Reliability and yield problems of wire bonding in microelectronics: the application of materials and interface science
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Reston, VA
Internat. Soc. for Hybrid Microelectronics
1989
|
| Schlagworte: | |
| Beschreibung: | XIII, 202 S. Ill., graph. Darst. |
| ISBN: | 0930815254 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV008949778 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | t | ||
| 008 | 940206s1989 ad|| |||| 00||| eng d | ||
| 020 | |a 0930815254 |9 0-930815-25-4 | ||
| 035 | |a (OCoLC)21148879 | ||
| 035 | |a (DE-599)BVBBV008949778 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-29T | ||
| 050 | 0 | |a TK7874 | |
| 082 | 0 | |a 621.381/5 |2 20 | |
| 100 | 1 | |a Harman, George G. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Reliability and yield problems of wire bonding in microelectronics |b the application of materials and interface science |
| 264 | 1 | |a Reston, VA |b Internat. Soc. for Hybrid Microelectronics |c 1989 | |
| 300 | |a XIII, 202 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Electronic packaging |x Defects | |
| 650 | 4 | |a Electronic packaging |x Reliability | |
| 650 | 4 | |a Semiconductors |x Failures | |
| 650 | 4 | |a Wire bonding (Electronic packaging) |x Production control | |
| 650 | 0 | 7 | |a Zuverlässigkeit |0 (DE-588)4059245-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Drahtbonden |0 (DE-588)4232596-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Drahtbonden |0 (DE-588)4232596-1 |D s |
| 689 | 0 | 1 | |a Zuverlässigkeit |0 (DE-588)4059245-5 |D s |
| 689 | 0 | 2 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | |5 DE-604 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-005905415 | ||
Datensatz im Suchindex
| _version_ | 1804123282963693568 |
|---|---|
| any_adam_object | |
| author | Harman, George G. |
| author_facet | Harman, George G. |
| author_role | aut |
| author_sort | Harman, George G. |
| author_variant | g g h gg ggh |
| building | Verbundindex |
| bvnumber | BV008949778 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| ctrlnum | (OCoLC)21148879 (DE-599)BVBBV008949778 |
| dewey-full | 621.381/5 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/5 |
| dewey-search | 621.381/5 |
| dewey-sort | 3621.381 15 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01452nam a2200409 c 4500</leader><controlfield tag="001">BV008949778</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">940206s1989 ad|| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0930815254</subfield><subfield code="9">0-930815-25-4</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)21148879</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV008949778</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-29T</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7874</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/5</subfield><subfield code="2">20</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Harman, George G.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Reliability and yield problems of wire bonding in microelectronics</subfield><subfield code="b">the application of materials and interface science</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Reston, VA</subfield><subfield code="b">Internat. Soc. for Hybrid Microelectronics</subfield><subfield code="c">1989</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XIII, 202 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield><subfield code="x">Defects</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield><subfield code="x">Reliability</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors</subfield><subfield code="x">Failures</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Wire bonding (Electronic packaging)</subfield><subfield code="x">Production control</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Zuverlässigkeit</subfield><subfield code="0">(DE-588)4059245-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Drahtbonden</subfield><subfield code="0">(DE-588)4232596-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Drahtbonden</subfield><subfield code="0">(DE-588)4232596-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Zuverlässigkeit</subfield><subfield code="0">(DE-588)4059245-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-005905415</subfield></datafield></record></collection> |
| id | DE-604.BV008949778 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:27:18Z |
| institution | BVB |
| isbn | 0930815254 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-005905415 |
| oclc_num | 21148879 |
| open_access_boolean | |
| owner | DE-29T |
| owner_facet | DE-29T |
| physical | XIII, 202 S. Ill., graph. Darst. |
| publishDate | 1989 |
| publishDateSearch | 1989 |
| publishDateSort | 1989 |
| publisher | Internat. Soc. for Hybrid Microelectronics |
| record_format | marc |
| spelling | Harman, George G. Verfasser aut Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science Reston, VA Internat. Soc. for Hybrid Microelectronics 1989 XIII, 202 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic packaging Defects Electronic packaging Reliability Semiconductors Failures Wire bonding (Electronic packaging) Production control Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Drahtbonden (DE-588)4232596-1 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Drahtbonden (DE-588)4232596-1 s Zuverlässigkeit (DE-588)4059245-5 s Mikroelektronik (DE-588)4039207-7 s DE-604 |
| spellingShingle | Harman, George G. Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science Electronic packaging Defects Electronic packaging Reliability Semiconductors Failures Wire bonding (Electronic packaging) Production control Zuverlässigkeit (DE-588)4059245-5 gnd Drahtbonden (DE-588)4232596-1 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4059245-5 (DE-588)4232596-1 (DE-588)4039207-7 |
| title | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_auth | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_exact_search | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_full | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_fullStr | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_full_unstemmed | Reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_short | Reliability and yield problems of wire bonding in microelectronics |
| title_sort | reliability and yield problems of wire bonding in microelectronics the application of materials and interface science |
| title_sub | the application of materials and interface science |
| topic | Electronic packaging Defects Electronic packaging Reliability Semiconductors Failures Wire bonding (Electronic packaging) Production control Zuverlässigkeit (DE-588)4059245-5 gnd Drahtbonden (DE-588)4232596-1 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electronic packaging Defects Electronic packaging Reliability Semiconductors Failures Wire bonding (Electronic packaging) Production control Zuverlässigkeit Drahtbonden Mikroelektronik |
| work_keys_str_mv | AT harmangeorgeg reliabilityandyieldproblemsofwirebondinginmicroelectronicstheapplicationofmaterialsandinterfacescience |