Fundamentals of adhesion:
Gespeichert in:
Format: | Buch |
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Sprache: | English |
Veröffentlicht: |
New York [u.a.]
Plenum Press
1991
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Schlagworte: | |
Online-Zugang: | Inhaltsverzeichnis |
Beschreibung: | Hier auch spätere, unveränderte Nachdrucke |
Beschreibung: | XVII, 454 S. graph. Darst. |
ISBN: | 0306434709 9781489920751 9781489920737 |
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245 | 1 | 0 | |a Fundamentals of adhesion |c ed. by Lieng-Huang Lee |
264 | 1 | |a New York [u.a.] |b Plenum Press |c 1991 | |
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Datensatz im Suchindex
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adam_text | Contents
1. The Chemistry and Physics of Solid Adhesion
Lieng Huang Lee
1. Introduction 1
2. The Four Forces of Nature 2
2.1. Carriers of Four Forces 3
2.2. Gluons and Adhesion of Nuclei 4
2.3. Nuclear Equation of State 5
3. Chemical Bonding and Intermolecular Forces 6
3.1. Chemical Forces and Covalent Bonding 6
3.2. Coulomb Force and Ionic Bond 6
3.3. Electronegativity and Partial Ionic Bond 7
3.4. Lifshitz van der Waals Forces Between Microscopic
Bodies 8
3.5. Nonretarded Lifshitz van der Waals Forces Between
Macroscropic Bodies 11
4. Molecular Interactions 16
4.1. Morse Interaction Curve 16
4.2. Perturbation Theory 17
4.3. Kitaura Morokuma s Decomposition of Interaction
Energies 18
4.4. Natural Bond Orbital (NBO) Donor Acceptor
Approach 19
4.5. Acid Base Interaction 21
5. Role of Diffusion in Adhesion 23
5.1. Fick s Laws of Diffusion 23
5.2. Activation Energy of Diffusion 24
5.3. Diffusion and Adhesion of Polymers 24
5.4. Diffusion of Solid into Polymers 26
6. Physicochemical Bonding on Solid Surfaces 26
6.1. Density of States (DOS) 26
6.2. Electron Work Function 27
6.3. Fermi Energy 28
6.4. Frontier Orbital Concept 30
7. Interactions on Solid Surfaces 32
7.1. Interactions Between Two Discrete Molecules 32
ix
x CONTENTS
7.2. Interactions Between a Molecule and a Solid 32
7.3. Chemisorption 33
8. Hard Soft Acid Base (HSAB) Principle 33
8.1. The HSAB Principle in Solution 33
8.2. Extension of the HSAB Principle to the Solid State 34
9. Metal to Metal Contact 35
9.1. Metal Metal Adhesion 36
9.2. Metal Metal Adhesion Theory 36
9.3. Effect of Critical Separation on Metal Metal Adhesion .... 36
9.4. Effect of the Acid Base Interaction on Metal Metal
Adhesion 37
9.5. Effect of Crystal Structure on Metal Metal Adhesion 37
9.6. Effect of Contact Electrification on Metal Metal
Adhesion 38
9.7. Effect of Diffusion on Metal Metal Adhesion 38
10. Metal Semiconductor Contact 39
10.1. Ionicity of Semiconductors 40
10.2. Metal Semiconductor Adhesion 41
10.3. Effect of Chemical Reaction on Metal Semiconductor
Interface 41
10.4. Effect of Contact Electrification on Metal Semiconductor
Adhesion 42
11. Metal Salt and Metal Oxide Adhesion 45
12. Metal—Ceramic Adhesion 46
13. Metal Superconductor Adhesion 48
14. Metal Glass Adhesion 48
15. Metal Diamond Adhesion 49
16. Metal Polymer Adhesion 50
16.1. Mechanisms of Metal Polymer Adhesion 50
16.2. Classification of Polymers According to their
Wettabilities 50
16.3. Metal Adhesion to Low Wettability Polymers 51
16.4. Metal Adhesion of Medium Wettability Polymers 55
16.5. Metal Adhesion to High Wettability Polymers 56
16.6. Metal Rubber Adhesion 60
16.7. Effect of Contact Electrification on Metal Polymer
Adhesion 62
17. Polymer Solid Adhesion 63
17.1. Polymer Solid Contact 64
