Electronics packaging forum: based on the Annual Electronics Packaging Symposium
Saved in:
| Format: | Conference Proceeding |
|---|---|
| Language: | Undetermined |
| Published: |
New York, NY
Van Nostrand
1990-
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| Subjects: | |
| Published: | 1.1990 - |
| ISSN: | 1060-5800 |
Staff View
MARC
| LEADER | 00000nas a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV004401799 | ||
| 003 | DE-604 | ||
| 005 | 20171201134234 | ||
| 007 | t | ||
| 008 | 991120c19909999xxu|| m| |||| 1 ||und d | ||
| 016 | 7 | |a 015900983 |2 DE-101 | |
| 016 | 7 | |a 1058531-X |2 DE-600 | |
| 022 | |a 1060-5800 |2 6 | ||
| 035 | |a (OCoLC)1085383160 | ||
| 035 | |a (DE-599)ZDB1058531-X | ||
| 040 | |a DE-604 |b ger | ||
| 041 | |a und | ||
| 044 | |a xxu |c XD-US | ||
| 049 | |a DE-91 | ||
| 084 | |a ELT 300f |2 stub | ||
| 084 | |a 620 |2 sdnb | ||
| 084 | |a MAS 060f |2 stub | ||
| 245 | 1 | 0 | |a Electronics packaging forum |b based on the Annual Electronics Packaging Symposium |c Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton |
| 264 | 3 | 1 | |a New York, NY |b Van Nostrand |c 1990- |
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 362 | 0 | |a 1.1990 - | |
| 363 | 0 | 1 | |a 1 |i 1990 |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Montage |0 (DE-588)4040126-1 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)4179998-7 |a Monografische Reihe |2 gnd-content | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 1 | |a Montage |0 (DE-588)4040126-1 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 1 | 1 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
| 689 | 1 | |5 ZDB | |
| 711 | 2 | |a Electronics Packaging Symposium |0 (DE-588)5021946-7 |4 isb | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-002731477 | ||
Record in the Search Index
| _version_ | 1804118579276152832 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV004401799 |
| classification_tum | ELT 300f MAS 060f |
| ctrlnum | 1058531-X (OCoLC)1085383160 (DE-599)ZDB1058531-X |
| dateSpan | 1.1990 - |
| discipline | Maschinenbau / Maschinenwesen Elektrotechnik Maschinenbau |
| format | Conference Proceeding |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01668nas a2200469 c 4500</leader><controlfield tag="001">BV004401799</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20171201134234 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">991120c19909999xxu|| m| |||| 1 ||und d</controlfield><datafield tag="016" ind1="7" ind2=" "><subfield code="a">015900983</subfield><subfield code="2">DE-101</subfield></datafield><datafield tag="016" ind1="7" ind2=" "><subfield code="a">1058531-X</subfield><subfield code="2">DE-600</subfield></datafield><datafield tag="022" ind1=" " ind2=" "><subfield code="a">1060-5800</subfield><subfield code="2">6</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1085383160</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)ZDB1058531-X</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">und</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">xxu</subfield><subfield code="c">XD-US</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 300f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">620</subfield><subfield code="2">sdnb</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 060f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Electronics packaging forum</subfield><subfield code="b">based on the Annual Electronics Packaging Symposium</subfield><subfield code="c">Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton</subfield></datafield><datafield tag="264" ind1="3" ind2="1"><subfield code="a">New York, NY</subfield><subfield code="b">Van Nostrand</subfield><subfield code="c">1990-</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="362" ind1="0" ind2=" "><subfield code="a">1.1990 -</subfield></datafield><datafield tag="363" ind1="0" ind2="1"><subfield code="a">1</subfield><subfield code="i">1990</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Montage</subfield><subfield code="0">(DE-588)4040126-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4179998-7</subfield><subfield code="a">Monografische Reihe</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Montage</subfield><subfield code="0">(DE-588)4040126-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">ZDB</subfield></datafield><datafield tag="711" ind1="2" ind2=" "><subfield code="a">Electronics Packaging Symposium</subfield><subfield code="0">(DE-588)5021946-7</subfield><subfield code="4">isb</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-002731477</subfield></datafield></record></collection> |
| genre | (DE-588)4179998-7 Monografische Reihe gnd-content (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Monografische Reihe Konferenzschrift |
| id | DE-604.BV004401799 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T16:12:32Z |
| institution | BVB |
| institution_GND | (DE-588)5021946-7 |
| issn | 1060-5800 |
| language | Undetermined |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-002731477 |
| oclc_num | 1085383160 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| publishDate | 1990 |
| publishDateSearch | 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 8888 |
| publishDateSort | 2024 |
| publisher | Van Nostrand |
| record_format | marc |
| spelling | Electronics packaging forum based on the Annual Electronics Packaging Symposium Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton New York, NY Van Nostrand 1990- txt rdacontent n rdamedia nc rdacarrier 1.1990 - 1 1990 Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Montage (DE-588)4040126-1 gnd rswk-swf (DE-588)4179998-7 Monografische Reihe gnd-content (DE-588)1071861417 Konferenzschrift gnd-content Elektronisches Bauelement (DE-588)4014360-0 s Montage (DE-588)4040126-1 s DE-604 Gehäuse (DE-588)4156307-4 s ZDB Electronics Packaging Symposium (DE-588)5021946-7 isb |
| spellingShingle | Electronics packaging forum based on the Annual Electronics Packaging Symposium Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd Montage (DE-588)4040126-1 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4156307-4 (DE-588)4040126-1 (DE-588)4179998-7 (DE-588)1071861417 |
| title | Electronics packaging forum based on the Annual Electronics Packaging Symposium |
| title_auth | Electronics packaging forum based on the Annual Electronics Packaging Symposium |
| title_exact_search | Electronics packaging forum based on the Annual Electronics Packaging Symposium |
| title_full | Electronics packaging forum based on the Annual Electronics Packaging Symposium Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton |
| title_fullStr | Electronics packaging forum based on the Annual Electronics Packaging Symposium Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton |
| title_full_unstemmed | Electronics packaging forum based on the Annual Electronics Packaging Symposium Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton |
| title_short | Electronics packaging forum |
| title_sort | electronics packaging forum based on the annual electronics packaging symposium |
| title_sub | based on the Annual Electronics Packaging Symposium |
| topic | Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd Montage (DE-588)4040126-1 gnd |
| topic_facet | Elektronisches Bauelement Gehäuse Montage Monografische Reihe Konferenzschrift |
| work_keys_str_mv | AT electronicspackagingsymposium electronicspackagingforumbasedontheannualelectronicspackagingsymposium |
| zdb_num | 1058531-X (DE-599)ZDB1058531-X |