Proceedings: June 12 - 14, 1991 Melbourne, Florida
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Tagungsbericht Buch |
| Sprache: | Undetermined |
| Veröffentlicht: |
New York, NY
IEEE
1991
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Literaturangaben |
| Beschreibung: | 262 S. Ill., graph. Darst. |
| ISBN: | 0780301099 0780301102 0780301110 |
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| 111 | 2 | |a University Government Industry Microelectronics Symposium |n 9 |d 1991 |c Melbourne, Fla. |j Verfasser |0 (DE-588)5065406-8 |4 aut | |
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Datensatz im Suchindex
| _version_ | 1804120103070990336 |
|---|---|
| adam_text | NINTH BIENNIAL UNIVERSITY/GOVERNMENT/INDUSTRY MICROELECTRONICS SYMPOSIUM
SESSION
1:
KEYNOTE SESSION
Thomas Sanders, General Chairman
James Freedman, Technical Program Chairman
Theme: United States Microelectronics Competitiveness for the 1990 s
Guest Speakers:
Dr. Ian Ross, President, AT&T Bell Laboratories
Chairman, National Advisory Committee on Semiconductors
Mr. Larry Sumney, President, Semiconductor Research Corporation
Dr. John A. White, Assistant Director for Engineering, National Science Foundation
Dr. Turner Hasty, Chief Operating Officer, SEMATECH
Dr. David Hodges, Dean, School of Engineering, University of California, Berkeley, California
SESSION
2:
UNIVERSITY/GOVERNMENT/INDUSTRY PROGRAMS
Co-Chairmen: John Blasingame, Tom Wade
linking university research to microelectronics manufacturing: Harris Semiconductor s approach to technology transfer
—
T. L. Haycock
.................................................................................. 1
Cooperative research and technology transfer
—
R.
Lucie
....................................................... 7
Bringing high technology to low technology industry
—Jř.
Perusich
and G. Michael
................................ 13
Clearinghouse for undergraduate microelectronics education: What have we learned?
—
B. L. MacDonald, D. J.
Cunningham, andR. B. Gold
....................................................................... 19
EUROSYSTEMS—
An industry/university advanced system design education project
—
P.
Pöchmüller,
M. Glesner,
and
P. Windirsch
.................................................................................... 24
University/government^ndustry program in analog/digital integrated circuits
—
Y. Shamash andR.
Massengate.......... 29
Low dielectric constant interconnect technology
—
A paradigm for interdisciplinary industry-university programs
—
R. J.
Gutmann andR.
Isaac
............................................................................. 33
A joint industry-university
СІМ
project for university microelectronics manufacturing
—
L. F. Fuller, C. Karacal,
T. J.
VanDenbosch,S. Slagsvol,andM. Poponiak
.......................................................... 37
SESSION
3:
MICROELECTRONICS EDUCATION
Co-Chairmen: Dave Kerns, Lynn Fuller
Tne
Microelectronics Manufacturing Engineering Program at Rensselaer Polytechnic Institute
—
J. B. Hudson and R. J.
Gutmann ....................................................................................... 41
Fast-turn
1С
prototyping for university education and research
—
D. J. Cunningham andR. B. Gold
.................... 44
Development of poly-gate NMOS process for research and teaching
—
D. S.
Langford,
К.
J. Rambo,
R. M. Fox, T. Bach,
mdC. Paneda
................................................................................... 48
Аи
ion-implanted N-weD bipolar process for university analog integrated circuit fabrication -^A. R. LaPietra and
L. F.
Fidler........................................................................................... 54
A process design course utilizing mfcromechankal devices
—
M. Lu andM.
A. Schmidt
............................. 60
CAPE-VLSI implementation of a systolic process«· array: Architecture, design and testing
—
-N. D. Hemkumar,
K. Kota,
and]. R.
Cavallaro
............................................................................... 64
VLSI microprocessor design for
ci^womktâmictim—J.E.VamentosandA.Rys
................................ 70
A cost analysis of operating
a łarge
integrated circuit laboratory at Rochester Institute of Technology—
Ł.