17.2. Polymers as Adhesives 66
18. Discussion 67
19. Summary 71
Appendix 72
A. Fundamental Physical Constants 72
B. Non SI Units Used with SI 72
Acknowledgment 72
CONTENTS xi
Nomenclature 73
References 75
2. Thermodynamics of Adhesion
W. Gutowski
1. Molecular Forces 87
1.1. General 87
1.2. Types of Intermolecular and Interatomic Forces, Their
Range and Magnitude 87
1.3. Classical (Microscopic) Theory of Interatomic and
Intermolecular Forces 89
1.4. Application of Quantum Field Theory for Estimation of
Interaction Force and Energy Between Two Solids
(Macroscopic Theory) 98
2. Acid Base (Donor Acceptor) Interactions 105
2.1. Br0nsted and Lewis Concepts of Acid Base
Interactions 105
2.2. Acidity and Basicity of Solid Surfaces 106
2.3. Quantitative Assessment of Acid Base Interactions 109
2.4. Acid Base Interactions in Adhesion 113
3. Thermodynamics of Surfaces 116
3.1. Surface Energy, Thermodynamic Work of Adhesion, and
Energy of Cohesion 116
3.2. Energy Equilibrium at the Interface 117
3.3. InterfacialEnergy 118
4. Experimental Techniques 123
4.1. Interfacial Energy at the Liquid Liquid and Liquid Gas
Interface by Techniques Independent of Contact Angle .... 124
4.2. Techniques Based on Measurement of the Equilibrium
Contact Angle 124
4.3. Techniques Based on Acid Base Interaction Concepts .... 131
Nomenclature 132
References 133
3. Theory of Adhesive Forces Across Interfaces: 1. The
Lifshitz—van der Waals Component of Interaction and
Adhesion
Robert J. Good and Manoj K. Chaudhury
1. Introduction 137
2. Theory of van der Waals Interactions Across Interfaces 137
2.1. The Pairwise Addition Approximation 137
2.2. The Lifshitz Theory: General Considerations 140
x« CONTENTS
3. Interactions Between Condensed Phases 142
4. Application to Interfacial Tension and Free Energy 145
Appendix. A Note on Electrostatic and Electromagnetic Units in the
Theory of Adhesion 147
Nomenclature 149
References 150
4. Theory of Adhesive Forces Across Interfaces: 2. Interfacial
Hydrogen Bonds as Acid Base Phenomena and as Factors
Enhancing Adhesion
Robert J. Good, Manoj K. Chaudhury, and Corel J. van Oss
1. Introduction 153
2. Monopolar and Bipolar Substances and Hydrogen Bonds per se ... 154
3. Classification of Binary Systems 157
4. Surface Parameters 7® and 7© That Give Direct Characterization
of Acidic and Basic Behavior 160
5. Application of the Lewis Acid Base Parameters 162
5.1. 7© and 7© Values of Selected Liquids 163
5.2. Application to Selected Solid Surfaces 164
5.3. Discussion of 7© and 7© Values in Table 5 165
6. An Anomaly 167
7. Applications 167
7.1. Negative Interfacial Tensions: An Illustration 167
7.2. Application to Adhesion and Adhesive Bonding 168
7.3. The Effective Range of Acid Base Interactions 169
7.4. Other Developments and Applications 169
8. Summary 170
Nomenclature 170
References 171
5. The Dynamics of Wetting
P. G. de Gennes
1. Introduction 173
2. The Final State in Complete Wetting 174
3. The Dynamics of Dry Spreading 175
4. Special Systems 177
4.1. Polymer Melts 177
4.2. Langmuir Blodgett Deposition 177
5. Conclusions 178
Acknowledgments 178
Nomenclature 178
References 179
CONTENTS xiii
6. Kinetics of Polymer Polymer Interdiffusion
F. Brochard Wyart
1. Introduction 181
1.1. Interdiffusion Coefficient 181
1.2. Interdiffusion Profiles 186
2. Dynamics of Pure Melts—Autoadhesion 188
2.1. Polymer Melts: Statics and Dynamics 189
2.2. Reptation and Self Diffusion of Entangled Polymers 190
2.3. Interdiffusion of Labeled PA/Unlabeled PA Polymers 191
