Multichip modules: systems advantages, major constructions, and materials technologies
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York
IEEE Press
1991
|
| Schriftenreihe: | IEEE Press selected reprint series
|
| Schlagworte: | |
| Beschreibung: | IX, 602 S. Ill., graph. Darst. |
| ISBN: | 087942267X |
Internformat
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| 264 | 1 | |a New York |b IEEE Press |c 1991 | |
| 300 | |a IX, 602 S. |b Ill., graph. Darst. | ||
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Datensatz im Suchindex
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| dewey-search | 621.381/046 |
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| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV008979305 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:27:52Z |
| institution | BVB |
| isbn | 087942267X |
| language | English |
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| physical | IX, 602 S. Ill., graph. Darst. |
| publishDate | 1991 |
| publishDateSearch | 1991 |
| publishDateSort | 1991 |
| publisher | IEEE Press |
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| series2 | IEEE Press selected reprint series |
| spelling | Multichip modules systems advantages, major constructions, and materials technologies ed. by R. Wayne Johnson New York IEEE Press 1991 IX, 602 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier IEEE Press selected reprint series Electronic packaging Microelectronic packaging Multichip modules (Microelectronics) Mikroelektronik (DE-588)4039207-7 gnd rswk-swf (DE-588)4143413-4 Aufsatzsammlung gnd-content Mikroelektronik (DE-588)4039207-7 s DE-604 Johnson, R. Wayne Sonstige oth |
| spellingShingle | Multichip modules systems advantages, major constructions, and materials technologies Electronic packaging Microelectronic packaging Multichip modules (Microelectronics) Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4143413-4 |
| title | Multichip modules systems advantages, major constructions, and materials technologies |
| title_auth | Multichip modules systems advantages, major constructions, and materials technologies |
| title_exact_search | Multichip modules systems advantages, major constructions, and materials technologies |
| title_full | Multichip modules systems advantages, major constructions, and materials technologies ed. by R. Wayne Johnson |
| title_fullStr | Multichip modules systems advantages, major constructions, and materials technologies ed. by R. Wayne Johnson |
| title_full_unstemmed | Multichip modules systems advantages, major constructions, and materials technologies ed. by R. Wayne Johnson |
| title_short | Multichip modules |
| title_sort | multichip modules systems advantages major constructions and materials technologies |
| title_sub | systems advantages, major constructions, and materials technologies |
| topic | Electronic packaging Microelectronic packaging Multichip modules (Microelectronics) Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electronic packaging Microelectronic packaging Multichip modules (Microelectronics) Mikroelektronik Aufsatzsammlung |
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