Multichip module design, fabrication, and testing:
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Bibliographic Details
Main Author: Licari, James J. (Author)
Format: Book
Language:English
Published: New York [u.a.] McGraw-Hill 1995
Series:Electronic packaging and interconnection series
Subjects:
Physical Description:XV, 381 S. Ill., graph. Darst.
ISBN:0070377154

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