2.4. Autoadhesion: Polymer Polymer Welding 193
3. Dynamics of PA/PB Mixtures: Heterojunctions 196
3.1. The Flory Huggins Free Energy of Mixing 196
3.2. Microscopic Theory of Mutual Diffusion 197
3.3. Interdiffusion of Small Chains (N A, NB Ne) 199
3.4. Interdiffusion of Entangled Polymers (NA, NB Ne) 201
3.5. PAIPB Welding (Short Time Behavior) 202
4. Conclusions 202
Acknowledgments 203
Nomenclature 204
References 204
7. Welding, Tack, and Green Strength of Polymers
Richard P. Wool
1. Introduction 207
2. Theory 208
2.1. Molecular Dynamics of Random Coil Chains 208
2.2. Molecular Description of a Polymer Polymer Interface . . . 209
2.3. Concentration Profile 214
2.4. Scaling Laws for a Polymer Polymer Interface 215
3. Fractal Nature of a Diffusion Front 216
3.1. Atomic Diffusion Front 216
3.2. Computer Analysis of Polymer Polymer Interdiffusion .... 218
4. Microstructural Fracture Criteria 220
4.1. Chain Pullout 220
4.2. Fracture Mechanics of Welding 222
4.3. Stages of Healing 227
5. Healing Experiments 229
5.1. Tack and Green Strength 229
6. Welding of Polymer Interfaces 233
6.1. Wedge Cleavage Experiment 233
7. Lap Shear Welding 241
7.1. Polystyrene Welding 241
x/V CONTENTS
8. Polymer Processing Weld Lines 242
8.1. Compression Molding 242
Acknowledgments 244
Nomenclature 244
References 246
8. Role of Electrostatics in Adhesion
Dan A. Hays
1. Introduction 249
2. Electrostatic Concepts 251
3. Electrostatic Force Between a Point Charge and Planar Material ... 253
4. Electrostatic Force Between Charged Planar Materials 254
5. Charge Exchange Properties of Materials 258
5.1. Metal Metal Charging 259
5.2. Metal Insulator Charging 261
5.3. Insulator Insulator Charging 265
6. Charge Penetration Depth in Insulators 266
7. Charge Back Flow During Separation 268
8. Interfacial Polarization 269
9. Charged Particle Adhesion 270
10. Summary 275
Nomenclature 275
References 276
9. Adhesion Through Silane Coupling Agents
Edwin P. Plueddemann
1. Introduction 279
2. General Equilibrium Conditions 280
2.1. Reaction with the Mineral 281
2.2. Hydrophobic Interphase Region 281
2.3. Optimum Structure in the Interphase Region 282
3. Crosslinking the Interphase Region 285
3.1. Inhibition of Cure by Fillers 285
3.2. Inhibition of Cure by Silanes 286
3.3. Additional Crosslinking Through the Coupling Agent 286
3.4. Additional Crosslinking Through Siliconates 287
4. Conclusion 289
References 289
10. Adhesive Adherend Interface and Interphase
James D. Miller and Hatsuo Ishida
1. Introduction 291
2. Interface 292
CONTENTS xv
3. Chemical Modifiers 297
4. Evidence of Chemical Bonding 302
5. Interphase 308
5.1. Theories 308
5.2. Properties 310
5.3. Silane Interphase 314
5.4. Other Additives 318
6. Future Directions 319
References 320
11. Adhesion at Metal Interfaces
Amitava Banerjea, John Ferrante, and John R. Smith
1. Introduction 325
2. Theoretical Considerations 327
2.1. First Principle Calculations 328
2.2. Jellium Model Calculations 329
3. Binding Energies 333
3.1. Fully Three Dimensional Calculations 335
3.2. Universality in the Shapes of the Binding Energy
Curves 337
4. Semiempirical Techniques 338
4.1. Embedded Atom Method 338
4.2. Equivalent Crystal Theory 339
5. Concluding Remarks 345
Nomenclature 346
References 347
12. Hard Soft Acid Base (HSAB) Principle for Solid Adhesion
and Surface Interactions
Lieng Huang Lee
1. Introduction 349
2. HSAB Principle 349
2.1. HSAB Principle for Inorganic Reactions 349
2.2. HSAB Principle for Organic Reactions and the Frontier
