Dry processing for submicrometer lithography: 12 - 13 October 1989, Santa Clara, California
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Bellingham, Wash.
SPIE
1990
|
| Schriftenreihe: | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE
1185 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Literaturangaben |
| Beschreibung: | VII, 307 S. Ill., graph. Darst. |
| ISBN: | 0819402214 |
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Datensatz im Suchindex
| _version_ | 1804118837177614336 |
|---|---|
| adam_text | DRY PROCESSING FOR SUBMICROMETER LITHOGRAPHY
Volume
1185
CONTENTS
Conference Committee
.................................................................vi
Introduction
.........................................................................
vii
SESSION
1
MULTILAYER RESIST ETCH TECHNOLOGY
1185-01
Silylated acid hardened resist technology positive, dry developable deep-UV
resists (Invited Paper)
J. W. Thackeray, J. F. Bohland, E. K. Pavelchek, G. W. Orsula, A. W. McCullough,
Shipley Co., Inc.; S. K. Jones, S. M. Bobbio, Microelectronics Ctr. of North Carolina
..............2
1185-02
Application of the kinetic theory of bombardment-induced interface evolution to
the pattern
transfer
step in multilayer lithography
С
W.
Jurgensen,
E.
S. Shaqfeh,
AT&T
Bell Lab
........................................... 12
1185-03
Etch resistance of silicon-containing polymers in oxygen plasma chemistry
S. M. Bobbio, S. K. Jones, Microelectronics Ctr. of North Carolina; T. G. Tessier,
Bell Northern Research; B. W. Dudley, B. Cohen, R. F. Jewett, A.
Morosoff,
Microelectronics Ctr. of North Carolina
..................................................24
1185-04
Submicron
single-layer lithography using reactive ion etching
G. R. Misium,
C. M.
Garza,
M. A. Douglas,
C. J.
Davis,
R. R. Doering, Texas
Instruments,
Inc
......................................................................34
1185-05
Dry process pattern transfer for x-ray mask fabrication (Invited Paper)
G. F. Doyle, Perkin-Elmer Corp
.........................................................40
1185-06
Magnetron-enhanced etching of photoresist for
submicron
patterning
A. Selino, M.
Siegel,
Matermis
Research Corp.; R. Lombaerts, UCB Electronics (Belgium)
.........51
1185-07
Entrenched metal lift-off using a novel bilayer process
T. D. DuBois, F. M. Tranjan, Univ. of North Carolina/Charlotte; S. K. Jones,
Microelectronics Ctr. of North Carolina; S. M. Bobbio, Univ. of North
Carolina/Charlotte and Microelectronics Ctr. of North Carolina; M. D. Kellam,
Microelectronics Ctr. of North Carolina; R. G. Frieser, Univ. of North
Carolina/Charlotte; A. D. Jones, Microelectronics Ctr. of North Carolina
.......................66
1185-15
Dry etching of niobium oxide
Ûnn
films
A. C.
Scabra,
P. Verdonck, W. L.
Xavier,
V. Baranauskas, State Univ. of Campinas (Brazil)
........80
SESSION
2
DEPOSITION AND ETCH TECHNOLOGY FOR SILICON DEVICE
FABRICATION
1185-29
ІП-8ІШ
porticulate contamination studies in process plasmas (Invited Paper)
G. S. Selwyn, J. S. McKillop,
K. Haller,
IBM/Thomas J. Watson Research Ctr
...................86
1185-08
Plasma-aseisted deposition and device technology: interlevel dielectric considerations
G. W. Hills, A. S. Harms, M.J. Thorns, AT&T Bell Labs..
..................................98
1185-09
High rate and selective reactive ion etching of polysilicon
L. Y. Tsou, North American Philips Corp
................................................110
1185-13
Profile control and stringer
rentoval
during plasma etch of submicrometer
polysilicon lines
B. A. Hasciden, P. Peavey, W. Elicson, Lam Research Corp.; T. Ahmed, Xerox
Microelectronics Ctr
..................................................................115
(continued)
DRY PROCESSING FOR SUBMICROMETER LITHOGRAPHY
Volume
1185
1185-10
Advanced
гОО-хнп
gate profile fabrication with reactive ion etching
H.
Hübner,
Siemens
AG
(FRG); W.
Pilz, Fraunhofer-Institut für
Mikrostrukturtechnik (FRG);
G. Belle, M. Franosch, Siemens
AG (FRG)
......................128
1185-31
CMOS DRAM alpha-partide
effects
R. R,
Zito, Richard
R.
Zito
R
&
D Corp
.................................................137
1185-12
Electron
cyclotron resonance
CVD planarization and trench-ffll
processes
(Invited
Paper)
D. R.
Denison,
Lam
Research Corp.;
С.
