Harman, G. G. (1989). Reliability and yield problems of wire bonding in microelectronics: The application of materials and interface science. Internat. Soc. for Hybrid Microelectronics.
Chicago Style (17th ed.) CitationHarman, George G. Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science. Reston, VA: Internat. Soc. for Hybrid Microelectronics, 1989.
MLA (9th ed.) CitationHarman, George G. Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science. Internat. Soc. for Hybrid Microelectronics, 1989.
Warning: These citations may not always be 100% accurate.