Molded interconnect devices: 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings]
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Bamberg
Meisenbach
1996
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | 399 S. Ill., graph. Darst. |
| ISBN: | 3875250788 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV011266745 | ||
| 003 | DE-604 | ||
| 005 | 20000420 | ||
| 007 | t | ||
| 008 | 970321s1996 ad|| |||| 10||| eng d | ||
| 020 | |a 3875250788 |9 3-87525-078-8 | ||
| 035 | |a (OCoLC)643530482 | ||
| 035 | |a (DE-599)BVBBV011266745 | ||
| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-12 |a DE-91 |a DE-22 |a DE-210 |a DE-29T |a DE-29 | ||
| 084 | |a ZM 8160 |0 (DE-625)157161: |2 rvk | ||
| 084 | |a CIT 735f |2 stub | ||
| 084 | |a ELT 299f |2 stub | ||
| 084 | |a ELT 235f |2 stub | ||
| 245 | 1 | 0 | |a Molded interconnect devices |b 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |c MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... |
| 246 | 1 | 3 | |a MID '96 |
| 264 | 1 | |a Bamberg |b Meisenbach |c 1996 | |
| 300 | |a 399 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 0 | 7 | |a Verdrahtung |0 (DE-588)4187633-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Formpressen |0 (DE-588)4155025-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Spritzgussteil |0 (DE-588)4182581-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Integriertes Bauelement |0 (DE-588)4161936-5 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |y 1996 |z Erlangen |2 gnd-content | |
| 689 | 0 | 0 | |a Formpressen |0 (DE-588)4155025-0 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Integriertes Bauelement |0 (DE-588)4161936-5 |D s |
| 689 | 1 | 1 | |a Spritzgussteil |0 (DE-588)4182581-0 |D s |
| 689 | 1 | |5 DE-604 | |
| 689 | 2 | 0 | |a Verdrahtung |0 (DE-588)4187633-7 |D s |
| 689 | 2 | 1 | |a Spritzgussteil |0 (DE-588)4182581-0 |D s |
| 689 | 2 | |5 DE-604 | |
| 700 | 1 | |a Bürkner, Georg |e Sonstige |4 oth | |
| 711 | 2 | |a MID |n 2 |d 1996 |c Erlangen |j Sonstige |0 (DE-588)2162740-X |4 oth | |
| 856 | 4 | 2 | |m Digitalisierung TU Muenchen |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007564854&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-007564854 | ||
Datensatz im Suchindex
| _version_ | 1804125769878732800 |
|---|---|
| adam_text | TABLE
OF
CONTENTS
Tasks and Objectives of the Research Association
Three-Dimensional Electronic Assemblies
(3-D
MID)
e.V. .....................1
PART
1:
INTRODUCTION STRATEGIES
Chairman: Prof. Dn-lng. K. Feldmann
-
FAPS, Univ. of Ertangen-Nuimiberg (D)
Molded Interconnect Devices
-
Recent Developments and Future Trends
.....5
Prof. Dr.-lng. K. Feldmann
-
FAPS, Univ. of Erlangen-Nuremberg (D)
MIDIA
and the MID Industry
...............................................19
M. L.
Suhr, Mitsui-Pathtek Corporation, Rochester (USA)
MID Versus Metal Insert Technology
......................................33
F. Meeuwsen
-
Philips B.V., Eindhoven (NL)
3-D
Products Aiming at the Customers Requests:
Wire-less, Easy Fabrication and Low Cost
.................................43
T. Ichige/ R, Komagine
-
Hitachi Cable, Ltd., Hitachi-shi (J)
PART
2:
APPLICATIONS I
Chairman:
Є.
Leipe
-
Schafflbau
AG,
Munich (D)
3-D
MID in Automotive Technology
...................................___51
F. Hajny
-
BMW
AG,
Munich (D)
I. Kriebitzsch
-
BMW
AG,
Munich (D)
Development of Automotive MID Applications
.....................,......65
M. Mettler
-
Circuit Wise, Inc., North Haven (USA)
MID Application to High Speed Transmission Connector
...................73
K. Hagiwara
/
Japan Aviation Electronics Industry, Ltd., Tokyo (J)
I Yumoto, Sankyo
fesei
Co. Ltd., Tokyo (J)
Molded Interconnect Technology in a Multi-position Control Switch
.........81
D. J.-R
Leveque
-
Eaton Corp., Milwaukee (USA)
PART
3:
APPLICATIONS
il
Chairman: M. Suhr
-
MňsuhPathtek
Охр.,
Rochester (USA)
ROS-ILCP: An Approach to Consumer-Oriented Chip Packaging
...........87
Dr.-lng. G. Kletneidam
-
Siemens
AG,
Munich (D)
MID Antenna and New Plastic Shield She» for Handheld Cellular Phones
.......99
F. Baba
et al.
