Reliability and yield problems of wire bonding in microelectronics: the application of materials and interface science
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Reston, VA
Internat. Soc. for Hybrid Microelectronics
1989
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| Subjects: | |
| Physical Description: | XIII, 202 S. Ill., graph. Darst. |
| ISBN: | 0930815254 |
Staff View
MARC
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| 650 | 4 | |a Electronic packaging |x Defects | |
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| 650 | 4 | |a Semiconductors |x Failures | |
| 650 | 4 | |a Wire bonding (Electronic packaging) |x Production control | |
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Record in the Search Index
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| dewey-sort | 3621.381 15 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV008949778 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:27:18Z |
| institution | BVB |
| isbn | 0930815254 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-005905415 |
| oclc_num | 21148879 |
| open_access_boolean | |
| owner | DE-29T |
| owner_facet | DE-29T |
| physical | XIII, 202 S. Ill., graph. Darst. |
| publishDate | 1989 |
| publishDateSearch | 1989 |
| publishDateSort | 1989 |
| publisher | Internat. Soc. for Hybrid Microelectronics |
| record_format | marc |
| spelling | Harman, George G. Verfasser aut Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science Reston, VA Internat. Soc. for Hybrid Microelectronics 1989 XIII, 202 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic packaging Defects Electronic packaging Reliability Semiconductors Failures Wire bonding (Electronic packaging) Production control Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Drahtbonden (DE-588)4232596-1 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Drahtbonden (DE-588)4232596-1 s Zuverlässigkeit (DE-588)4059245-5 s Mikroelektronik (DE-588)4039207-7 s DE-604 |
| spellingShingle | Harman, George G. Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science Electronic packaging Defects Electronic packaging Reliability Semiconductors Failures Wire bonding (Electronic packaging) Production control Zuverlässigkeit (DE-588)4059245-5 gnd Drahtbonden (DE-588)4232596-1 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4059245-5 (DE-588)4232596-1 (DE-588)4039207-7 |
| title | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_auth | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_exact_search | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_full | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_fullStr | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_full_unstemmed | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_short | Reliability and yield problems of wire bonding in microelectronics |
| title_sort | reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_sub | the application of materials and interface science |
| topic | Electronic packaging Defects Electronic packaging Reliability Semiconductors Failures Wire bonding (Electronic packaging) Production control Zuverlässigkeit (DE-588)4059245-5 gnd Drahtbonden (DE-588)4232596-1 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electronic packaging Defects Electronic packaging Reliability Semiconductors Failures Wire bonding (Electronic packaging) Production control Zuverlässigkeit Drahtbonden Mikroelektronik |
| work_keys_str_mv | AT harmangeorgeg reliabilityandyieldproblemsofwirebondinginmicroelectronicstheapplicationofmaterialsandinterfacescience |