Introduction to multichip modules:
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
Wiley
1995
|
| Schlagworte: | |
| Beschreibung: | XXII, 322 S. graph. Darst. |
| ISBN: | 0471114383 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV010650017 | ||
| 003 | DE-604 | ||
| 005 | 19960607 | ||
| 007 | t | ||
| 008 | 960307s1995 d||| |||| 00||| engod | ||
| 020 | |a 0471114383 |9 0-471-11438-3 | ||
| 035 | |a (OCoLC)299812758 | ||
| 035 | |a (DE-599)BVBBV010650017 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-91G | ||
| 050 | 0 | |a TK7870.15 | |
| 082 | 0 | |a 621.381046 | |
| 084 | |a DAT 135f |2 stub | ||
| 100 | 1 | |a Sherwani, Naveed |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Introduction to multichip modules |c Naveed Sherwani ; Qiong Yu ; Sandeep Badida |
| 264 | 1 | |a New York [u.a.] |b Wiley |c 1995 | |
| 300 | |a XXII, 322 S. |b graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Electronic equipment - Packaging | |
| 650 | 4 | |a Multichip modules (Microelectronics) | |
| 700 | 1 | |a Yu, Qiong |e Verfasser |4 aut | |
| 700 | 1 | |a Badida, Sandeep |e Verfasser |4 aut | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-007107413 | ||
Datensatz im Suchindex
| _version_ | 1804125127323942912 |
|---|---|
| any_adam_object | |
| author | Sherwani, Naveed Yu, Qiong Badida, Sandeep |
| author_facet | Sherwani, Naveed Yu, Qiong Badida, Sandeep |
| author_role | aut aut aut |
| author_sort | Sherwani, Naveed |
| author_variant | n s ns q y qy s b sb |
| building | Verbundindex |
| bvnumber | BV010650017 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
| callnumber-raw | TK7870.15 |
| callnumber-search | TK7870.15 |
| callnumber-sort | TK 47870.15 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_tum | DAT 135f |
| ctrlnum | (OCoLC)299812758 (DE-599)BVBBV010650017 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Informatik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV010650017 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:56:37Z |
| institution | BVB |
| isbn | 0471114383 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007107413 |
| oclc_num | 299812758 |
| open_access_boolean | |
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| owner_facet | DE-91G DE-BY-TUM |
| physical | XXII, 322 S. graph. Darst. |
| publishDate | 1995 |
| publishDateSearch | 1995 |
| publishDateSort | 1995 |
| publisher | Wiley |
| record_format | marc |
| spelling | Sherwani, Naveed Verfasser aut Introduction to multichip modules Naveed Sherwani ; Qiong Yu ; Sandeep Badida New York [u.a.] Wiley 1995 XXII, 322 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic equipment - Packaging Multichip modules (Microelectronics) Yu, Qiong Verfasser aut Badida, Sandeep Verfasser aut |
| spellingShingle | Sherwani, Naveed Yu, Qiong Badida, Sandeep Introduction to multichip modules Electronic equipment - Packaging Multichip modules (Microelectronics) |
| title | Introduction to multichip modules |
| title_auth | Introduction to multichip modules |
| title_exact_search | Introduction to multichip modules |
| title_full | Introduction to multichip modules Naveed Sherwani ; Qiong Yu ; Sandeep Badida |
| title_fullStr | Introduction to multichip modules Naveed Sherwani ; Qiong Yu ; Sandeep Badida |
| title_full_unstemmed | Introduction to multichip modules Naveed Sherwani ; Qiong Yu ; Sandeep Badida |
| title_short | Introduction to multichip modules |
| title_sort | introduction to multichip modules |
| topic | Electronic equipment - Packaging Multichip modules (Microelectronics) |
| topic_facet | Electronic equipment - Packaging Multichip modules (Microelectronics) |
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