F. Fuller, S. P.
Blondell, and]. Tkmey
........................................................................... 76
SESSION 4: TEST and EVALUATION
Co-Chairmen: Jeff
Comte,
Tom
Haycock
Electrical characterization of polysilicon surface roughness in double polysfficon EPROMS —R. Turkman
.............. 79
Characterization of ULSI gate oxide reliability using substrate and channel electron injection stresses—T. Nishida,
S. E.
Thompson, J. T. Kavalieros,
Y. Lu,
andM. K. Han
...................................................... 84
Current conduction in thermally grown thin SiOa films
—
Y. L.
Chiou,
C. H.
Sow,
G.
Li,
J.
P. Gambino, and P. J. Tsang
... 89
Thermal
self-limiting effects in the long-term AC stress on
η
-channel LDD MOSFETs—
M.
Lee,
S. S.
B. Or,
N.
Hwang,
L. Forbes, W. Haddad, and W. Richling
............................................................... 93
Capacitance-voltage characteristics of amorphous silicon based metal-insulator-semiconductor structure
—
J. S.
Choi
and
G. W.
Neudeck ............................................................................... 98
Electrical characterization of MOSIS-fabricated circuit elements—
C. M
.
Stillo.R. M. Fox,D. S.
Langford,
and
D.
J. Ferris
. 103
Reliability in VHSIC-level
1.25
jum radiation-hard CMOS
1С
devices —F. Evans, J. Wall, P. Brusius, and M. Mitchell
... 107
Assessing performance of standard evaluation circuits for radiation hardened 32-bit processor—^. A. Koziarz
.......... 113
SESSION
5:
MANUFACTURING METHODS
Co-Chairmen: Frank Minardi, Bill Swindel
A new approach to statistical process control in a test environment: The empirical delta control chart
—
S. Weisbrod and
C. S. McFarland
................................................................................
П6
Techniques for optimizing statistical simulations —F. M.
Rotella
and T. J. Sanders
................................ 122
A review of statistical tool set for the yield enhancement of integrated circuits—-R. J. Joyce, R. D. Alderman, T. P. Djeu,
andJ.
С
Smith
................................................................................. 128
Improving semiconductor yields by varying silicon substrate parameters
—5.
Weisbrod, D. Adelman, and W. Huber
..... 134
Database management system for the self-directed work team
—
S. D. Titus and M. K, Stebbins
...................... 138
The use of short cycle test chips to accelerate yield learning during the startup of a
150
mm fabrication facility
—
J. McDantel, D. Mowsund,
С
Siłsby.andJ. Winnett
................................................... 143
Yield analysis for a large-area analog X-ray sensor array
—
W.R.
Eisenstadt,
S. S.
Potluri,
K. J.
Rombo,
and R. M.
Fox
... 149
SESSION
6:
MODELING and DESIGN METHODOLOGIES
Co-Chairmen: Rick Gold, Ron
Rasmussen
Process and device simulation at Harris Semiconductor —R.Lowther
........................................... 153
Concurrent use of two-dimensional process and device simulators in the development of latch-up free BiCMOS process
—
M. G. Guvench, S. Irving, M. Robinson, andD.
Desbiens
.............................................. 159
A DC model for the
HEMT
including me effect of parasitic conduction —M. Saleh and M. El-N
okati
................. 164
A subthreshold model for the analysis of
MOS
IC s-^M. El-Nokali and A. Afzati-Kushaa
.......................... 169
Automated synthesis of macro/behavioral models for mixed analog/digital circuits, including complete power supply
effects—
Л.
S. Vogetsong.G.M.Morency, andM.
С
Chian
.............................................. 173
Variable tape CMOS buffer design—
5.
R. Vemuru andE. D. Smith
............................................ 179
A structured custom logic-design methodology—/.
Simone
and M. Cases
....................................... 185
A high-speed VLSI chip for data compression —N.RanganathanandS.Henriques
............................... 190
SESSION
7:
MICROELECTRONIC PROCESSES
Co-Chairmen: Bill Triggs, Jim Freedmaa
A ftìu-wafer
SOI process for
З-Штепѕкши
integration
—
C. K. Subramanian and
G. W.
Neudeck.................... 195
MOS
fabrication process integrating self-aligned
polysMkon
gate and post-processed metal gate devices on a single die
—Jr. D. Butler andR.
