Dry etching for VLSI:
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Buch |
Sprache: | English |
Veröffentlicht: |
New York u.a.
Plenum Press
1991
|
Schriftenreihe: | Updates in applied physics and electrical technology
|
Schlagworte: | |
Beschreibung: | XVII, 237 S. graph. Darst. |
ISBN: | 0306438356 |
Internformat
MARC
LEADER | 00000nam a2200000 c 4500 | ||
---|---|---|---|
001 | BV009012356 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | t | ||
008 | 940206s1991 d||| |||| 00||| eng d | ||
020 | |a 0306438356 |9 0-306-43835-6 | ||
035 | |a (OCoLC)23142645 | ||
035 | |a (DE-599)BVBBV009012356 | ||
040 | |a DE-604 |b ger |e rakddb | ||
041 | 0 | |a eng | |
049 | |a DE-29T |a DE-703 |a DE-11 | ||
050 | 0 | |a TK7871.85 | |
082 | 0 | |a 621.381/52 |2 20 | |
084 | |a ZM 7660 |0 (DE-625)157138: |2 rvk | ||
084 | |a ZN 4950 |0 (DE-625)157424: |2 rvk | ||
100 | 1 | |a Roosmalen, Alfred J. van |e Verfasser |4 aut | |
245 | 1 | 0 | |a Dry etching for VLSI |c A. J. van Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader |
264 | 1 | |a New York u.a. |b Plenum Press |c 1991 | |
300 | |a XVII, 237 S. |b graph. Darst. | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
490 | 0 | |a Updates in applied physics and electrical technology | |
650 | 4 | |a Integrated circuits |x Very large scale integration |x Design and construction | |
650 | 4 | |a Plasma etching | |
650 | 4 | |a Semiconductors |x Etching | |
650 | 0 | 7 | |a VLSI |0 (DE-588)4117388-0 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Trockenätzen |0 (DE-588)4222074-9 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Ätzen |0 (DE-588)4000648-7 |2 gnd |9 rswk-swf |
689 | 0 | 0 | |a VLSI |0 (DE-588)4117388-0 |D s |
689 | 0 | 1 | |a Trockenätzen |0 (DE-588)4222074-9 |D s |
689 | 0 | |5 DE-604 | |
689 | 1 | 0 | |a Ätzen |0 (DE-588)4000648-7 |D s |
689 | 1 | |8 1\p |5 DE-604 | |
700 | 1 | |a Baggerman, J. A. |e Verfasser |4 aut | |
700 | 1 | |a Brader, S. J. |e Verfasser |4 aut | |
999 | |a oai:aleph.bib-bvb.de:BVB01-005958563 | ||
883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk |
Datensatz im Suchindex
_version_ | 1804123361229406208 |
---|---|
any_adam_object | |
author | Roosmalen, Alfred J. van Baggerman, J. A. Brader, S. J. |
author_facet | Roosmalen, Alfred J. van Baggerman, J. A. Brader, S. J. |
author_role | aut aut aut |
author_sort | Roosmalen, Alfred J. van |
author_variant | a j v r ajv ajvr j a b ja jab s j b sj sjb |
building | Verbundindex |
bvnumber | BV009012356 |
callnumber-first | T - Technology |
callnumber-label | TK7871 |
callnumber-raw | TK7871.85 |
callnumber-search | TK7871.85 |
callnumber-sort | TK 47871.85 |
callnumber-subject | TK - Electrical and Nuclear Engineering |
classification_rvk | ZM 7660 ZN 4950 |
ctrlnum | (OCoLC)23142645 (DE-599)BVBBV009012356 |
dewey-full | 621.381/52 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381/52 |
dewey-search | 621.381/52 |
dewey-sort | 3621.381 252 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
format | Book |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01692nam a2200481 c 4500</leader><controlfield tag="001">BV009012356</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">940206s1991 d||| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0306438356</subfield><subfield code="9">0-306-43835-6</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)23142645</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV009012356</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-29T</subfield><subfield code="a">DE-703</subfield><subfield code="a">DE-11</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7871.85</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/52</subfield><subfield code="2">20</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZM 7660</subfield><subfield code="0">(DE-625)157138:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4950</subfield><subfield code="0">(DE-625)157424:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Roosmalen, Alfred J. van</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Dry etching for VLSI</subfield><subfield code="c">A. J. van Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New York u.a.