Electronics packaging forum: based on the Annual Electronics Packaging Symposium
Gespeichert in:
Format: | Tagungsbericht |
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Sprache: | Undetermined |
Veröffentlicht: |
New York, NY
Van Nostrand
1990-
|
Schlagworte: | |
Veröffentlicht: | 1.1990 - |
ISSN: | 1060-5800 |
Internformat
MARC
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336 | |b txt |2 rdacontent | ||
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655 | 7 | |0 (DE-588)4179998-7 |a Monografische Reihe |2 gnd-content | |
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689 | 1 | |5 ZDB | |
711 | 2 | |a Electronics Packaging Symposium |0 (DE-588)5021946-7 |4 isb | |
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Datensatz im Suchindex
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any_adam_object | |
building | Verbundindex |
bvnumber | BV004401799 |
classification_tum | ELT 300f MAS 060f |
ctrlnum | 1058531-X (OCoLC)1085383160 (DE-599)ZDB1058531-X |
dateSpan | 1.1990 - |
discipline | Maschinenbau / Maschinenwesen Elektrotechnik Maschinenbau |
format | Conference Proceeding |
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genre | (DE-588)4179998-7 Monografische Reihe gnd-content (DE-588)1071861417 Konferenzschrift gnd-content |
genre_facet | Monografische Reihe Konferenzschrift |
id | DE-604.BV004401799 |
illustrated | Illustrated |
indexdate | 2024-07-09T16:12:32Z |
institution | BVB |
institution_GND | (DE-588)5021946-7 |
issn | 1060-5800 |
language | Undetermined |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-002731477 |
oclc_num | 1085383160 |
open_access_boolean | |
owner | DE-91 DE-BY-TUM |
owner_facet | DE-91 DE-BY-TUM |
publishDate | 1990 |
publishDateSearch | 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 8888 |
publishDateSort | 2024 |
publisher | Van Nostrand |
record_format | marc |
spelling | Electronics packaging forum based on the Annual Electronics Packaging Symposium Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton New York, NY Van Nostrand 1990- txt rdacontent n rdamedia nc rdacarrier 1.1990 - 1 1990 Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Montage (DE-588)4040126-1 gnd rswk-swf (DE-588)4179998-7 Monografische Reihe gnd-content (DE-588)1071861417 Konferenzschrift gnd-content Elektronisches Bauelement (DE-588)4014360-0 s Montage (DE-588)4040126-1 s DE-604 Gehäuse (DE-588)4156307-4 s ZDB Electronics Packaging Symposium (DE-588)5021946-7 isb |
spellingShingle | Electronics packaging forum based on the Annual Electronics Packaging Symposium Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd Montage (DE-588)4040126-1 gnd |
subject_GND | (DE-588)4014360-0 (DE-588)4156307-4 (DE-588)4040126-1 (DE-588)4179998-7 (DE-588)1071861417 |
title | Electronics packaging forum based on the Annual Electronics Packaging Symposium |
title_auth | Electronics packaging forum based on the Annual Electronics Packaging Symposium |
title_exact_search | Electronics packaging forum based on the Annual Electronics Packaging Symposium |
title_full | Electronics packaging forum based on the Annual Electronics Packaging Symposium Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton |
title_fullStr | Electronics packaging forum based on the Annual Electronics Packaging Symposium Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton |
title_full_unstemmed | Electronics packaging forum based on the Annual Electronics Packaging Symposium Continuing Education Division of the T.J. Watson School of Engineering, Applied Science and Technology. State University of New York, Binghampton |
title_short | Electronics packaging forum |
title_sort | electronics packaging forum based on the annual electronics packaging symposium |
title_sub | based on the Annual Electronics Packaging Symposium |
topic | Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd Montage (DE-588)4040126-1 gnd |
topic_facet | Elektronisches Bauelement Gehäuse Montage Monografische Reihe Konferenzschrift |
work_keys_str_mv | AT electronicspackagingsymposium electronicspackagingforumbasedontheannualelectronicspackagingsymposium |
zdb_num | 1058531-X (DE-599)ZDB1058531-X |