Heat transfer in electronic and microelectronic equipment:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York u.a.
Hemisphere Publ. Corp.
1990
|
| Schriftenreihe: | International Centre for Heat and Mass Transfer <Beograd>: Proceedings of the International Centre for Heat and Mass Transfer
29 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Literaturangaben |
| Beschreibung: | XII, 1036 S. Ill., graph. Darst. |
Internformat
MARC
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| 035 | |a (DE-599)BVBBV004458301 | ||
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| 084 | |a ELT 249f |2 stub | ||
| 245 | 1 | 0 | |a Heat transfer in electronic and microelectronic equipment |c ed. by A. E. Bergles |
| 264 | 1 | |a New York u.a. |b Hemisphere Publ. Corp. |c 1990 | |
| 300 | |a XII, 1036 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a International Centre for Heat and Mass Transfer <Beograd>: Proceedings of the International Centre for Heat and Mass Transfer |v 29 | |
| 500 | |a Literaturangaben | ||
| 650 | 4 | |a Electronic apparatus and appliances |x Cooling |v Congresses | |
| 650 | 4 | |a Heat |x Transmission |v Congresses | |
| 650 | 0 | 7 | |a Elektronisches Gerät |0 (DE-588)4127635-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Kühlung |0 (DE-588)4132435-3 |2 gnd |9 rswk-swf |
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| 689 | 0 | 1 | |a Kühlung |0 (DE-588)4132435-3 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Bergles, A. E. |e Sonstige |4 oth | |
| 830 | 0 | |a International Centre for Heat and Mass Transfer <Beograd>: Proceedings of the International Centre for Heat and Mass Transfer |v 29 |w (DE-604)BV001896670 |9 29 | |
| 856 | 4 | 2 | |m Digitalisierung TU Muenchen |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=002763920&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-002763920 | ||
Datensatz im Suchindex
| _version_ | 1804118627724558336 |
|---|---|
| adam_text | Contents
Preface
xi
OVERVIEW
Cooling
Electronic
Equipment: Past, Present, and Future
W
Nakayama and A. E. Bergles
3
Evolution of Cooling Technology in Medium and Large Scale
Computers—An IBM Perspective
R. C
Chu
and
R. E.
Simons
41
Thermal Control for Mini- and Microcomputers: The Limits of Air Cooling
R.
Hannemann 61
AIR COOLING
Analysis of Extended Surface Arrays for Air-Cooled Electronic Equipment
A. D.
Kraus 85
Channel Natural Convection Air Cooling—The Variable Property Effect
and Thermal Drag
Z. Guo, Z. Li, and
Y. Gui
113
Studies on Natural Convection Heat Transfer from Arrays of Block-Like
Heat-Generating Modules on a Vertical Plate
Y M.
Chen and
Y
Kuo
125
A Fundamental Investigation of Laminar Natural Convection Heat
Transfer from a Vertical Plate with Discontinuous Surface Heating
K. Kishinami, H.
Saito,
and I. Tokura
139
Laminar Mixed Convection between Vertical Plates with Isolated Thermal
Sources
P.I.F.de Almeida and
L F.
Milanez
155
Mixed Convective Heat Transfer in Vertical Cavities with Heated Bottom
Surface
H.-J. Shaw, C.-K. Chen, and
J. W.
Cleaver
169
Experimental and Numerical Investigation of Natural Convection in Square
Enclosures with a Nonuniformly Heated Vertical Surface
G. Cesini, M. Paroncini, and R.
Ricci
185
Numerical Simulation of Natural Convection in Rectangular Enclosures
with Discrete Heated Elements
G.-X. Wang, H.-L Zhang, and W.-Q. Tao
197
Cooling Performance of Fins under an Obstacle
Y. Yokono, T. Sasaki, and M. Ishizuka
211
Enhancement
of Forced Convection Air Cooling of Block-Like Electronic
Components in In-Line Arrays
Y. P. Gan, S. Wang, D. H. Lei, and
С
F. Ma
223
Heat Exchange of Rectangular, and Cylindrical Elements of Radioelectronic
Equipment under Forced and Natural Air Motion
A A. Khalatov, V. V. Orlyansky, and A. F. Vasilyev
235
Experimental Study: Effect of Surface Orientation on Mixed Convection
Heat Transfer from Discrete Sources on Conducting Plates
J. R. Culham and
M. M.
Yovanovich
247
A Detailed Analysis of the Conductive/Convective Heat Transfer in a
Single Electronic Board
Y.
Bertin
and J. B. Saulnier
259
A Methodology for Optimization of Convective Cooling Systems for
Electronic Devices
B. B.
Mikié,
H.
Kozlu,
and
A. T.
Patera
269
Cooling Techniques for Electronic and Microelectronic
Equipment—Chinese Research
С
F. Ma and D. Z. Zhao
287
Effects of Rear and Lateral Ducts on the Thermal Behavior of Digital
Transmission Equipment
N.
