Harman, G. G. (1989). Reliability and yield problems of wire bonding in microelectronics: The application of materials and interface science. Internat. Soc. for Hybrid Microelectronics.
Chicago-Zitierstil (17. Ausg.)Harman, George G. Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science. Reston, VA: Internat. Soc. for Hybrid Microelectronics, 1989.
MLA-Zitierstil (9. Ausg.)Harman, George G. Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science. Internat. Soc. for Hybrid Microelectronics, 1989.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.