interconnect Devices
Dr.-lng. F.
Zahradník
- LSR
Univ. of Eriangen-Nuremberg (D)
Material Alternatives for Film in Mold MIDs
.............................183
M. L. Smith
-
UFE
Inc., Stillwater (USA)
Development of SnBi-based Solder Alloys with Low Melting Point
.........195
M. Dffles
/
C.
E.
Reittnger
/
H.
W.
Bergmann, WTM, Urw.
of
Ertangen-Nuremberg (D)
Part
6.
PRODUCTION AND METALLIZATION
Chairman: G.
Bürkner -
Shipley GmbH,
Esslingen (D)
Ageing Studies on Three Dimensional Metallized
PPS
(Abstract)
...........207
R
Moran
-
AIT Ltd., Manchester
(GB)
T. Charlesworth
-
L.G.G. Chariesworth Ltd., Worcestershire
(GB)
G.
Small
-
Philips Petrolium Ltd.
(GB)
Influence of Processing and Flow Conditions in Multi-Component
.........209
Injection Molding on the Strength of Compatible Material Combinations
K. Kuhmann
-
LKT, Univ. of Erlangen-Nuremberg (D)
Circuit Structuring of Moulded Interconnect Devices by Selective
.........221
Application of an Electroless Plating Catalyst Technology
R
A-Hunter
-
Shipley Europe Ltd., Coventry
(GB)
Sputtering
-
a New Technique for Depositing Metals
......................231
onto Three Dimensional Plastic Parts
Dr. J.
Krempel-Hesse /
R. Kukla
/
R. Adam
-
Leybold Systems,
Hanau
(D)
Productivity Improvement in Polymers Processing
......................241
(Injection Moulding) for Manufacturing of MIDs
S. Junagade, Siemens Ltd., Nashik
(IND)
Realising of Applicative Requirements by
Зи-МиІШауег
..................253
Ceramic Substrates
M.Luniak
/
Dr.-Ing. R. Bauer,
IET,
TU
Dresden
(D)
Injection Molding of
LIGA
and LIGA-similar
Microstructures
...............265
Dr. R.
Ruprecht /
Dr. T. Hanemann
/
Dr. V. Plotter
/
J.
Haußeit,
Institut für Materialforschung, Forschungszentrum
Karlsruhe
(D)
Properties of Hot Stamped Molded Interconnection Devices
..............277
S.
Stampfer /
Prof. Dr.-Ing. Dr. h.c.
G.W. Ehrenstein,
LKT, Univ. of Eriangen-Nuremberg (D)
РАЙТ
7:
ASSEMBLY AND JOINING
Chairman: Prof. Dr.-lng. Dr. h.c. M.
Geiger-
UFT, Univ. of Erlangen-Nuremberg (D)
Modular System tor Assembling SMD onto Complex Shaped MIDs
........289
A. Brand
-
FAPS, Univ. of Eriangen-Nuremberg (D)
New Ught-Soldering System Integrates the Assembly and Soldering
......303
of SMD-Components
Prof. Dr.-lng. G.
Seliger /
J.
Niemeier - TU Berlin
(D)
Dr.
U. Meiseł
/
U.
Gerloff
-
Hahn-Meitner-Instìtut
Berlin
(D)
Simultaneous
Laser
Beam Soldering of SMT-Components on MIDs
,.......313
with Fibre-coupled Laser Diodes
T.
Fröhlich /
Prof. Dr-lng. Dr. h.0. M.
Geiger /
M.
Glasmacher / HJ. Pucher - LFT,
Univ.
of
Erlangen-Nuremberg (D)
Characterization of a Polymeric, Area Array, Z-Axis Interconnect Film
.....327
Adhesive for Microelectronic Assembly
M. Corey
/
K. Gilleo
/
S. J.
Corbett
-
Alpha Metals Inc., Jersey
City (GB)
D.
Baghurst
/
G. Nicholts
-
Cookson Technology Centre, Oxfordshire
(GB)
Application of Microcrystalline Solders for Laser Beam Soldering
......... 337
Prof. Dr.-lng.
L
Dorn / F.
Herbert
/
Dr.-lng.
S.
Jafari,
Joining and Coating Techniques,
TU
Berlin (D)
Ultrasonic-Adhesive
-
a New Method for Plastic-Manufacturing
........... 349
Prof. Dr.-lng. L.
Dorn /
Dr.-lng. S. Jafari
/
S. Bautsch,
Joining and Coating Techniques,
TU
Berlin (D)
Potential of Electrically Conductive
Adhesivos
for MID-Technology
........359
R.
Luchs,
FAPS, Univ.of Erlangen-Nuremberg (D)
PART
8:
RELIABILITY AND RECYCLING
Chairman: Prof. Dc-lng. K.
Feldmann -
FAPS, Univ. of Erlangen-Nuremberg (D)
Requirements and Material Properties of MIDs
...........................369
Prof.
ОЫпд. К.
Feidmann
/
T.
Krautheim
/
S.
Stampfer, 3-D
MID
e.V., Eiterigen
(D)
Characterization of the Reliability of MIDs
................................379
M. Gerhard
-
FAPS, Univ. of Eriangen-Nuremberg (D)
I. Kriebitzsch
-
BMW
AG,
Munich (D)
Recycling of Molded interconnect Devices
...............................389
Dr.-fng. J. Schiebisch
/
T. Schubert
/
Prof. Dr.-lng. Dr. h.c. G.W.
Ehrenstein,
UCT,
Univ. of Eriangen-Nuremberg (D)
|
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| genre_facet | Konferenzschrift 1996 Erlangen |
| id | DE-604.BV011266745 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:06:50Z |
| institution | BVB |
| institution_GND | (DE-588)2162740-X |
| isbn | 3875250788 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007564854 |
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| physical | 399 S. Ill., graph. Darst. |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| publisher | Meisenbach |
| record_format | marc |
| spelling | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... MID '96 Bamberg Meisenbach 1996 399 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Verdrahtung (DE-588)4187633-7 gnd rswk-swf Formpressen (DE-588)4155025-0 gnd rswk-swf Spritzgussteil (DE-588)4182581-0 gnd rswk-swf Integriertes Bauelement (DE-588)4161936-5 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1996 Erlangen gnd-content Formpressen (DE-588)4155025-0 s DE-604 Integriertes Bauelement (DE-588)4161936-5 s Spritzgussteil (DE-588)4182581-0 s Verdrahtung (DE-588)4187633-7 s Bürkner, Georg Sonstige oth MID 2 1996 Erlangen Sonstige (DE-588)2162740-X oth Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007564854&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] Verdrahtung (DE-588)4187633-7 gnd Formpressen (DE-588)4155025-0 gnd Spritzgussteil (DE-588)4182581-0 gnd Integriertes Bauelement (DE-588)4161936-5 gnd |
| subject_GND | (DE-588)4187633-7 (DE-588)4155025-0 (DE-588)4182581-0 (DE-588)4161936-5 (DE-588)1071861417 |
| title | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |
| title_alt | MID '96 |
| title_auth | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |
| title_exact_search | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |
| title_full | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... |
| title_fullStr | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... |
| title_full_unstemmed | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... |
| title_short | Molded interconnect devices |
| title_sort | molded interconnect devices 2 international congress in erlangen germany 25 26 september 1996 proceedings |
| title_sub | 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |
| topic | Verdrahtung (DE-588)4187633-7 gnd Formpressen (DE-588)4155025-0 gnd Spritzgussteil (DE-588)4182581-0 gnd Integriertes Bauelement (DE-588)4161936-5 gnd |
| topic_facet | Verdrahtung Formpressen Spritzgussteil Integriertes Bauelement Konferenzschrift 1996 Erlangen |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007564854&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT burknergeorg moldedinterconnectdevices2internationalcongressinerlangengermany2526september1996proceedings AT miderlangen moldedinterconnectdevices2internationalcongressinerlangengermany2526september1996proceedings AT burknergeorg mid96 AT miderlangen mid96 |