R. Kim and L. F.
Milanez
299
Some Factors Influencing the Optimum Free Air Cooling of Electronic
Cabinets
G. Guglielmini, G.
Mi/ano,
and M.
Misale
311
Modeling of PCB s in Enclosures
M. Cadre, A. Viault, V. Pimont, and
A. Bourg
327
Convective Heat Transfer in Electronic Facilities
G.
N.
Dulnev, V. A. Korablyov, and A. V. Sharkov
339
Intensification of Air Cooling by Inclined Inlet of Air
M
Jícha
and J.
Horský
365
An Approach to the Design of a Forced-Air Cooling System for I/O Cards
in Standard
1
9-inch Card Frames
M. Zivanovié
381
Thermal Enhancement for Simulated LSI Packages by External Rods
J.
H. Chou
and K. F. Chiang
393
LIQUID COOLING
Liquid Immersion Cooling of Electronic Components
F. P. Incropera
407
Natural Convection Immersion Cooling of an Array of Simulated
Electronic Components in an Enclosure Filled with Dielectric Fluid
Y. Josh/, M. D.
Kelleher,
and T. J. Benedict
445
Mechanism of Boiling Hysteresis of Enhanced Surfaces
Y.-D. CaoandM.-D. Xin
469
vi
Heat Transfer and
Pressure
Drop for High Density Staggered
Pin
Fin
Arrays with Liquid Coolants
T. R. Craig,
F R
Incropera, and S. Ramadhyani
479
Cold Plates for IBM Thermal Conduction Module Electronic Modules
U. P
Hwang and K. P.
Moran
495
Enhancement of Heat Transfer for Vapor Condensation in Evaporative
Systems of Cooling
/. /.
Gogonin and O. A. Kabov
509
An Immersion Cooling Unit: Condensation in a Remotely Subcooled
Liquid
R. Letan
521
Enhancement of Immersion Cooling of Microelectronic Devices by Foreign
Gas Jet Impingement
С
F. Ma and A. E. Bergles
537
Closed Two-Phase Thermosyphon for Cooling of High-Power
Semiconductors
M. Lallemand, V. Duyme, U.
Eckes,
and
R
Merel
551
Nucleate Boiling Heat Transfer on Horizontal Cylinders with Re-entrant
Grooved Surfaces
Y
Hamáno
and
Y
Chujo
561
Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips
with
Fluorinert
Liquids
K.-A. Park, A. E. Bergles, and R. D.
Danielson
573
On Performances of Nucleate Boiling Enhanced Surfaces for Cooling of
High Power Electronic Devices
G. Guglielmini, M.
Misale,
С.
Pasquali,
C. Schenone,
and M.
Zappaterra
589
Two-Phase
Thermosyphon Devices
for the Cooling of Large
Thyristors
R
Bordignon,
A. Ragni, E. Latro
f a, and C. Casarosa
601
Critical Heat Fluxes at Jet-Cooled Flat Surfaces
R. Škéma
and
A. A. Šiančiauskas
621
Thermophysical Aspects of Techniques Related to Enhancing Thermal
Stability of Electronic Equipment Using Porous Coatings of Cooled
Surfaces
M
A, Styrikovich and S. P. Malyshenko
627
CONDUCTION ASPECTS
Fundamentals of Thermal Constriction (Spreading) Resistance for
Electronic Cooling
M. M.
Yovanovich
651
Thermal Contact Resistance in Electronic Equipment
V. W. Antonetti
663
Thermal Contact Conductance—A Comparison of Methods
M. B. Henriques
Mantelli
and H.-U. Pilchowski
675
vii
A Shape Factor Approach to Heat Conduction Problems of Composite
Members in Electronic Equipment
W. Nakayama, K. Fujioka, and Y. Tajima
689
Conjugate Heat Transfer in Forced Convection Cooling of Chip Arrays
G. S. Barozzi and E.
Nobile
709
Transient Heating in Microelectronic Components
G. De
Mey, D. Bhattacharya, M. Driscart, and L. Rottiers
725
Conditions for Virtual Junction Temperature Calculation and Power
Semiconductor Devices
Z. Bencib and
В.
Grguriò
737
Thermal Problems in the Lasergyros
A. Alexandre
and
D. et
Riquet
749
A Study on a Variable-Conductance Heat Pipe Using a Binary Mixture
K. Hijikata, H. Hasegawa, and T. Nagasaki
761
Heat Pipes and Heat Pipe Heat Exchangers for Cooling of Electronic and
Microelectronic Equipment
F. Jelinek,
J. Kabíček, V. Hlavačka, and F.
Polášek
777
Optimal Construction
of Radioelectronic Devices of the Cassette Design
According to Temperature Control
U. G. Stoyan, B. G. Kolodyazhny, A. S. Tugayev and B. S.
Elkin
809
Synthesis of Thermoelectric Thermostats for Radio Electronic Equipment
and Their Automatic Design
M.
