EuPac '96: lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Tagungsbericht Buch |
| Sprache: | English |
| Veröffentlicht: |
Düsseldorf
Dt. Verl. für Schweißtechnik, DVS-Verl.
1996
|
| Ausgabe: | Print. in form of ms. |
| Schriftenreihe: | DVS-Berichte
173 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | 176 S. zahlr. Ill. u. graph. Darst. |
| ISBN: | 3871554782 |
Internformat
MARC
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| 245 | 1 | 0 | |a EuPac '96 |b lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 |c organizer: German Welding Society, Düsseldorf |
| 250 | |a Print. in form of ms. | ||
| 264 | 1 | |a Düsseldorf |b Dt. Verl. für Schweißtechnik, DVS-Verl. |c 1996 | |
| 300 | |a 176 S. |b zahlr. Ill. u. graph. Darst. | ||
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| 999 | |a oai:aleph.bib-bvb.de:BVB01-007021469 | ||
Datensatz im Suchindex
| _version_ | 1804125002015965184 |
|---|---|
| adam_text | Table of contents
Foreword
Opening lecture
Modular systems in MST for medical applications
....................................................1
W.
Menz,
W.
Bacher,
W.
К.
Schomburg
Design
&
modeling
Software tools for electromagnetic compatibility on board level
............................4
A. Franchois, R.
De
Smedt, K. Allaert
Design and characterization of RF-circuits in multilayer
MCM
substrates
.............
б
H.
Rekonen, A. Perttula, A. Tervonen, P. Barnwell, G. Shorthouse
The use of integrated resistors and buried capacitance in high
............................11
performance telecom printed circuit boards
J. Peeters, E. Roose,
L
Vandam, A. Ackaert, K.
Allaert,
L.
Van
den Torren, L.
Martens
A simplified approach for the environmental assessment of
.................................15
populated printed circuit boards
N. F. Nissen,
A. Middendorf
Joining
An overview of polymeric electronics packaging using conductive
.....................19
adhesives
J.Liu
Development of an adhesive TAB joining technology
............................................24
J. Vanfleteren, A. Van Calster, K. Sabbe,
M. De Caluwé, A. Dravet,
P.
Kertész,
S. Sécher, K.
Deckelmann, J. Wiese,
E. Cortes,
M.
Lopez,
G.
Schols,
К.
Allaert,
P.
Vetter,
M.
Forrest
Conductive adhesive joints with non-conductive adhesives for small-
................27
pitch SMT-applications
A. Bauer, H. Oeverdiek, T.
Gesang,
H.
Schäfer
Electrically conductive adhesive joints with nonfilled adhesives
.........................30
H.
Schäfer,
G.
Wiegmann,
O.-D. Hennernann
Flip-chip
&
area array
Flip-chip integration in standard SMT assembling processes
...............................33
H.
Richter,
M.
Florjancic,
W.
Heck,
T. Schleeh, A.
Löhnen
Flip-chip bonding
investigations on
the self-alignment of tin-lead
.......................37
bumps under vacuum conditions
J.
F. Kuhmann,
H.-J. Hensel, H.-G. Bach
Si circuit chip joining technology using
Ar
atom bombardment
...........................41
A. Kohno, Y. Sasaki, M. Horino, M,
Usami,
M.
Tokuda,
К.
Sahara
Flip-chip technology for chip-on-glass applications (LCD)
....................................47
D.
Wojciechowski,
A. Van Calster,
M. Vrana, J.
De Baets,
M. De Caluwé, P. Bosch
Flip-chip bonding with solder-filled anisotropic adhesive
.....................................51
P. Savolainen, J. Kivilahti
Materials and interfaces
Organic versus non-organic substrates for
R. F.
applications
..............................54
C. Drevôn
The impact of thermoplastic substrates on soldering of
........................................58
electronic products
K. Feidrnann, M. Gerhard
Sn-Ag-Ga, a possible lead-free solder alloy
.............................................................65
K. Fritz, S.
Wege,
Kh. G.
Schmitt-Thomas
Stability of grain structure and grain boundary distribution
..................................69
in 1-D and 2-D metallic systems
V. G. Sursaeva, T.
V. Tatzij,
L. S. Shvindlerman, R.
G. Faulkner
MS-packaging
&
optical integration
Techniques for optoelectronic interconnections
....................................................73
M. Leppihalme, S. Honkanen
Self-aligned packaging of multi-channel
photodiode
array module
......................75
using AuSn solder bump flip-chip bonding
M. Itoh, I. Yoneda, J. Sasaki, H. Honmou, K. Fukushima, T. Nagahori
High precision
LIGA
structures for optical fibre-in-board technology
..................77
A. Picard,
W.
Ehrfeld,
J.
Reinhardt,
D.
Morlion,
J. Vandewege, P. J.
Vetter
Wafer through-hole interconnections for high vertical wiring densities
..............81
C. Christensen, S.
Bouwstra,
J.
W.
Petersen, P.
Kersten
MCMs
Issues and opportunities in thin film
MCM
...............................................................83
E. Beyne
High power
3D
MCM-V modules
................................................................................88
A. Coello-Vera, L.
Albo,
P. Pipard, M. Masgrangeas
MCM
introduction scenarios for B-ISDN
...................................................................91
W.
Temmerman,
R.