Chiang,
D. B.
Fraser, Intel Corp
......................142
1185-14
Characterization of sidewall passivation material deposited during
trench etch
B. Vasquez, H. G. Tompkins, P.
Fejes,
Motorola, Inc.;
T. Y. Lee, L.
J. Smith,
Applied Materials,
Inc
................................................................148
SESSION
3
PROCESS DIAGNOSTICS AND MODELING
1185-28
Spatial and size distributions of
submicron
particles in rf plasmas
K. R. Stalder, SRI International
.........................................................164
1185-17
Comparison of the optical projection lithography simulators in SAMPLE and
PROLITH
0. D. Crisalle, S. R. Keifling, D. E. Seborg, D. A. Mellichamp, Univ. of California/
Santa Barbara
..........;............................................................171
1
185-18
Statistical methodology for the evaluation, characterization, and
optimization of dry etch modules
R. O. Lynch, R. J.
Markte, SEMATECH.................................................188
1185-19
Continuum modeling of rf glow dischargee (Invited Paper)
H. H. Sawin, E. Gogolides, Massachusetts Institute of Technology
............................198
1185-20
Optimization of a highly selective nitride/oxide
RIE in a
batch etching
machine by statistical analysts
F.
N. Hause,
H. J.
Stocker, R.
О.
Lynch, SEMATECH
.....................................209
1
і
85-21
Profile evolution model with redepoeition
S. C. Jackson,
E. L
du Pont de
Nemours
&
Co., Inc.;
T. J.
Dalton,
Massachusetts
Institute of Technology
...............................................................225
1185-22
In-eitu wafer
monitoring
for plasma etching
D. S. Grimard, F. L. Terry, Jr., M. E. Elta, Univ. of Michigan/Arm Arbor.
....................234
1185-26
Radical and molecular product concentration measurements in CF4 RF plasmas
by
infrared
tunable diode beer absorption
J. C. Wormhoudt, Aerodyne Research,
Inc
...............................................248
SESSION
4
PLASMA EQUIPMENT AND RADIATION DAMAGE ISSUES
1185-23
Review of magnetron etefa technology (Invited Paper)
S. M. Bobbio, Microelectronics Ctr. of North Carolina
.....................................262
1185-24
Magneto-transport characterization of e-beam-induced damage in GaAe-AlGaAs
heteroetructures
T. Fink, New Jersey Institute of Technology; D. D. Smith, U.S. Army Electronics
Technology and Devices
Lab.;
W.
D.
Braddock, Cornell Univ
...............................278
1185-25
Damage to gate cuddes in reactive km etching
1. Wu, R. H. Bruce, G. B. Anderson, M. Koyanagi, T. Y. Huang, Xerox Palo Alto
Research Ctr
........................................................................284
DRY PROCESSING FOR SUBMICROMETER LITHOGRAPHY
Volume
1185
1185-30
Application of plasma diagnostic techniques to dry etching process control
V. G. Deshmukh, T. I. Cox, A. J. Hydes, D. A. Hope, Royal Signals and Radar
Establishment (UK)
..................................................................296
Addendum
.........................................................................306
Author Index
.......................................................................307
DRY PROCESSING FOR SUBMICROMETER LITHOGRAPHY
Volume
1185
AUTHOR INDEX
Ahmed, Tofael,
115
Anderson, Greg,
284
Ashburn, Stan P., Addendum
Baiya,
Α.,
Addendum
Baranauskas, Vitor,
80
Belle,
Gábriellé,
128
Bobbio, Stephen M, Addendum,
2, 24, 66, 262
Bohland, John
F., 2
Braddock, W. D.,
278
Bruce, Richard H.,
284
Chiang,
Chien,
142
Cohen,
Batia,
24
Cox, T. I.,
296
Crisatte, Oscar D.,
171
Dalton,
Timothy J.,
225
Davis, Cecil J.,
34
Denison, Dean R.,
142
Deshmukh, V. G.,
296
Doering, Robert R.,
34
Douglas, Monte
Α.,
34
Doyle, Gary
F., 40
DuBois, Thomas D., Addendum,
66
Dudley, Bruce W.,
24
EHcson, William,
115
Elta, Michael E.,
234
Fejes,
Peter,
148
Fink,
Tobin,
278
Franosch, M.,
128
Fraser,
David
В.,
142
Frieser,
Rudolph
G.,
Addendum,
66
Garza,
Cesar
M.,
34
Gogolides, Evangelos, 198
Greene, Richard
F.,
Addendum
Grimard, Dennis S.,
234
Halier, K.,
86
Harms, Alain S.,
98
Haselden, Barbara
Α.,
115
Hause.
Fred
Ν.,
209
Hills, Graham W., 98
Hope, D.
