Multilayer ceramic substrate technology for VLSI package multichip module:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English Japanese |
| Veröffentlicht: |
London u.a.
Elsevier Applied Science
1993
|
| Schriftenreihe: | Ceramic research and development in Japan
|
| Schlagworte: | |
| Beschreibung: | XIII, 242 S. Ill., graph. Darst. |
| ISBN: | 185166579X |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV008328780 | ||
| 003 | DE-604 | ||
| 005 | 19941220 | ||
| 007 | t | ||
| 008 | 931111s1993 ad|| |||| 00||| engod | ||
| 020 | |a 185166579X |9 1-85166-579-X | ||
| 035 | |a (OCoLC)468598724 | ||
| 035 | |a (DE-599)BVBBV008328780 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 1 | |a eng |h jpn | |
| 049 | |a DE-91 |a DE-703 | ||
| 082 | 1 | |a 621.395 |2 22 | |
| 084 | |a UQ 8500 |0 (DE-625)146599: |2 rvk | ||
| 084 | |a ELT 299f |2 stub | ||
| 100 | 1 | |a Ōtsuka, Kanji |e Verfasser |4 aut | |
| 240 | 1 | 0 | |a Seramikku tasō haisen kiban |
| 245 | 1 | 0 | |a Multilayer ceramic substrate technology for VLSI package multichip module |c K. Otsuka |
| 264 | 1 | |a London u.a. |b Elsevier Applied Science |c 1993 | |
| 300 | |a XIII, 242 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Ceramic research and development in Japan | |
| 650 | 7 | |a Alumine |2 ram | |
| 650 | 7 | |a Appareils électroniques - Emballage - Matériaux |2 ram | |
| 650 | 7 | |a Circuits intégrés à très grande échelle - Conception et construction |2 ram | |
| 650 | 7 | |a Céramiques électroniques |2 ram | |
| 650 | 0 | 7 | |a VLSI |0 (DE-588)4117388-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mehrschichtsystem |0 (DE-588)4244347-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Multichiptechnik |0 (DE-588)4267925-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektrokeramik |0 (DE-588)4151820-2 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektrokeramik |0 (DE-588)4151820-2 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Mehrschichtsystem |0 (DE-588)4244347-7 |D s |
| 689 | 1 | 1 | |a Multichiptechnik |0 (DE-588)4267925-4 |D s |
| 689 | 1 | 2 | |a VLSI |0 (DE-588)4117388-0 |D s |
| 689 | 1 | |5 DE-604 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-005501685 | ||
Datensatz im Suchindex
| _version_ | 1804122722021670912 |
|---|---|
| any_adam_object | |
| author | Ōtsuka, Kanji |
| author_facet | Ōtsuka, Kanji |
| author_role | aut |
| author_sort | Ōtsuka, Kanji |
| author_variant | k ō kō |
| building | Verbundindex |
| bvnumber | BV008328780 |
| classification_rvk | UQ 8500 |
| classification_tum | ELT 299f |
| ctrlnum | (OCoLC)468598724 (DE-599)BVBBV008328780 |
| dewey-full | 621.395 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.395 |
| dewey-search | 621.395 |
| dewey-sort | 3621.395 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV008328780 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:18:23Z |
| institution | BVB |
| isbn | 185166579X |
| language | English Japanese |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-005501685 |
| oclc_num | 468598724 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-703 |
| owner_facet | DE-91 DE-BY-TUM DE-703 |
| physical | XIII, 242 S. Ill., graph. Darst. |
| publishDate | 1993 |
| publishDateSearch | 1993 |
| publishDateSort | 1993 |
| publisher | Elsevier Applied Science |
| record_format | marc |
| series2 | Ceramic research and development in Japan |
| spelling | Ōtsuka, Kanji Verfasser aut Seramikku tasō haisen kiban Multilayer ceramic substrate technology for VLSI package multichip module K. Otsuka London u.a. Elsevier Applied Science 1993 XIII, 242 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Ceramic research and development in Japan Alumine ram Appareils électroniques - Emballage - Matériaux ram Circuits intégrés à très grande échelle - Conception et construction ram Céramiques électroniques ram VLSI (DE-588)4117388-0 gnd rswk-swf Mehrschichtsystem (DE-588)4244347-7 gnd rswk-swf Multichiptechnik (DE-588)4267925-4 gnd rswk-swf Elektrokeramik (DE-588)4151820-2 gnd rswk-swf Elektrokeramik (DE-588)4151820-2 s DE-604 Mehrschichtsystem (DE-588)4244347-7 s Multichiptechnik (DE-588)4267925-4 s VLSI (DE-588)4117388-0 s |
| spellingShingle | Ōtsuka, Kanji Multilayer ceramic substrate technology for VLSI package multichip module Alumine ram Appareils électroniques - Emballage - Matériaux ram Circuits intégrés à très grande échelle - Conception et construction ram Céramiques électroniques ram VLSI (DE-588)4117388-0 gnd Mehrschichtsystem (DE-588)4244347-7 gnd Multichiptechnik (DE-588)4267925-4 gnd Elektrokeramik (DE-588)4151820-2 gnd |
| subject_GND | (DE-588)4117388-0 (DE-588)4244347-7 (DE-588)4267925-4 (DE-588)4151820-2 |
| title | Multilayer ceramic substrate technology for VLSI package multichip module |
| title_alt | Seramikku tasō haisen kiban |
| title_auth | Multilayer ceramic substrate technology for VLSI package multichip module |
| title_exact_search | Multilayer ceramic substrate technology for VLSI package multichip module |
| title_full | Multilayer ceramic substrate technology for VLSI package multichip module K. Otsuka |
| title_fullStr | Multilayer ceramic substrate technology for VLSI package multichip module K. Otsuka |
| title_full_unstemmed | Multilayer ceramic substrate technology for VLSI package multichip module K. Otsuka |
| title_short | Multilayer ceramic substrate technology for VLSI package multichip module |
| title_sort | multilayer ceramic substrate technology for vlsi package multichip module |
| topic | Alumine ram Appareils électroniques - Emballage - Matériaux ram Circuits intégrés à très grande échelle - Conception et construction ram Céramiques électroniques ram VLSI (DE-588)4117388-0 gnd Mehrschichtsystem (DE-588)4244347-7 gnd Multichiptechnik (DE-588)4267925-4 gnd Elektrokeramik (DE-588)4151820-2 gnd |
| topic_facet | Alumine Appareils électroniques - Emballage - Matériaux Circuits intégrés à très grande échelle - Conception et construction Céramiques électroniques VLSI Mehrschichtsystem Multichiptechnik Elektrokeramik |
| work_keys_str_mv | AT otsukakanji seramikkutasohaisenkiban AT otsukakanji multilayerceramicsubstratetechnologyforvlsipackagemultichipmodule |