</subfield><subfield code="b">Plenum Press</subfield><subfield code="c">1991</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XVII, 237 S.</subfield><subfield code="b">graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Updates in applied physics and electrical technology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Very large scale integration</subfield><subfield code="x">Design and construction</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Plasma etching</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors</subfield><subfield code="x">Etching</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Trockenätzen</subfield><subfield code="0">(DE-588)4222074-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Ätzen</subfield><subfield code="0">(DE-588)4000648-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Trockenätzen</subfield><subfield code="0">(DE-588)4222074-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Ätzen</subfield><subfield code="0">(DE-588)4000648-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Baggerman, J. A.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Brader, S. J.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-005958563</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield></record></collection> |
id | DE-604.BV009012356 |
illustrated | Illustrated |
indexdate | 2024-07-09T17:28:33Z |
institution | BVB |
isbn | 0306438356 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-005958563 |
oclc_num | 23142645 |
open_access_boolean | |
owner | DE-29T DE-703 DE-11 |
owner_facet | DE-29T DE-703 DE-11 |
physical | XVII, 237 S. graph. Darst. |
publishDate | 1991 |
publishDateSearch | 1991 |
publishDateSort | 1991 |
publisher | Plenum Press |
record_format | marc |
series2 | Updates in applied physics and electrical technology |
spelling | Roosmalen, Alfred J. van Verfasser aut Dry etching for VLSI A. J. van Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader New York u.a. Plenum Press 1991 XVII, 237 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Updates in applied physics and electrical technology Integrated circuits Very large scale integration Design and construction Plasma etching Semiconductors Etching VLSI (DE-588)4117388-0 gnd rswk-swf Trockenätzen (DE-588)4222074-9 gnd rswk-swf Ätzen (DE-588)4000648-7 gnd rswk-swf VLSI (DE-588)4117388-0 s Trockenätzen (DE-588)4222074-9 s DE-604 Ätzen (DE-588)4000648-7 s 1\p DE-604 Baggerman, J. A. Verfasser aut Brader, S. J. Verfasser aut 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Roosmalen, Alfred J. van Baggerman, J. A. Brader, S. J. Dry etching for VLSI Integrated circuits Very large scale integration Design and construction Plasma etching Semiconductors Etching VLSI (DE-588)4117388-0 gnd Trockenätzen (DE-588)4222074-9 gnd Ätzen (DE-588)4000648-7 gnd |
subject_GND | (DE-588)4117388-0 (DE-588)4222074-9 (DE-588)4000648-7 |
title | Dry etching for VLSI |
title_auth | Dry etching for VLSI |
title_exact_search | Dry etching for VLSI |
title_full | Dry etching for VLSI A. J. van Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader |
title_fullStr | Dry etching for VLSI A. J. van Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader |
title_full_unstemmed | Dry etching for VLSI A. J. van Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader |
title_short | Dry etching for VLSI |
title_sort | dry etching for vlsi |
topic | Integrated circuits Very large scale integration Design and construction Plasma etching Semiconductors Etching VLSI (DE-588)4117388-0 gnd Trockenätzen (DE-588)4222074-9 gnd Ätzen (DE-588)4000648-7 gnd |
topic_facet | Integrated circuits Very large scale integration Design and construction Plasma etching Semiconductors Etching VLSI Trockenätzen Ätzen |
work_keys_str_mv | AT roosmalenalfredjvan dryetchingforvlsi AT baggermanja dryetchingforvlsi AT bradersj dryetchingforvlsi |