-
Mitsubishi Electric
Co.,
Hyogo (J)
Use
of Two-Shot-MIDs for Controlling
Devices (Abstract)
..................107
V.
Zippmann -
Buss GmbH
&
Co. KG,
Münzenberg (D)
Application Profiles of Two-Shot Molded MIDs
...........................109
M. Spiegel
-
Mitsui Pathtek Corp., Rochester (USA)
PART
4:
DEVELOPMENT AND DESIGN
Chairman: Dr. M.
Römer- Hoechst
AG,
Frankfurt
(D)
MID Company Cooperations
-
Experience with
.............................119
Joint Case Study Seminars (Abstract)
G.
Förster -
FUBA Printed Circuits GmbH, Gittetde (D)
D.
Glimmerveen
-
МІР
GmbH, Aachen (D)
U.
Hartmann -
Bolta
GmbH,
Leinburg
(D)
Design Catalogue for
3-D
MID
...........................................121
M.
Giersbeck /
Prof. Dr.-Ing. W.
Michaeli -
IKV Aachen (D)
Dr.-lng. T.
Brinkmann -
M
-Тес
GmbH, Herzogenrath (D)
3-D
MECAD and Computer Aided Planning Tools
.........................131
Dr.-lng. T.
Krebs -
Integral Solutions GmbH, Nuremberg (D)
The Application of Insert Moulding in the Preparation of
Working Prototypes
.................................................... 143
Prof. P.
J. C
Gough, Univ. of Liverpool
(GB)
PART
5:
MATERIALS
Chairman: Prof. Dc-lng. Dr. h.c. G.
Ehrenstein -
LKT, Univ. of Eriangen-Nuremberg (D)
innovative Solutions for MIDs with
Polyamide
Specialities
................157
U.
Hochuli /
E. R Aepli
-
EMS-Chemie, Domat
/
Ems (CH)
Highly Conductive Polymer Composites for
3D
Wiring Circuit
.............165
by injection Molding
H. Noguchi
/
T. Nakagawa
-
Univ. of Tokyo (J)
Properties of Blends with Poly(arylene ether ketones) and their
...........175
Applicability as Materials for Molded Interconnect Devices
Dr.-lng. F.
Zahradník
- LSR
Univ. of Eriangen-Nuremberg (D)
Material Alternatives for Film in Mold MIDs
.............................183
M. L. Smith
-
UFE
Inc., Stillwater (USA)
Development of SnBi-based Solder Alloys with Low Melting Point
.........195
M. Dffles
/
C.
E.
Reittnger
/
H.
W.
Bergmann, WTM, Urw.
of
Ertangen-Nuremberg (D)
Part
6.
PRODUCTION AND METALLIZATION
Chairman: G.
Bürkner -
Shipley GmbH,
Esslingen (D)
Ageing Studies on Three Dimensional Metallized
PPS
(Abstract)
...........207
R
Moran
-
AIT Ltd., Manchester
(GB)
T. Charlesworth
-
L.G.G. Chariesworth Ltd., Worcestershire
(GB)
G.
Small
-
Philips Petrolium Ltd.
(GB)
Influence of Processing and Flow Conditions in Multi-Component
.........209
Injection Molding on the Strength of Compatible Material Combinations
K. Kuhmann
-
LKT, Univ. of Erlangen-Nuremberg (D)
Circuit Structuring of Moulded Interconnect Devices by Selective
.........221
Application of an Electroless Plating Catalyst Technology
R
A-Hunter
-
Shipley Europe Ltd., Coventry
(GB)
Sputtering
-
a New Technique for Depositing Metals
......................231
onto Three Dimensional Plastic Parts
Dr. J.
Krempel-Hesse /
R. Kukla
/
R. Adam
-
Leybold Systems,
Hanau
(D)
Productivity Improvement in Polymers Processing
......................241
(Injection Moulding) for Manufacturing of MIDs
S. Junagade, Siemens Ltd., Nashik
(IND)
Realising of Applicative Requirements by
Зи-МиІШауег
..................253
Ceramic Substrates
M.Luniak
/
Dr.-Ing. R. Bauer,
IET,
TU
Dresden
(D)
Injection Molding of
LIGA
and LIGA-similar
Microstructures
...............265
Dr. R.
Ruprecht /
Dr. T. Hanemann
/
Dr. V. Plotter
/
J.
Haußeit,
Institut für Materialforschung, Forschungszentrum
Karlsruhe
(D)
Properties of Hot Stamped Molded Interconnection Devices
..............277
S.
Stampfer /
Prof. Dr.-Ing. Dr. h.c.
G.W. Ehrenstein,
LKT, Univ. of Eriangen-Nuremberg (D)
РАЙТ
7:
ASSEMBLY AND JOINING
Chairman: Prof. Dr.-lng. Dr. h.c. M.
Geiger-
UFT, Univ. of Erlangen-Nuremberg (D)
Modular System tor Assembling SMD onto Complex Shaped MIDs
........289
A. Brand
-
FAPS, Univ. of Eriangen-Nuremberg (D)
New Ught-Soldering System Integrates the Assembly and Soldering
......303
of SMD-Components
Prof. Dr.-lng. G.
Seliger /
J.
Niemeier - TU Berlin
(D)
Dr.
U. Meiseł
/
U.
Gerloff
-
Hahn-Meitner-Instìtut
Berlin
(D)
Simultaneous
Laser
Beam Soldering of SMT-Components on MIDs
,.......313
with Fibre-coupled Laser Diodes
T.
Fröhlich /
Prof. Dr-lng. Dr. h.0. M.
Geiger /
M.
Glasmacher / HJ. Pucher - LFT,
Univ.
of
Erlangen-Nuremberg (D)
Characterization of a Polymeric, Area Array, Z-Axis Interconnect Film
.....327
Adhesive for Microelectronic Assembly
M. Corey
/
K. Gilleo
/
S. J.
Corbett
-
Alpha Metals Inc., Jersey
City (GB)
D.
Baghurst
/
G. Nicholts
-
Cookson Technology Centre, Oxfordshire
(GB)
Application of Microcrystalline Solders for Laser Beam Soldering
......... 337
Prof. Dr.-lng.
L
Dorn / F.
Herbert
/
Dr.-lng.
S.
Jafari,
Joining and Coating Techniques,
TU
Berlin (D)
Ultrasonic-Adhesive
-
a New Method for Plastic-Manufacturing
........... 349
Prof. Dr.-lng. L.
Dorn /
Dr.-lng. S. Jafari
/
S. Bautsch,
Joining and Coating Techniques,
TU
Berlin (D)
Potential of Electrically Conductive
Adhesivos
for MID-Technology
........359
R.
Luchs,
FAPS, Univ.of Erlangen-Nuremberg (D)
PART
8:
RELIABILITY AND RECYCLING
Chairman: Prof. Dc-lng. K.
Feldmann -
FAPS, Univ. of Erlangen-Nuremberg (D)
Requirements and Material Properties of MIDs
...........................369
Prof.
ОЫпд. К.
Feidmann
/
T.
Krautheim
/
S.
Stampfer, 3-D
MID
e.V., Eiterigen
(D)
Characterization of the Reliability of MIDs
................................379
M. Gerhard
-
FAPS, Univ. of Eriangen-Nuremberg (D)
I. Kriebitzsch
-
BMW
AG,
Munich (D)
Recycling of Molded interconnect Devices
...............................389
Dr.-fng. J. Schiebisch
/
T. Schubert
/
Prof. Dr.-lng. Dr. h.c. G.W.