Α.,
296
Huang, Tiao
Y.,
284
Hübner. Holfier, 128
Hydes,
A. J.,
296
Jackson, Scott
С,
225
Jewett, Russell F., 24
Jones,
A. D.,
66
Jones, Susan K., 2, 24, 66
Jurgensen, Charles W., 12
Keifling, Steven R., 171
Kellam,
M. D.,
66
Koyanagi, Mitsu, 284
Lee,
Terranee
Y.,
148
Lombaerts, Ria, 51
Lynch, Richard 0., 188, 209
Markle, Richard J., 188
McCullough, Andrew W., 2
McKillop, John S., 86
McVittie, James, Addendum
Mellichamp,
Duncan
Α.,
171
Misium, George R„ 34
Morosoff,
Arturo,
24
Orsula, George W„ 2
Pavelchek, Edward K„ 2
Peavey, Paula, 115
Pilz,
Wolfgang,
128
Reisman,
Arnold, Addendum
Rey, J.,
Addendum
Sawin, Herbert H., 198
Seabra,
A, C,
80
Seborg,
Dale
E.,
171
Selino,
Angelo,
51
Selwyn, Gary
S.,
86
Shaqfeh, EricS., 12
Siegel. Mark, 51
Smith,
Doran
D.,
278
Smith,
Laurel J.,
148
Stalder,
Kenneth R.,
164
Stocker,
H. J.,
209
Terry, Fred
L.
,
Jr.,
234
Tessier, Theodore G.,
24
Thackeray, James W.,
2
Thoma, Morgan J.,
98
Tompkins, Harlartd G.,
148
Tranjan, Farid M., Addendum,
66
Tsou,
L. Y.,
110
Vasquez, Barbara,
148
Vertfonck, P.,
80
Wormhoudt,
Jody
С,
248
Wu,
I-Wei,
284
Xavier, W. L.,
80
Zito, Richard
R.,
137
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| genre | (DE-588)1071861417 Konferenzschrift 1989 Santa Clara Calif. gnd-content |
| genre_facet | Konferenzschrift 1989 Santa Clara Calif. |
| id | DE-604.BV004720081 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T16:16:38Z |
| institution | BVB |
| isbn | 0819402214 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-002900755 |
| oclc_num | 508158041 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-83 |
| owner_facet | DE-91 DE-BY-TUM DE-83 |
| physical | VII, 307 S. Ill., graph. Darst. |
| publishDate | 1990 |
| publishDateSearch | 1990 |
| publishDateSort | 1990 |
| publisher | SPIE |
| record_format | marc |
| series | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| series2 | Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE |
| spelling | Dry processing for submicrometer lithography 12 - 13 October 1989, Santa Clara, California James Bondur ... chairs/eds. Bellingham, Wash. SPIE 1990 VII, 307 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE 1185 Literaturangaben Microelectronics Congresses Microlithography Congresses Photolithography Congresses Semiconductors Congresses Nanometerbereich (DE-588)4327473-0 gnd rswk-swf Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd rswk-swf Trockenätzen (DE-588)4222074-9 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1989 Santa Clara Calif. gnd-content Trockenätzen (DE-588)4222074-9 s Lithografie Halbleitertechnologie (DE-588)4191584-7 s Nanometerbereich (DE-588)4327473-0 s DE-604 Bondur, James Sonstige oth Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE 1185 (DE-604)BV000010887 1185 Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=002900755&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Dry processing for submicrometer lithography 12 - 13 October 1989, Santa Clara, California Society of Photo-Optical Instrumentation Engineers: Proceedings of SPIE Microelectronics Congresses Microlithography Congresses Photolithography Congresses Semiconductors Congresses Nanometerbereich (DE-588)4327473-0 gnd Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd Trockenätzen (DE-588)4222074-9 gnd |
| subject_GND | (DE-588)4327473-0 (DE-588)4191584-7 (DE-588)4222074-9 (DE-588)1071861417 |
| title | Dry processing for submicrometer lithography 12 - 13 October 1989, Santa Clara, California |
| title_auth | Dry processing for submicrometer lithography 12 - 13 October 1989, Santa Clara, California |
| title_exact_search | Dry processing for submicrometer lithography 12 - 13 October 1989, Santa Clara, California |
| title_full | Dry processing for submicrometer lithography 12 - 13 October 1989, Santa Clara, California James Bondur ... chairs/eds. |
| title_fullStr | Dry processing for submicrometer lithography 12 - 13 October 1989, Santa Clara, California James Bondur ... chairs/eds. |
| title_full_unstemmed | Dry processing for submicrometer lithography 12 - 13 October 1989, Santa Clara, California James Bondur ... chairs/eds. |
| title_short | Dry processing for submicrometer lithography |
| title_sort | dry processing for submicrometer lithography 12 13 october 1989 santa clara california |
| title_sub | 12 - 13 October 1989, Santa Clara, California |
| topic | Microelectronics Congresses Microlithography Congresses Photolithography Congresses Semiconductors Congresses Nanometerbereich (DE-588)4327473-0 gnd Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd Trockenätzen (DE-588)4222074-9 gnd |
| topic_facet | Microelectronics Congresses Microlithography Congresses Photolithography Congresses Semiconductors Congresses Nanometerbereich Lithografie Halbleitertechnologie Trockenätzen Konferenzschrift 1989 Santa Clara Calif. |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=002900755&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV000010887 |
| work_keys_str_mv | AT bondurjames dryprocessingforsubmicrometerlithography1213october1989santaclaracalifornia |