Flip chip technologies:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | Undetermined |
| Veröffentlicht: |
New York [u.a.]
McGraw-Hill
1996
|
| Schlagworte: | |
| Beschreibung: | XXIV, 565 S. Ill., graph. Darst. |
| ISBN: | 0070366098 |
Internformat
MARC
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| 003 | DE-604 | ||
| 005 | 19971222 | ||
| 007 | t | ||
| 008 | 960828s1996 ad|| |||| 00||| und d | ||
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| 035 | |a (OCoLC)832413257 | ||
| 035 | |a (DE-599)BVBBV010919714 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | |a und | ||
| 049 | |a DE-29T |a DE-Aug4 | ||
| 084 | |a ZN 4200 |0 (DE-625)157375: |2 rvk | ||
| 100 | 1 | |a Lau, John H. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Flip chip technologies |c John H. Lau [ed.] |
| 264 | 1 | |a New York [u.a.] |b McGraw-Hill |c 1996 | |
| 300 | |a XXIV, 565 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 0 | 7 | |a Fertigungstechnik |0 (DE-588)4329079-6 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
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| 689 | 0 | 1 | |a Fertigungstechnik |0 (DE-588)4329079-6 |D s |
| 689 | 0 | |5 DE-604 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-007303616 | ||
Datensatz im Suchindex
| _version_ | 1804125410416394240 |
|---|---|
| any_adam_object | |
| author | Lau, John H. |
| author_facet | Lau, John H. |
| author_role | aut |
| author_sort | Lau, John H. |
| author_variant | j h l jh jhl |
| building | Verbundindex |
| bvnumber | BV010919714 |
| classification_rvk | ZN 4200 |
| ctrlnum | (OCoLC)832413257 (DE-599)BVBBV010919714 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV010919714 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:01:07Z |
| institution | BVB |
| isbn | 0070366098 |
| language | Undetermined |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007303616 |
| oclc_num | 832413257 |
| open_access_boolean | |
| owner | DE-29T DE-Aug4 |
| owner_facet | DE-29T DE-Aug4 |
| physical | XXIV, 565 S. Ill., graph. Darst. |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| publisher | McGraw-Hill |
| record_format | marc |
| spelling | Lau, John H. Verfasser aut Flip chip technologies John H. Lau [ed.] New York [u.a.] McGraw-Hill 1996 XXIV, 565 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Fertigungstechnik (DE-588)4329079-6 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Fertigungstechnik (DE-588)4329079-6 s DE-604 |
| spellingShingle | Lau, John H. Flip chip technologies Fertigungstechnik (DE-588)4329079-6 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4329079-6 (DE-588)4014360-0 |
| title | Flip chip technologies |
| title_auth | Flip chip technologies |
| title_exact_search | Flip chip technologies |
| title_full | Flip chip technologies John H. Lau [ed.] |
| title_fullStr | Flip chip technologies John H. Lau [ed.] |
| title_full_unstemmed | Flip chip technologies John H. Lau [ed.] |
| title_short | Flip chip technologies |
| title_sort | flip chip technologies |
| topic | Fertigungstechnik (DE-588)4329079-6 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Fertigungstechnik Elektronisches Bauelement |
| work_keys_str_mv | AT laujohnh flipchiptechnologies |