Soldering processes and equipment:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York, NY u.a.
Wiley
1993
|
| Schriftenreihe: | A Wiley interscience publication
|
| Schlagworte: | |
| Beschreibung: | XIV, 296 S. Ill., graph. Darst. |
| ISBN: | 047159167X |
Internformat
MARC
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| 245 | 1 | 0 | |a Soldering processes and equipment |c ed. by Michael G. Pecht |
| 264 | 1 | |a New York, NY u.a. |b Wiley |c 1993 | |
| 300 | |a XIV, 296 S. |b Ill., graph. Darst. | ||
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| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a A Wiley interscience publication | |
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| 650 | 4 | |a Solder and soldering | |
| 650 | 4 | |a Surface mount technology | |
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| 700 | 1 | |a Pecht, Michael G. |e Sonstige |4 oth | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-006295668 | ||
Datensatz im Suchindex
| _version_ | 1804123871445516288 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV009533852 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
| callnumber-raw | TK7870.15 |
| callnumber-search | TK7870.15 |
| callnumber-sort | TK 47870.15 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_tum | FER 660f |
| ctrlnum | (OCoLC)26767806 (DE-599)BVBBV009533852 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Fertigungstechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV009533852 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:36:39Z |
| institution | BVB |
| isbn | 047159167X |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-006295668 |
| oclc_num | 26767806 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | XIV, 296 S. Ill., graph. Darst. |
| publishDate | 1993 |
| publishDateSearch | 1993 |
| publishDateSort | 1993 |
| publisher | Wiley |
| record_format | marc |
| series2 | A Wiley interscience publication |
| spelling | Soldering processes and equipment ed. by Michael G. Pecht New York, NY u.a. Wiley 1993 XIV, 296 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier A Wiley interscience publication Electronic packaging Materials Solder and soldering Surface mount technology Löten (DE-588)4036162-7 gnd rswk-swf Löten (DE-588)4036162-7 s DE-604 Pecht, Michael G. Sonstige oth |
| spellingShingle | Soldering processes and equipment Electronic packaging Materials Solder and soldering Surface mount technology Löten (DE-588)4036162-7 gnd |
| subject_GND | (DE-588)4036162-7 |
| title | Soldering processes and equipment |
| title_auth | Soldering processes and equipment |
| title_exact_search | Soldering processes and equipment |
| title_full | Soldering processes and equipment ed. by Michael G. Pecht |
| title_fullStr | Soldering processes and equipment ed. by Michael G. Pecht |
| title_full_unstemmed | Soldering processes and equipment ed. by Michael G. Pecht |
| title_short | Soldering processes and equipment |
| title_sort | soldering processes and equipment |
| topic | Electronic packaging Materials Solder and soldering Surface mount technology Löten (DE-588)4036162-7 gnd |
| topic_facet | Electronic packaging Materials Solder and soldering Surface mount technology Löten |
| work_keys_str_mv | AT pechtmichaelg solderingprocessesandequipment |