De
Bondt, A. Ackaert,
K. Allaert, M.
Forrest
MCM-L packaging: Technology for die and SMD components
..............................95
under the same overcoating
P. Clot, J.-F. Zeberli
Reliability
Reliability analysis techniques for electronic equipment and systems
................99
A. Birolini
Fracture electronics
-
fracture problems in electronic packaging
......................106
B. Michel, A. Schubert, J. Villain
Deformation measurements at components, printed wiring boards
...................108
and microelectronic assemblies to ensure the reliability of a system
T. Ahrens, M.
Krumm
Damage and micro-crack evolution in SMT solder joints
.....................................112
K. Heiduschke, L. Weber, A. Birolini
Reliability of displaced solder joints
.......................................................................116
K. Halser
Wire bonding
Wire bonding for future requirements
....................................................................119
K.-D. Lang
Frequency characteristics of ultrasonic wire bonding
.........................................125
-
high frequency ultrasonic wire bonding
J. Tsujino
Investigations on the damage mechanism of aluminium wire bonds
.................128
used for high-power applications
M.-H. Poech, K. J. Dittmer,
D. Gäbisch
Optimization of the ball-wedge bonding process for use of thick
.......................132
wires on non-precious metal basis
H. Fritzsche, E. Meusel, U. Draugelates, T.-U.
Trapp
Analytical methods to characterise the interconnection quality
.........................135
of gold ball bonds
A. Carrass, V. P. Jaecklin
Poster
contributions
Radiated emission of
PCB
tracks
............................................................................140
P.
De
Langhe, F. Olyslager, A. Franchois, D.
De Zutter, K.
Allaert
The structures of laser-beam soldered
microjoints
with RS solders
..................143
L.
Dorn, F.
Herbert,
F.
Hofmann,
S.
Jafari,
H. Sodeik
High frequency characterization of laser-CVD deposited aluminum lines
.........146
D.
Metzger,
A. Loppnow, A. Owzar, H. Reichl
Temperature dependence of solder paste adhesion
.............................................149
M. Nowottnick, K. Wittke, M. Kising, H. Bell, A. Woock
Study of adhesion of molding compounds on differently treated
.......................151
copper surfaces
A.
Scandurra,
R. Zaíarana,
A. Grasso,
Β.
Pelligra,
G. F. Indelli
Evaluation
of wettability
and behaviour of the solder-flux-system
.....................156
Kh.
G.
Schmitt-Thomas,
J.
Schurig,
H.
Höninger
II
Right-first-time
MCM
design
.................................................................................159
O. Zorba
Fully automatic calculation of die-attach voids
.....................................................162
U. E.
Frank
Groundruies for reliability improvement of IGBT power module packaging
......163
P. Jacob, M. Held, P.
Scacco
investigations on low-stress COB-packaging
........................................................166
W. Schneider
Reliability prediction of wire bonding
.....................................................................168
V. Tiederle
Interconnection by laser induced metal deposition from liquid solutions
.........171
A. Gillner, M. Wehner
|
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| ctrlnum | (OCoLC)633591420 (DE-599)BVBBV010533043 |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | Print. in form of ms. |
| format | Conference Proceeding Book |
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| genre_facet | Konferenzschrift 1996 Essen |
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| indexdate | 2024-07-09T17:54:37Z |
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| institution_GND | (DE-588)2152510-9 (DE-588)2152511-0 |
| isbn | 3871554782 |
| language | English |
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| physical | 176 S. zahlr. Ill. u. graph. Darst. |
| publishDate | 1996 |
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| spelling | EuPac 2 1996 Essen Verfasser (DE-588)2152510-9 aut EuPac '96 lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 organizer: German Welding Society, Düsseldorf Print. in form of ms. Düsseldorf Dt. Verl. für Schweißtechnik, DVS-Verl. 1996 176 S. zahlr. Ill. u. graph. Darst. txt rdacontent n rdamedia nc rdacarrier DVS-Berichte 173 Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1996 Essen gnd-content Elektronisches Bauelement (DE-588)4014360-0 s Verbindungstechnik (DE-588)4129183-9 s DE-604 International Conference on Interconnection Technology in Electronics 8 1996 Essen Sonstige (DE-588)2152511-0 oth DVS-Berichte 173 (DE-604)BV000003557 173 Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007021469&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | EuPac '96 lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 DVS-Berichte Verbindungstechnik (DE-588)4129183-9 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4129183-9 (DE-588)4014360-0 (DE-588)1071861417 |
| title | EuPac '96 lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 |
| title_auth | EuPac '96 lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 |
| title_exact_search | EuPac '96 lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 |
| title_full | EuPac '96 lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 organizer: German Welding Society, Düsseldorf |
| title_fullStr | EuPac '96 lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 organizer: German Welding Society, Düsseldorf |
| title_full_unstemmed | EuPac '96 lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 organizer: German Welding Society, Düsseldorf |
| title_short | EuPac '96 |
| title_sort | eupac 96 lectures and poster show contributions of the 2nd european conference on electronic packaging technology 8th international conference on interconnection technology in electronics essen d january 31 february 2 1996 |
| title_sub | lectures and poster show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics ; Essen/D, January 31 - February 2, 1996 |
| topic | Verbindungstechnik (DE-588)4129183-9 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Verbindungstechnik Elektronisches Bauelement Konferenzschrift 1996 Essen |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007021469&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV000003557 |
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