Orbital Approach 350
2.3. Perturbation Equation 350
2.4. Electronegativity and Absolute Hardness 351
3. Extension of the HSAB Principle to Solid Interactions 353
3.1. Electronic Band Structures of Solids 353
3.2. Average Energy Gap and Absolute Hardness 354
3.3. Energy Gaps and Absolute Hardness Values for
Semiconductors 354
3.4. Absolute Hardness of Solid 357
xw CONTENTS
4. Applications of the HSAB Principle to Adhesion and Surface
Interactions Between Metals and Polymers 358
5. Conclusions 359
Acknowledgments 359
Nomenclature 360
References 360
13. Interface Design for Thin Film Adhesion
John E. E. Baglin
1. Introduction 363
2. Origins of Thin Film Adhesion 364
2.1. Interface Energy 364
2.2. Interface Fracture 365
3. Adhesion Performance 366
3.1. Dependence on Application 366
3.2. Adhesion Measurements 367
4. Adhesion Enhancement 370
4.1. Processing Strategies 370
4.2. Ion Beam Techniques 371
5. Summary 381
References 381
14. Chemistry, Microstructure, and Adhesion of Metal Polymer
Interfaces
Paul S. Ho, Richard Haight, Robert C. White, B. D. Silverman,
and F. Faupel
1. Introduction 383
2. Chemical Bonding and Electronic Structure 385
2.1. Electronic Structure of Polyimide Surface 385
2.2. Chromium Polyimide Interface 388
2.3. Copper Polyimide Interface 391
3. Interfacial Microstructure 393
4. Adhesion and Deformation 399
5. Summary 404
Acknowledgments 405
References 405
15. Aspects of Bioadhesion
Robert E. Baier and Anne E. Meyer
1. Introduction 407
2. Analytical Methods Most Applicable to Bioadhesion Studies 409
CONTENTS xvii
3. Experimental Requirements 410
4. Bioadhesion of Microbes 410
5. Bioadhesion of Macrobiota 415
6. Bioadhesion from Blood 415
7. Bioadhesion in Hard and Soft Tissues 417
8. Research Priorities for Future Bioadhesion Studies 419
9. Summary and Conclusions 420
10. Postscript: Universality of the Principle of Bioabhesion 421
Acknowledgments 422
References 422
About the Contributors 427
Author Index 431
Subject Index 437
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illustrated | Illustrated |
indexdate | 2024-07-09T16:14:45Z |
institution | BVB |
isbn | 0306434709 9781489920751 9781489920737 |
language | English |
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spelling | Fundamentals of adhesion ed. by Lieng-Huang Lee New York [u.a.] Plenum Press 1991 XVII, 454 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Hier auch spätere, unveränderte Nachdrucke Adhäsion (DE-588)4000493-4 gnd rswk-swf (DE-588)4143413-4 Aufsatzsammlung gnd-content Adhäsion (DE-588)4000493-4 s DE-604 Lee, Lieng-Huang Sonstige oth HBZ Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=002824115&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
spellingShingle | Fundamentals of adhesion Adhäsion (DE-588)4000493-4 gnd |
subject_GND | (DE-588)4000493-4 (DE-588)4143413-4 |
title | Fundamentals of adhesion |
title_auth | Fundamentals of adhesion |
title_exact_search | Fundamentals of adhesion |
title_full | Fundamentals of adhesion ed. by Lieng-Huang Lee |
title_fullStr | Fundamentals of adhesion ed. by Lieng-Huang Lee |
title_full_unstemmed | Fundamentals of adhesion ed. by Lieng-Huang Lee |
title_short | Fundamentals of adhesion |
title_sort | fundamentals of adhesion |
topic | Adhäsion (DE-588)4000493-4 gnd |
topic_facet | Adhäsion Aufsatzsammlung |
url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=002824115&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
work_keys_str_mv | AT leelienghuang fundamentalsofadhesion |