Ehrenstein,
UCT,
Univ. of Eriangen-Nuremberg (D)
|
| any_adam_object | 1 |
| building | Verbundindex |
| bvnumber | BV011266745 |
| classification_rvk | ZM 8160 |
| classification_tum | CIT 735f ELT 299f ELT 235f |
| ctrlnum | (OCoLC)643530482 (DE-599)BVBBV011266745 |
| discipline | Werkstoffwissenschaften Chemie-Ingenieurwesen Elektrotechnik Werkstoffwissenschaften / Fertigungstechnik |
| format | Conference Proceeding Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02092nam a2200493 c 4500</leader><controlfield tag="001">BV011266745</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20000420 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">970321s1996 ad|| |||| 10||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3875250788</subfield><subfield code="9">3-87525-078-8</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)643530482</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV011266745</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-12</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-22</subfield><subfield code="a">DE-210</subfield><subfield code="a">DE-29T</subfield><subfield code="a">DE-29</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZM 8160</subfield><subfield code="0">(DE-625)157161:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">CIT 735f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 299f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 235f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Molded interconnect devices</subfield><subfield code="b">2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings]</subfield><subfield code="c">MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ...</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">MID '96</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Bamberg</subfield><subfield code="b">Meisenbach</subfield><subfield code="c">1996</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">399 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verdrahtung</subfield><subfield code="0">(DE-588)4187633-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Formpressen</subfield><subfield code="0">(DE-588)4155025-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Spritzgussteil</subfield><subfield code="0">(DE-588)4182581-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integriertes Bauelement</subfield><subfield code="0">(DE-588)4161936-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="y">1996</subfield><subfield code="z">Erlangen</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Formpressen</subfield><subfield code="0">(DE-588)4155025-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Integriertes Bauelement</subfield><subfield code="0">(DE-588)4161936-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Spritzgussteil</subfield><subfield code="0">(DE-588)4182581-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="2" ind2="0"><subfield code="a">Verdrahtung</subfield><subfield code="0">(DE-588)4187633-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2="1"><subfield code="a">Spritzgussteil</subfield><subfield code="0">(DE-588)4182581-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Bürkner, Georg</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="711" ind1="2" ind2=" "><subfield code="a">MID</subfield><subfield code="n">2</subfield><subfield code="d">1996</subfield><subfield code="c">Erlangen</subfield><subfield code="j">Sonstige</subfield><subfield code="0">(DE-588)2162740-X</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Digitalisierung TU Muenchen</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007564854&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-007564854</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift 1996 Erlangen gnd-content |
| genre_facet | Konferenzschrift 1996 Erlangen |
| id | DE-604.BV011266745 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:06:50Z |
| institution | BVB |
| institution_GND | (DE-588)2162740-X |
| isbn | 3875250788 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007564854 |
| oclc_num | 643530482 |
| open_access_boolean | |
| owner | DE-12 DE-91 DE-BY-TUM DE-22 DE-BY-UBG DE-210 DE-29T DE-29 |
| owner_facet | DE-12 DE-91 DE-BY-TUM DE-22 DE-BY-UBG DE-210 DE-29T DE-29 |
| physical | 399 S. Ill., graph. Darst. |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| publisher | Meisenbach |
| record_format | marc |
| spelling | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... MID '96 Bamberg Meisenbach 1996 399 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Verdrahtung (DE-588)4187633-7 gnd rswk-swf Formpressen (DE-588)4155025-0 gnd rswk-swf Spritzgussteil (DE-588)4182581-0 gnd rswk-swf Integriertes Bauelement (DE-588)4161936-5 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1996 Erlangen gnd-content Formpressen (DE-588)4155025-0 s DE-604 Integriertes Bauelement (DE-588)4161936-5 s Spritzgussteil (DE-588)4182581-0 s Verdrahtung (DE-588)4187633-7 s Bürkner, Georg Sonstige oth MID 2 1996 Erlangen Sonstige (DE-588)2162740-X oth Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007564854&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] Verdrahtung (DE-588)4187633-7 gnd Formpressen (DE-588)4155025-0 gnd Spritzgussteil (DE-588)4182581-0 gnd Integriertes Bauelement (DE-588)4161936-5 gnd |
| subject_GND | (DE-588)4187633-7 (DE-588)4155025-0 (DE-588)4182581-0 (DE-588)4161936-5 (DE-588)1071861417 |
| title | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |
| title_alt | MID '96 |
| title_auth | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |
| title_exact_search | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |
| title_full | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... |
| title_fullStr | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... |
| title_full_unstemmed | Molded interconnect devices 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] MID '96. Organized by Research Association Three-Dimensional Electronic Assemblies ... Publ. by Georg Bürkner ... |
| title_short | Molded interconnect devices |
| title_sort | molded interconnect devices 2 international congress in erlangen germany 25 26 september 1996 proceedings |
| title_sub | 2. international congress in Erlangen, Germany, 25. - 26. September 1996 ; [proceedings] |
| topic | Verdrahtung (DE-588)4187633-7 gnd Formpressen (DE-588)4155025-0 gnd Spritzgussteil (DE-588)4182581-0 gnd Integriertes Bauelement (DE-588)4161936-5 gnd |
| topic_facet | Verdrahtung Formpressen Spritzgussteil Integriertes Bauelement Konferenzschrift 1996 Erlangen |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007564854&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT burknergeorg moldedinterconnectdevices2internationalcongressinerlangengermany2526september1996proceedings AT miderlangen moldedinterconnectdevices2internationalcongressinerlangengermany2526september1996proceedings AT burknergeorg mid96 AT miderlangen mid96 |