Plastic encapsulated microelectronics: materials, processes, quality, reliability, and applications
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
Wiley
1995
|
| Schriftenreihe: | A Wiley-Interscience publication
|
| Schlagworte: | |
| Beschreibung: | WST: Plastic-encapsulated microelectronics |
| Beschreibung: | XXXIV, 474 S. Ill., graph. Darst. |
| ISBN: | 0471306258 |
Internformat
MARC
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| 246 | 1 | 3 | |a Plastic-encapsulated microelectronics |
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| 300 | |a XXXIV, 474 S. |b Ill., graph. Darst. | ||
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| 490 | 0 | |a A Wiley-Interscience publication | |
| 500 | |a WST: Plastic-encapsulated microelectronics | ||
| 650 | 4 | |a Microelectronic packaging |x Materials | |
| 650 | 4 | |a Microencapsulation | |
| 650 | 4 | |a Plastics in packaging | |
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Datensatz im Suchindex
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| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV010644680 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:56:31Z |
| institution | BVB |
| isbn | 0471306258 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007102822 |
| oclc_num | 31738522 |
| open_access_boolean | |
| owner | DE-29T DE-91 DE-BY-TUM DE-1050 |
| owner_facet | DE-29T DE-91 DE-BY-TUM DE-1050 |
| physical | XXXIV, 474 S. Ill., graph. Darst. |
| publishDate | 1995 |
| publishDateSearch | 1995 |
| publishDateSort | 1995 |
| publisher | Wiley |
| record_format | marc |
| series2 | A Wiley-Interscience publication |
| spelling | Plastic encapsulated microelectronics materials, processes, quality, reliability, and applications ed. by Michael G. Pecht ... Plastic-encapsulated microelectronics New York [u.a.] Wiley 1995 XXXIV, 474 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier A Wiley-Interscience publication WST: Plastic-encapsulated microelectronics Microelectronic packaging Materials Microencapsulation Plastics in packaging Kunststoff (DE-588)4033676-1 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Mikroverkapselung (DE-588)4169865-4 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 s Mikroverkapselung (DE-588)4169865-4 s Kunststoff (DE-588)4033676-1 s DE-604 Pecht, Michael G. Sonstige oth |
| spellingShingle | Plastic encapsulated microelectronics materials, processes, quality, reliability, and applications Microelectronic packaging Materials Microencapsulation Plastics in packaging Kunststoff (DE-588)4033676-1 gnd Mikroelektronik (DE-588)4039207-7 gnd Mikroverkapselung (DE-588)4169865-4 gnd |
| subject_GND | (DE-588)4033676-1 (DE-588)4039207-7 (DE-588)4169865-4 |
| title | Plastic encapsulated microelectronics materials, processes, quality, reliability, and applications |
| title_alt | Plastic-encapsulated microelectronics |
| title_auth | Plastic encapsulated microelectronics materials, processes, quality, reliability, and applications |
| title_exact_search | Plastic encapsulated microelectronics materials, processes, quality, reliability, and applications |
| title_full | Plastic encapsulated microelectronics materials, processes, quality, reliability, and applications ed. by Michael G. Pecht ... |
| title_fullStr | Plastic encapsulated microelectronics materials, processes, quality, reliability, and applications ed. by Michael G. Pecht ... |
| title_full_unstemmed | Plastic encapsulated microelectronics materials, processes, quality, reliability, and applications ed. by Michael G. Pecht ... |
| title_short | Plastic encapsulated microelectronics |
| title_sort | plastic encapsulated microelectronics materials processes quality reliability and applications |
| title_sub | materials, processes, quality, reliability, and applications |
| topic | Microelectronic packaging Materials Microencapsulation Plastics in packaging Kunststoff (DE-588)4033676-1 gnd Mikroelektronik (DE-588)4039207-7 gnd Mikroverkapselung (DE-588)4169865-4 gnd |
| topic_facet | Microelectronic packaging Materials Microencapsulation Plastics in packaging Kunststoff Mikroelektronik Mikroverkapselung |
| work_keys_str_mv | AT pechtmichaelg plasticencapsulatedmicroelectronicsmaterialsprocessesqualityreliabilityandapplications AT pechtmichaelg plasticencapsulatedmicroelectronics |