E. Beaty
..................................................................... 199
Chatactomtion and elimination
ď
threshold voltage proWems in the BiMOS process
—^././)єоя
.................. 204
Oxidation and tteroai
ййяШу
of thin
fita
copper layers
—
F. Shacham-Diamand, J. Li, J. O. Olowlafe, S.
Russel,
Y.
Tomou,
and J.
W.
Mayer
.............................................................. 210
Schoaky banner enhancement in Ni/Ai layer-by-layer contacts to n-GaAs—A. K.
Kulkami
and J.
Lu
................. 216
Myαystaffiшdiшlonddbv!юepккessmg-^.ö.£^/«,Ä.Äшíl€5fe«,
T. A. Rappel,
and
S. Y.Ue
.................. 222
A novel method of forming a thin single crystal silicon diaphragm with precise thickness for potential use in fabricating
micromechanical sensors using merged epitaxial lateral overgrowth
—
A, E. Kabir, J. J.
Рак,
and G. W.
Neudeck ... 226
SESSION
8:
MICROELECTRONIC PACKAGING
Co-Chairmen: Gene
Feit, Roy
Colclaser
Multi-chip modules: A comparative study. Phase I: System design and substrate selection
—
R. C. Bracken, M. M.
Salatino,
C. L.
Adtíns, and
В.
P. Kraemer
............................................................ 232
The establishment of a multi-chip module foundry at
RIT
—
R. E.
Pearson and P. R. Mukund
........................ 238
A fracture mechanics methodology for slow crack growth in thin polyimide films
—
V. H.
Kenner,
S. F.
Popelář, and
С.
H. Popelar
..................................................................................... 242
Effect of
geometry on
me söain
inetectronic packages
—
A. S. Voloshin and P. H. Tsao
............................ 246
A
wafer scale
programmable
systolic
data
processor
—
D. Landis,
J.
Yoder,
D.
Whittaker, and
T.
Dobbins
.............. 252
Electrical design considerations for high-speed computer packages
—
M. Cases
................................... 257
CONFERENCE AUTHOR INDEX
................................................................. 263
|
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| illustrated | Illustrated |
| indexdate | 2024-07-09T16:36:45Z |
| institution | BVB |
| institution_GND | (DE-588)5065406-8 |
| isbn | 0780301099 0780301102 0780301110 |
| language | Undetermined |
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| owner_facet | DE-91 DE-BY-TUM |
| physical | 262 S. Ill., graph. Darst. |
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| spelling | University Government Industry Microelectronics Symposium 9 1991 Melbourne, Fla. Verfasser (DE-588)5065406-8 aut Proceedings June 12 - 14, 1991 Melbourne, Florida ninth Biennial University Government Industry Microelectronics Symposium New York, NY IEEE 1991 262 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Literaturangaben Mikroelektronik (DE-588)4039207-7 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1991 Melbourne Fla. gnd-content Mikroelektronik (DE-588)4039207-7 s DE-604 Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=003702340&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Proceedings June 12 - 14, 1991 Melbourne, Florida Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)1071861417 |
| title | Proceedings June 12 - 14, 1991 Melbourne, Florida |
| title_auth | Proceedings June 12 - 14, 1991 Melbourne, Florida |
| title_exact_search | Proceedings June 12 - 14, 1991 Melbourne, Florida |
| title_full | Proceedings June 12 - 14, 1991 Melbourne, Florida ninth Biennial University Government Industry Microelectronics Symposium |
| title_fullStr | Proceedings June 12 - 14, 1991 Melbourne, Florida ninth Biennial University Government Industry Microelectronics Symposium |
| title_full_unstemmed | Proceedings June 12 - 14, 1991 Melbourne, Florida ninth Biennial University Government Industry Microelectronics Symposium |
| title_short | Proceedings |
| title_sort | proceedings june 12 14 1991 melbourne florida |
| title_sub | June 12 - 14, 1991 Melbourne, Florida |
| topic | Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Mikroelektronik Konferenzschrift 1991 Melbourne Fla. |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=003702340&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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