Surface mount technologies, technologies, circuits & tools, hybrid & advanced packaging technologies: Tagungsband
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Bibliographic Details
Format: Conference Proceeding Book
Language:German
Published: Berlin [u.a.] VDE-Verl. 1995
Subjects:
Item Description:Literaturangaben
Physical Description:805 S. Ill., graph. Darst.
ISBN:3800721112

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection!