Multichip modules: systems, advantages, major constructions, and materials technologies
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Piscataway, NJ
IEEE Press
1991
|
| Series: | IEEE Press selected reprint series
|
| Subjects: | |
| Item Description: | Literaturangaben |
| Physical Description: | IX, 603 S. zahlr. Ill., graph. Darst. |
| ISBN: | 087942267X |
Staff View
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV005463705 | ||
| 003 | DE-604 | ||
| 005 | 20050314 | ||
| 007 | t | ||
| 008 | 920812s1991 ad|| |||| 00||| engod | ||
| 020 | |a 087942267X |9 0-87942-267-X | ||
| 035 | |a (OCoLC)22624226 | ||
| 035 | |a (DE-599)BVBBV005463705 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-91 | ||
| 050 | 0 | |a TK7870.15 | |
| 082 | 0 | |a 621.381/046 |2 20 | |
| 084 | |a ELT 299f |2 stub | ||
| 245 | 1 | 0 | |a Multichip modules |b systems, advantages, major constructions, and materials technologies |c ed. by R. Wayne Johnson ... |
| 264 | 1 | |a Piscataway, NJ |b IEEE Press |c 1991 | |
| 300 | |a IX, 603 S. |b zahlr. Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a IEEE Press selected reprint series | |
| 500 | |a Literaturangaben | ||
| 650 | 4 | |a Electronic packaging | |
| 650 | 4 | |a Microelectronic packaging | |
| 650 | 4 | |a Multichip modules (Microelectronics) | |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)4143413-4 |a Aufsatzsammlung |2 gnd-content | |
| 689 | 0 | 0 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Johnson, R. Wayne |e Sonstige |4 oth | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-003419973 | ||
Record in the Search Index
| _version_ | 1804119677062873088 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV005463705 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
| callnumber-raw | TK7870.15 |
| callnumber-search | TK7870.15 |
| callnumber-sort | TK 47870.15 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_tum | ELT 299f |
| ctrlnum | (OCoLC)22624226 (DE-599)BVBBV005463705 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01298nam a2200397 c 4500</leader><controlfield tag="001">BV005463705</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20050314 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">920812s1991 ad|| |||| 00||| engod</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">087942267X</subfield><subfield code="9">0-87942-267-X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)22624226</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV005463705</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7870.15</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield><subfield code="2">20</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 299f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Multichip modules</subfield><subfield code="b">systems, advantages, major constructions, and materials technologies</subfield><subfield code="c">ed. by R. Wayne Johnson ...</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Piscataway, NJ</subfield><subfield code="b">IEEE Press</subfield><subfield code="c">1991</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">IX, 603 S.</subfield><subfield code="b">zahlr. Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">IEEE Press selected reprint series</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Literaturangaben</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronic packaging</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Multichip modules (Microelectronics)</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4143413-4</subfield><subfield code="a">Aufsatzsammlung</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Johnson, R. Wayne</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-003419973</subfield></datafield></record></collection> |
| genre | (DE-588)4143413-4 Aufsatzsammlung gnd-content |
| genre_facet | Aufsatzsammlung |
| id | DE-604.BV005463705 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T16:29:59Z |
| institution | BVB |
| isbn | 087942267X |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-003419973 |
| oclc_num | 22624226 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | IX, 603 S. zahlr. Ill., graph. Darst. |
| publishDate | 1991 |
| publishDateSearch | 1991 |
| publishDateSort | 1991 |
| publisher | IEEE Press |
| record_format | marc |
| series2 | IEEE Press selected reprint series |
| spelling | Multichip modules systems, advantages, major constructions, and materials technologies ed. by R. Wayne Johnson ... Piscataway, NJ IEEE Press 1991 IX, 603 S. zahlr. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier IEEE Press selected reprint series Literaturangaben Electronic packaging Microelectronic packaging Multichip modules (Microelectronics) Mikroelektronik (DE-588)4039207-7 gnd rswk-swf (DE-588)4143413-4 Aufsatzsammlung gnd-content Mikroelektronik (DE-588)4039207-7 s DE-604 Johnson, R. Wayne Sonstige oth |
| spellingShingle | Multichip modules systems, advantages, major constructions, and materials technologies Electronic packaging Microelectronic packaging Multichip modules (Microelectronics) Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4143413-4 |
| title | Multichip modules systems, advantages, major constructions, and materials technologies |
| title_auth | Multichip modules systems, advantages, major constructions, and materials technologies |
| title_exact_search | Multichip modules systems, advantages, major constructions, and materials technologies |
| title_full | Multichip modules systems, advantages, major constructions, and materials technologies ed. by R. Wayne Johnson ... |
| title_fullStr | Multichip modules systems, advantages, major constructions, and materials technologies ed. by R. Wayne Johnson ... |
| title_full_unstemmed | Multichip modules systems, advantages, major constructions, and materials technologies ed. by R. Wayne Johnson ... |
| title_short | Multichip modules |
| title_sort | multichip modules systems advantages major constructions and materials technologies |
| title_sub | systems, advantages, major constructions, and materials technologies |
| topic | Electronic packaging Microelectronic packaging Multichip modules (Microelectronics) Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electronic packaging Microelectronic packaging Multichip modules (Microelectronics) Mikroelektronik Aufsatzsammlung |
| work_keys_str_mv | AT johnsonrwayne multichipmodulessystemsadvantagesmajorconstructionsandmaterialstechnologies |