Principles of electronic packaging:
Gespeichert in:
Format: | Buch |
---|---|
Sprache: | English |
Veröffentlicht: |
New York [u.a.]
McGraw-Hill
1989
|
Schriftenreihe: | McGraw-Hill series in electrical engineering : McGraw-Hill series in material science and engineering
|
Schlagworte: | |
Beschreibung: | Literaturangaben |
Beschreibung: | XXVIII, 962 S. Ill., graph. Darst. |
ISBN: | 0070563063 |
Internformat
MARC
LEADER | 00000nam a2200000 c 4500 | ||
---|---|---|---|
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003 | DE-604 | ||
005 | 20121002 | ||
007 | t | ||
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035 | |a (OCoLC)18136666 | ||
035 | |a (DE-599)BVBBV004074838 | ||
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050 | 0 | |a TK7870 | |
082 | 0 | |a 621.381/73 |2 19 | |
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084 | |a ELT 296f |2 stub | ||
245 | 1 | 0 | |a Principles of electronic packaging |c ed. by Donald P. Seraphim ... |
264 | 1 | |a New York [u.a.] |b McGraw-Hill |c 1989 | |
300 | |a XXVIII, 962 S. |b Ill., graph. Darst. | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
490 | 0 | |a McGraw-Hill series in electrical engineering : McGraw-Hill series in material science and engineering | |
500 | |a Literaturangaben | ||
650 | 4 | |a Electronic packaging | |
650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Elektronische Baugruppe |0 (DE-588)4014350-8 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Montage |0 (DE-588)4040126-1 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Chip |0 (DE-588)4197163-2 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
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689 | 0 | |5 DE-604 | |
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700 | 1 | |a Seraphim, Donald P. |e Sonstige |4 oth | |
999 | |a oai:aleph.bib-bvb.de:BVB01-002547602 |
Datensatz im Suchindex
_version_ | 1804118304409780224 |
---|---|
any_adam_object | |
building | Verbundindex |
bvnumber | BV004074838 |
callnumber-first | T - Technology |
callnumber-label | TK7870 |
callnumber-raw | TK7870 |
callnumber-search | TK7870 |
callnumber-sort | TK 47870 |
callnumber-subject | TK - Electrical and Nuclear Engineering |
classification_rvk | ZN 4300 |
classification_tum | ELT 296f |
ctrlnum | (OCoLC)18136666 (DE-599)BVBBV004074838 |
dewey-full | 621.381/73 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381/73 |
dewey-search | 621.381/73 |
dewey-sort | 3621.381 273 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Book |
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id | DE-604.BV004074838 |
illustrated | Illustrated |
indexdate | 2024-07-09T16:08:10Z |
institution | BVB |
isbn | 0070563063 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-002547602 |
oclc_num | 18136666 |
open_access_boolean | |
owner | DE-91 DE-BY-TUM DE-29T DE-Aug4 DE-634 DE-83 |
owner_facet | DE-91 DE-BY-TUM DE-29T DE-Aug4 DE-634 DE-83 |
physical | XXVIII, 962 S. Ill., graph. Darst. |
publishDate | 1989 |
publishDateSearch | 1989 |
publishDateSort | 1989 |
publisher | McGraw-Hill |
record_format | marc |
series2 | McGraw-Hill series in electrical engineering : McGraw-Hill series in material science and engineering |
spelling | Principles of electronic packaging ed. by Donald P. Seraphim ... New York [u.a.] McGraw-Hill 1989 XXVIII, 962 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier McGraw-Hill series in electrical engineering : McGraw-Hill series in material science and engineering Literaturangaben Electronic packaging Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Elektronische Baugruppe (DE-588)4014350-8 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Montage (DE-588)4040126-1 gnd rswk-swf Chip (DE-588)4197163-2 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Gehäuse (DE-588)4156307-4 s DE-604 Montage (DE-588)4040126-1 s Chip (DE-588)4197163-2 s Mikroelektronik (DE-588)4039207-7 s Elektronische Baugruppe (DE-588)4014350-8 s Seraphim, Donald P. Sonstige oth |
spellingShingle | Principles of electronic packaging Electronic packaging Mikroelektronik (DE-588)4039207-7 gnd Elektronische Baugruppe (DE-588)4014350-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Montage (DE-588)4040126-1 gnd Chip (DE-588)4197163-2 gnd Gehäuse (DE-588)4156307-4 gnd |
subject_GND | (DE-588)4039207-7 (DE-588)4014350-8 (DE-588)4014360-0 (DE-588)4040126-1 (DE-588)4197163-2 (DE-588)4156307-4 |
title | Principles of electronic packaging |
title_auth | Principles of electronic packaging |
title_exact_search | Principles of electronic packaging |
title_full | Principles of electronic packaging ed. by Donald P. Seraphim ... |
title_fullStr | Principles of electronic packaging ed. by Donald P. Seraphim ... |
title_full_unstemmed | Principles of electronic packaging ed. by Donald P. Seraphim ... |
title_short | Principles of electronic packaging |
title_sort | principles of electronic packaging |
topic | Electronic packaging Mikroelektronik (DE-588)4039207-7 gnd Elektronische Baugruppe (DE-588)4014350-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Montage (DE-588)4040126-1 gnd Chip (DE-588)4197163-2 gnd Gehäuse (DE-588)4156307-4 gnd |
topic_facet | Electronic packaging Mikroelektronik Elektronische Baugruppe Elektronisches Bauelement Montage Chip Gehäuse |
work_keys_str_mv | AT seraphimdonaldp principlesofelectronicpackaging |