U. Spokojny,
V.
N.
Ga/ev,
N. V. Kolomoetz, and M. A.
Lesenkina
825
Thermophysical
Problems with
Freon
Evaporative Systems and Heat
Pipes Employed in Cooling Electronic Equipment
G. V. Rezníkov, G. F.
Smirnov, and
B. M. Shabanov
841
Thermal Performance Analysis of a Power Module Heat Sink
M.
Živanovlć
and Z. Tatarovic
861
Application of Laser Speckle Photography in the Study of Electronic
Cooling
Y.-Z. Song and Z.-Y. Guo
871
Thermal Performance of Leadless Chip Carriers Mounted on Cored PCB s
P. Jackson
881
THERMAL ANALYSIS
The Synthesis of Thermostable Devices and Systems
G.
N.
Dulnev and A. V. Sigailov
897
Application of Computational Fluid Dynamics for Analyzing Practical
Electronics Cooling Problems
С
Prakash
923
viii
Analysis of the Heat Transfer in Coupled Electronic Boards by a New
Global Network Representation
J.
Bastos
and J. B. Saulnier
939
On the Development of Efficient Interactive CAD Techniques for Circuit
Boards
N.
Ottavy and G.
Piena
953
A Comparison of Finite Element Conduction Heat Transfer Codes
K. S. Manning and D. A.
Kaminski 967
Thermal Analysis of Hybrid Integrated Circuits
M. Lugovic and P. Biljanovic
983
Thermal Analysis of Microelectronic Systems Using Finite Element
Modeling
H. Hardisty and J. Abboud
999
Thermal Analysis of Multilayer Printed Circuit Boards Using a Hybrid
Integral-Thermal Network Method
L. M. Simeza and M. M. Yovanovich
1015
Index
1029
ix
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| indexdate | 2024-07-09T16:13:18Z |
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| language | English |
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| series | International Centre for Heat and Mass Transfer <Beograd>: Proceedings of the International Centre for Heat and Mass Transfer |
| series2 | International Centre for Heat and Mass Transfer <Beograd>: Proceedings of the International Centre for Heat and Mass Transfer |
| spelling | Heat transfer in electronic and microelectronic equipment ed. by A. E. Bergles New York u.a. Hemisphere Publ. Corp. 1990 XII, 1036 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier International Centre for Heat and Mass Transfer <Beograd>: Proceedings of the International Centre for Heat and Mass Transfer 29 Literaturangaben Electronic apparatus and appliances Cooling Congresses Heat Transmission Congresses Elektronisches Gerät (DE-588)4127635-8 gnd rswk-swf Kühlung (DE-588)4132435-3 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1988 Dubrovnik gnd-content Elektronisches Gerät (DE-588)4127635-8 s Kühlung (DE-588)4132435-3 s DE-604 Bergles, A. E. Sonstige oth International Centre for Heat and Mass Transfer <Beograd>: Proceedings of the International Centre for Heat and Mass Transfer 29 (DE-604)BV001896670 29 Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=002763920&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Heat transfer in electronic and microelectronic equipment International Centre for Heat and Mass Transfer <Beograd>: Proceedings of the International Centre for Heat and Mass Transfer Electronic apparatus and appliances Cooling Congresses Heat Transmission Congresses Elektronisches Gerät (DE-588)4127635-8 gnd Kühlung (DE-588)4132435-3 gnd |
| subject_GND | (DE-588)4127635-8 (DE-588)4132435-3 (DE-588)1071861417 |
| title | Heat transfer in electronic and microelectronic equipment |
| title_auth | Heat transfer in electronic and microelectronic equipment |
| title_exact_search | Heat transfer in electronic and microelectronic equipment |
| title_full | Heat transfer in electronic and microelectronic equipment ed. by A. E. Bergles |
| title_fullStr | Heat transfer in electronic and microelectronic equipment ed. by A. E. Bergles |
| title_full_unstemmed | Heat transfer in electronic and microelectronic equipment ed. by A. E. Bergles |
| title_short | Heat transfer in electronic and microelectronic equipment |
| title_sort | heat transfer in electronic and microelectronic equipment |
| topic | Electronic apparatus and appliances Cooling Congresses Heat Transmission Congresses Elektronisches Gerät (DE-588)4127635-8 gnd Kühlung (DE-588)4132435-3 gnd |
| topic_facet | Electronic apparatus and appliances Cooling Congresses Heat Transmission Congresses Elektronisches Gerät Kühlung Konferenzschrift 1988 Dubrovnik |
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